Patents by Inventor Yusheng Bian

Yusheng Bian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230273369
    Abstract: Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Shesh Mani Pandey, Yusheng Bian, Steven M. Shank, Judson Holt
  • Publication number: 20230266526
    Abstract: Disclosed is an optical waveguide including a waveguide core and waveguide cladding surrounding the waveguide core. The waveguide cladding includes at least one stack of cladding material layers positioned laterally adjacent to a sidewall of the waveguide core such that each cladding material layer in the stack abuts the sidewall of the waveguide core. Each of the cladding material layers in the stack has a smaller refractive index than the waveguide core and at least two of the cladding material layers in the stack have different refractive indices, thereby tailoring field confinement and reshaping the optical mode. Different embodiments include different numbers of cladding material layers in the stack, different stacking orders of the cladding material layers, different waveguide core types, symmetric or asymmetric cladding structures on opposite sides of the waveguide core, etc. Also disclosed is a method of forming the optical waveguide.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: GlobalFoundries U.S. Inc.
    Inventors: Shesh Mani Pandey, Yusheng Bian, Francis O. Afzal
  • Publication number: 20230266529
    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a waveguide core and a back-end-of-line stack including a first metallization level, a second metallization level, and a heat sink having a metal feature in the second metallization level. The heat sink is positioned adjacent to a section of the waveguide core. The first metallization level including a dielectric layer positioned between the metal feature and the section of the waveguide core.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Hemant Dixit, Yusheng Bian, Theodore Letavic
  • Publication number: 20230266530
    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Yusheng Bian, Hemant Dixit, Theodore Letavic
  • Publication number: 20230266533
    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Theodore Letavic, Yusheng Bian, Hemant Dixit
  • Publication number: 20230266544
    Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Yusheng Bian, Nicholas Polomoff, Keith Donegan, Qizhi Liu, Steven M. Shank
  • Patent number: 11733458
    Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes a first waveguide core having a first inverse taper, a second waveguide core having a second inverse taper, and a third waveguide core having a third inverse taper that is laterally positioned between the first inverse taper and the second inverse taper. The structure further includes a fourth waveguide core having a fourth inverse taper that is positioned to overlap with the first inverse taper, and a fifth waveguide core having a fifth inverse taper that is positioned to overlap with the second inverse taper.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: August 22, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Patent number: 11721780
    Abstract: Structures for an avalanche photodetector and methods of forming a structure for an avalanche photodetector. The structure includes a first semiconductor layer having a first portion and a second portion, and a second semiconductor layer stacked in a vertical direction with the first semiconductor layer. The first portion of the first semiconductor layer defines a multiplication region of the avalanche photodetector, and the second semiconductor layer defines an absorption region of the avalanche photodetector. The structure further includes a charge sheet in the second portion of the first semiconductor layer. The charge sheet has a thickness that varies with position in a horizontal plane, and the charge sheet is positioned in the vertical direction between the second semiconductor layer and the first portion of the first semiconductor layer.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: August 8, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Asif Chowdhury, Yusheng Bian
  • Patent number: 11719895
    Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: August 8, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Nicholas Polomoff, Keith Donegan, Qizhi Liu, Steven M. Shank
  • Publication number: 20230244030
    Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes an edge coupler having a longitudinal axis, a first ring resonator, and a second ring resonator. The first ring resonator has a first center point that is spaced from the longitudinal axis of the edge coupler by a first perpendicular distance. The second ring resonator has a second center point that is spaced from the longitudinal axis of the edge coupler by a second perpendicular distance.
    Type: Application
    Filed: January 31, 2022
    Publication date: August 3, 2023
    Inventors: Yusheng Bian, Steven M. Shank, Takako Hirokawa
  • Publication number: 20230244033
    Abstract: Waveguide structures and methods of fabricating a waveguide structure. The structure includes a first waveguide core, a second waveguide core, and a third waveguide core adjacent to the first waveguide core and the second waveguide core. The third waveguide core is laterally separated from the first waveguide core by a first slot, and the third waveguide core is laterally separated from the second waveguide core by a second slot. The first waveguide core and the second waveguide core comprise a first material, and the third waveguide core comprises a second material that is different in composition from the first material.
