Abstract: A method of programming a PMOS stacked gate memory cell is provided that utilizes the correlation between injection current and substrate current during the programming cycle to provide a feedback correction to the control gate of the memory cell to compensate for the negative potential shift on the floating gate as a result of its charging time.

Abstract: A split-gate FLASH memory cell is formed with a floating gate that has a tip in the middle of the floating gate. The method of the present invention forms the tip to have a substantially constant radius of curvature, tip angle, and distance to the overlying tunneling oxide. As a result, the tip of the present invention increases the localized enhancement of the electric field.

Abstract: A non-volatile memory cell including a gated diode and a single readout transistor, methods for programming and reading out such a cell, and a memory including an array of such cells. The readout transistor is an MOS transistor. The transistor and gated diode are formed in a volume of semiconductor material of one type, and share a source region, a control gate, and a floating gate. The transistor has a drain region formed of semiconductor material of one type and the diode has a drain region formed of semiconductor material of the opposite type.

Abstract: In an electrically programmable non-volatile memory cell, the first terminal of a high density capacitive structure is electrically connected to a conductive structure to form a floating gate/first electrode, while the second terminal of the capacitive structure is used as a control gate, providing a cell with a high overall capacitive coupling ratio, a relatively small area, and a high voltage tolerance.

Abstract: A memory cell and method for making a memory cell. The memory cell has a floating gate and a control gate, and a source region and a drain region. The structure of the device is such that the area of capacitive coupling between the floating gate and the source region is oriented along a sidewall of a trench formed in a substrate. The drain region is disposed under the bottom of the trench.

Abstract: A split-gate flash memory array is programmed, in part, by applying a programming voltage to the row of cells that include the to-be-programmed cells, and an inhibiting voltage to the row of cells that share the same source line as the row that includes the to-be-programmed cells. The inhibiting voltage is greater than zero and less than the programming voltage.

Abstract: A method for making an electrically programmable and erasable memory cell is disclosed. Specifically, a method for creating a floating gate using shallow trench isolation-type techniques is utilized to provide a floating gate having sharply defined tip characteristics. A first insulating layer is formed over a substrate. A conductive material is formed over the first insulating layer. A trench is defined in the conductive layer. This trench is filled with an oxide which is used as a mask to define tips of the floating gate during an etching process which defines the edges of the floating gate. After the floating gate has been etched, a tunneling oxide deposited over the floating gate. A conductive material is then formed over the tunneling oxide.

Abstract: A split-gate FLASH memory cell is formed with a floating gate that has a tip in the middle of the floating gate. The method of the present invention forms the tip to have a substantially constant radius of curvature, tip angle, and distance to the overlying tunneling oxide. As a result, the tip of the present invention increases the localized enhancement of the electric field.

Abstract: A memory cell and method for making a memory cell. The memory cell has a floating gate and a control gate, and a source region and a drain region. The structure of the device is such that the area of capacitive coupling between the floating gate and the source region is oriented along a sidewall of a trench formed in a substrate. The drain region is disposed under the bottom of the trench.