Patents by Inventor Yutaka Onozuka
Yutaka Onozuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7763957Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: GrantFiled: June 1, 2007Date of Patent: July 27, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Patent number: 7612438Abstract: An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on the plurality of adhesion parts, respectively, each of the plurality of adhesion parts including a height control member and an adhesive.Type: GrantFiled: July 13, 2005Date of Patent: November 3, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Masahiko Akiyama, Yujiro Hara, Yutaka Onozuka, Tsuyoshi Hioki, Mitsuo Nakajima
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Publication number: 20090206444Abstract: An integrated semiconductor device includes a plurality of semiconductor elements having different integrated element circuits or different sizes; an insulating material arranged between the semiconductor elements; an organic insulating film arranged entirely on the semiconductor elements and the insulating material; a fine thin-layer wiring that arranged on the organic insulating film and connects the semiconductor elements; a first input/output electrode arranged on an area of the insulating material; and a first bump electrode formed on the first input/output electrode.Type: ApplicationFiled: February 13, 2009Publication date: August 20, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Hiroshi YAMADA, Kazuhiko ITAYA, Yutaka ONOZUKA, Hideyuki FUNAKI
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Publication number: 20090179317Abstract: It is made possible to restrict warpage at the time of resin cure and achieve a smaller thickness. A semiconductor device includes: a first chip including a MEMS device and a first pad formed on an upper face of the MEMS device, the first pad being electrically connected to the MEMS device; a second chip including a semiconductor device and a second pad formed on an upper face of the semiconductor device, the second pad being electrically connected to the semiconductor device; and an adhesive portion having a stacked structure, and bonding a side face of the first chip and a side face of the second chip, the stacked structure including a first adhesive film formed by adding a first material constant modifier to a first resin, and a second adhesive film formed by adding a second material constant modifier to a second resin.Type: ApplicationFiled: January 8, 2009Publication date: July 16, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Atsuko Iida, Yutaka Onozuka, Kazuhiko Itaya
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Patent number: 7541224Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: GrantFiled: November 22, 2005Date of Patent: June 2, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Publication number: 20090096971Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: ApplicationFiled: December 16, 2008Publication date: April 16, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Tsuyoshi HIOKI, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Publication number: 20090050988Abstract: A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere.Type: ApplicationFiled: August 21, 2008Publication date: February 26, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuhiro Suzuki, Michihiko Nishigaki, Yutaka Onozuka, Hiroshi Yamada, Kazuhiko Itaya, Hideyuki Funaki
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Publication number: 20080318356Abstract: It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips.Type: ApplicationFiled: August 28, 2008Publication date: December 25, 2008Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Yutaka Onozuka, Hiroshi Yamada, Hideyuki Funaki, Kazuhiko Itaya
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Patent number: 7407839Abstract: An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on the plurality of adhesion parts, respectively, each of the plurality of adhesion parts including a height control member and an adhesive.Type: GrantFiled: July 13, 2005Date of Patent: August 5, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Masahiko Akiyama, Yujiro Hara, Yutaka Onozuka, Tsuyoshi Hioki, Mitsuo Nakajima
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Publication number: 20070273018Abstract: It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips.Type: ApplicationFiled: February 26, 2007Publication date: November 29, 2007Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Yutaka Onozuka, Hiroshi Yamada, Hideyuki Funaki, Kazuhiko Itaya
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Publication number: 20070235736Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: ApplicationFiled: June 1, 2007Publication date: October 11, 2007Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Patent number: 7265385Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: GrantFiled: August 23, 2005Date of Patent: September 4, 2007Assignee: Kabushiki Kaisha ToshibaInventors: Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Patent number: 7223632Abstract: An active matrix substrate comprises a substrate, a thick-film adhesive pad made of organic resin, provided on the substrate and including, at least at a part of a side face thereof, an inclined region having a first contact angle smaller than 90 degrees to the main face of the substrate, a thin-film active element provided on the thick-film adhesive pad, and a thin-film interconnection line connected to the thin-film active element and extending onto the substrate via the inclined region, a film thickness of the thick-film adhesive pad being four or more times that of the thin-film interconnection line.Type: GrantFiled: March 22, 2005Date of Patent: May 29, 2007Assignee: Kabushiki Kaisha ToshibaInventors: Yutaka Onozuka, Mitsuo Nakajima, Yujiro Hara, Tsuyoshi Hioki, Masahiko Akiyama
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Publication number: 20070057256Abstract: An element forming substrate includes a substrate and a plurality of elements which are arranged in a matrix form on the substrate. Each of the elements includes a thin film transistor and contact pads connected to the transistor, and has peripheral sides separated from adjacent elements in a plane of the substrate. A channel direction of the transistor is inclined relative to the peripheral sides of the elements.Type: ApplicationFiled: September 1, 2006Publication date: March 15, 2007Inventors: Yujiro Hara, Yutaka Onozuka, Keiji Sugi, Masahiko Akiyama
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Patent number: 7180237Abstract: In an active matrix substrate, the substrate includes a pixel region and a peripheral region surrounding the pixel region. A plurality of adhesive layers arranged to form a matrix having rows and columns are arranged in the pixel region, and pluralities of active elements are formed, respectively, on the plural adhesive layers. A spacer layer is formed in the peripheral region, and a uniform pressure is applied between the active element and the adhesive layer in performing the transfer.Type: GrantFiled: September 23, 2004Date of Patent: February 20, 2007Assignee: Kabushiki Kaisha ToshibaInventors: Yutaka Onozuka, Masahiko Akiyama, Yujiro Hara, Kentaro Miura
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Publication number: 20060172470Abstract: A method of manufacturing a thin film element is proposed, which can prevent the decrease in TFT manufacturing yield caused by the cracks occurring in an isolation layer at the time of the removing of an element formation substrate. A protection layer is formed between a plurality of TFTs, and an isolation layer is formed below the TFTs and the protection layer. This structure can prevent the TFTs from suffering adverse effects when the TFTs are temporarily bonded to an intermediate transfer substrate, and the element formation substrate and the isolation layer are removed.Type: ApplicationFiled: January 12, 2006Publication date: August 3, 2006Applicant: Kabushiki Kaisha ToshibaInventors: Yujiro Hara, Yutaka Onozuka, Kentaro Miura, Masahiko Akiyama
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Patent number: 7081642Abstract: An active matrix substrate comprises a substrate, a thick-film adhesive pad made of organic resin, provided on the substrate and including, at least at a part of a side face thereof, an inclined region having a first contact angle smaller than 90 degrees to the main face of the substrate, a thin-film active element provided on the thick-film adhesive pad, and a thin-film interconnection line connected to the thin-film active element and extending onto the substrate via the inclined region, a film thickness of the thick-film adhesive pad being four or more times that of the thin-film interconnection line.Type: GrantFiled: March 22, 2005Date of Patent: July 25, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Yutaka Onozuka, Mitsuo Nakajima, Yujiro Hara, Tsuyoshi Hioki, Masahiko Akiyama
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Publication number: 20060076561Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: ApplicationFiled: November 22, 2005Publication date: April 13, 2006Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Patent number: 6987284Abstract: A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.Type: GrantFiled: May 16, 2003Date of Patent: January 17, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara, Yutaka Onozuka
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Publication number: 20060001023Abstract: An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on the plurality of adhesion parts, respectively, each of the plurality of adhesion parts including a height control member and an adhesive.Type: ApplicationFiled: July 13, 2005Publication date: January 5, 2006Inventors: Masahiko Akiyama, Yujiro Hara, Yutaka Onozuka, Tsuyoshi Hioki, Mitsuo Nakajima