    Type: Application
    Filed: January 31, 2022
    Publication date: August 3, 2023
    Inventors: Shesh Mani Pandey, Yusheng Bian, Judson Holt
  • Publication number: 20230236361
    Abstract: The disclosed subject matter relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to photonic devices having thermally conductive layers for the removal of heat from optoelectronic components in the photonic devices.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventors: HEMANT MARTAND DIXIT, WILLIAM J. TAYLOR, JR., YUSHENG BIAN, THEODORE LETAVIC, OSCAR D. RESTREPO
  • Patent number: 11705529
    Abstract: Structures for a photodetector and methods of fabricating a structure for a photodetector. The structure includes a first waveguide core having a first taper, a semiconductor layer having a sidewall adjacent to the first taper, and a second waveguide core having a second taper that is positioned to overlap with the first taper and a curved section. The second taper is longitudinally positioned between the sidewall of the semiconductor layer and the curved section. The curved section terminates the second waveguide core.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: July 18, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Asif Chowdhury
  • Patent number: 11703641
    Abstract: Structures for a wavelength division multiplexing filter and methods of fabricating a structure for a wavelength division multiplexing filter. The structure includes a first waveguide core having a first section and a second section. The first section and the second section have a first notched sidewall and a second notched sidewall opposite to the first notched sidewall. The structure further includes a second waveguide core positioned with a first offset in a first direction relative to the first section and the second section of the first waveguide core and with a second offset in a second direction relative to the first section and the second section of the first waveguide core. The second direction is transverse to the first direction.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: July 18, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Francis Afzal
  • Patent number: 11693184
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: July 4, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Yusheng Bian, Won Suk Lee, Abdelsalam A. Aboketaf
  • Patent number: 11686901
    Abstract: Embodiments of the disclosure provide an optical polarizer with a varying vertical thickness, and methods to form the same. An optical polarizer according to the disclosure may include a first waveguide core over a semiconductor substrate. A first cladding material is on at least an upper surface of the first waveguide core. A second waveguide core over the first waveguide core and above the first cladding material. The second waveguide core includes a first segment having a vertical thickness that varies along a length of the first segment. A second cladding material is at least partially surrounding the second waveguide core. Transfer of one of a transverse electric (TE) mode signal and a transverse magnetic (TM) mode signal from the first waveguide core to the second waveguide core occurs between the first segment of the second waveguide core and the first waveguide core.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: June 27, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Aboketaf Abdelsalam, Yusheng Bian
  • Publication number: 20230187566
    Abstract: Structures for a photodetector and methods of fabricating a structure for a photodetector. The structure includes a first waveguide core having a first taper, a semiconductor layer having a sidewall adjacent to the first taper, and a second waveguide core having a second taper that is positioned to overlap with the first taper and a curved section. The second taper is longitudinally positioned between the sidewall of the semiconductor layer and the curved section. The curved section terminates the second waveguide core.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventors: Yusheng Bian, Asif Chowdhury
  • Patent number: 11662523
    Abstract: Structures including an edge coupler and methods of forming a structure including an edge coupler. The structure includes a waveguide core over a dielectric layer and a back-end-of-line stack over the dielectric layer and the waveguide core. The back-end-of-line stack includes a side edge and a truncated layer that is overlapped with a tapered section of the waveguide core. The truncated layer has a first end surface adjacent to the side edge and a second end surface above the tapered section of the waveguide core. The truncated layer is tapered from the first end surface to the second end surface.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: May 30, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Roderick A. Augur, Kenneth J. Giewont, Karen Nummy
  • Patent number: 11656409
    Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a semiconductor waveguide on a semiconductor layer. The semiconductor waveguide includes a first vertical sidewall over the semiconductor layer over the semiconductor layer. A plurality of grating protrusions extends horizontally from the first vertical sidewall of the semiconductor waveguide.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: May 23, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Qizhi Liu
  • Publication number: 20230155050
    Abstract: Structures for an avalanche photodetector and methods of forming a structure for an avalanche photodetector. The structure includes a first semiconductor layer having a first portion and a second portion, and a second semiconductor layer stacked in a vertical direction with the first semiconductor layer. The first portion of the first semiconductor layer defines a multiplication region of the avalanche photodetector, and the second semiconductor layer defines an absorption region of the avalanche photodetector. The structure further includes a charge sheet in the second portion of the first semiconductor layer. The charge sheet has a thickness that varies with position in a horizontal plane, and the charge sheet is positioned in the vertical direction between the second semiconductor layer and the first portion of the first semiconductor layer.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Inventors: Asif Chowdhury, Yusheng Bian