Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: selecting a programmed word line, where the programmed word line has a plurality of segments respectively corresponding to a plurality of bit lines; providing a program voltage to a voltage receiving end of the programmed word line, and sequentially transmitting the program voltage to the segments; respectively providing a plurality of bit line voltages to the bit lines at a plurality of enable time points and turning on a string selection switch at a setting time point; and setting voltage values of the bit line voltages according to the segments corresponding to the bit lines, respectively, or setting the enable time points according to the segments corresponding to the bit lines, or setting the setting time point according to a voltage transmission delay of the programmed word line.

Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.

Abstract: A method, an apparatus and a system for cell detection are provided. In the apparatus, a hyperspectrum module is used to capture information across electromagnetic spectrums from an image, a stereo camera module is used to capture three-dimensional image information, and the hyperspectrum module and the stereo camera module form a trinocular micro spectrometer. A microscopic optical module is provided for the two modules to form hyperspectrum and three-dimensional image information from a cell and its split cells via a lens. In the method, a series of continuous images are obtained within a time period. An observation image array with a plurality of observation image zones are provided to retrieve coordinates of a plurality of feature points at different times. Finally, a holistic cellular activity can be obtained by analyzing continuous hyperspectrum and 3D image information from the images over time.

Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.

Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.

Abstract: A magnetoresistor device includes a magnetoresistor, a protection layer, a first conductive structure, and a second conductive structure. The magnetoresistor is disposed over a substrate. The protection layer is formed over a portion of the magnetoresistor. The first conductive structure is disposed over the protection layer and includes a lower barrier layer and a metal layer disposed over the lower barrier layer. The second conductive structure is disposed over the substrate and partially covers the magnetoresistor. The second conductive structure includes the lower barrier layer and the metal layer disposed over the lower barrier layer.

Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.

Abstract: An apparatus for a chuck having particle recesses is provided. In some embodiments, the chuck includes a plurality of impressions and a particle recess. The impressions of the plurality of impressions are laterally spaced and extend into the chuck from a top surface of the chuck to a base surface of the chuck. The base surface of the chuck defines bottom surfaces respectively of the impressions and is spaced between the top surface of the chuck and a bottom surface of the chuck. The particle recess extends in to the chuck from the top surface of the chuck to a location spaced between the base surface of the chuck and the bottom surface of the chuck. In particular, the particle recess is configured to underlie a workpiece alignment mark of a workpiece.

Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.

Abstract: A protective cover comprises a fixing plate, a first folding plate, a second folding plate, and a third folding plate. The fixing plate is fixed connected to a back surface of an electronic device and includes a first magnetic component. The first folding plate is foldably connected to the fixing plate and attaches to the back surface by a first attaching force. The second folding plate is foldably connected to the fixing plate and attaches to the back surface by a second attaching force. The third folding plate is foldably connected to the second folding plate and includes a second magnetic component to attach to the back surface. When the protective cover is folded, the third folding plate, the second folding plate, and the first folding plate leave the back surface in sequence; the fixing plate, the first folding plate, and the second folding plate form a support state.

Abstract: An apparatus for a chuck having particle recesses is provided. In some embodiments, the chuck includes a plurality of impressions and a particle recess. The impressions of the plurality of impressions are laterally spaced and extend into the chuck from a top surface of the chuck to a base surface of the chuck. The base surface of the chuck defines bottom surfaces respectively of the impressions and is spaced between the top surface of the chuck and a bottom surface of the chuck. The particle recess extends in to the chuck from the top surface of the chuck to a location spaced between the base surface of the chuck and the bottom surface of the chuck. In particular, the particle recess is configured to underlie a workpiece alignment mark of a workpiece.

Abstract: A semiconductor structure includes a substrate, a first source/drain region, a second source/drain region, a channel doping region and a gate structure. The first source/drain region is disposed in the substrate. The first source/drain region includes a first region and a second region under the first region. The second source/drain region is disposed in the substrate. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed in the substrate between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. In a projection plane parallel to the top surface of the substrate, the second region of the first source/drain region is separated from the gate structure. The first source/drain region, the second source/drain region and the channel doping region have the same conductive type.

Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.

Abstract: An electronic device is provided. The electronic device comprises a first body structure; a connecting portion; and a second body structure connected to the first body structure via the connecting portion. The second body structure includes a cover portion, and an end portion connected to an edge of the cover portion. A thickness of the end portion is larger than the thickness of the cover portion. An I/O port is disposed at a side wall of the end portion.

Abstract: A portable electronic device comprises a body, a stationary magnetic element and a base. The stationary magnetic element is disposed at a periphery of the first groove. The connecting element of the base is disposed on the bottom plate of the base and including a second engaging surface and a second groove. An opening of the second groove is formed on the second engaging surface. The rotatable magnetic element is pivotally connected with the second groove. One end of the rotatable magnetic element can rotate in/out the second groove. When a distance between the first engaging surface and the second engaging surface is less than a predetermined value and the opening of the first groove faces to the opening of the second groove, the rotatable magnetic element is attracted by the stationary magnetic element to rotate out of the second groove and get into the first groove.

Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.

Abstract: An electronic device includes a first machine body and a second machine body adapted to be detachably assembled to the first machine body. The first machine body includes a first casing, a first hinge fixed to a side of the first casing, a second hinge pivoted to the first hinge along an axis, and a first connecting member disposed at the side and linked to the second hinge. The first and the second hinges are covered by the first casing. The second machine body includes a second casing and a second connecting member. When the first machine body is assembled to the second machine body, the first connecting member is fixed to the second connecting member, the second hinge is fixed jointly so that the first hinge is rotatable related to the second hinge. Accordingly, the first casing is rotatable related to the second casing.

Abstract: A protective cover comprises a fixing plate, a first folding plate, a second folding plate, and a third folding plate. The fixing plate is fixed connected to a back surface of an electronic device and includes a first magnetic component. The first folding plate is foldably connected to the fixing plate and attaches to the back surface by a first attaching force. The second folding plate is foldably connected to the fixing plate and attaches to the back surface by a second attaching force. The third folding plate is foldably connected to the second folding plate and includes a second magnetic component to attach to the back surface. When the protective cover is folded, the third folding plate, the second folding plate, and the first folding plate leave the back surface in sequence; the fixing plate, the first folding plate, and the second folding plate form a support state.

Abstract: A portable electronic device comprises a body, a stationary magnetic element and a base. The stationary magnetic element is disposed at a periphery of the first groove. The connecting element of the base is disposed on the bottom plate of the base and including a second engaging surface and a second groove. An opening of the second groove is formed on the second engaging surface. The rotatable magnetic element is pivotally connected with the second groove. One end of the rotatable magnetic element can rotate in/out the second groove. When a distance between the first engaging surface and the second engaging surface is less than a predetermined value and the opening of the first groove faces to the opening of the second groove, the rotatable magnetic element is attracted by the stationary magnetic element to rotate out of the second groove and get into the first groove.

Abstract: A semiconductor structure includes a first source/drain region, a second source/drain region, a channel doping region, a gate structure, a first well and a second well. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. The first well has a first portion disposed under the first source/drain region. The second well is disposed opposite to the first well and separated from the second source/drain region. The first source/drain region, the second source/drain region and the channel doping region have a first conductive type. The first well and the second well have a second conductive type different from the first conductive type.