Abstract: A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

Abstract: A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).

Abstract: There are provided a battery frame that is attached to a structural member on a floor back of an automobile body and accommodates a battery, and a rear suspension member assembly that is attached to rear floor side members and supports a rear suspension. The rear suspension member assembly is attached to the rear floor side members at least at right and left front-side attachment parts and right and left rear-side attachment parts. The rear suspension member assembly is attached to the battery frame at a first attachment part that is closer to a vehicle front than the right and left front-side attachment parts.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1): (where in chemical formula (1), Ar1 is a substituted or unsubstituted first aromatic ring group, and each Ar2 is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar1 and Ar2 has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.

Abstract: A semiconductor component includes: a semiconductor device; an insulating molded portion configured to encapsulate the semiconductor device; a terminal connected to the semiconductor device, the terminal being configured to project out from the insulating molded portion; and a cooler mounted with the insulating molded portion such that the semiconductor device is cooled; wherein a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion.

Abstract: A prismatic secondary battery including a battery container containing an electric storage element and having first and second wide surfaces and an opening; a lid having first and second through holes and a centerline extending along a length of the lid; a first and second flat plate-like current collector plate inserted into the first and second through holes made of metal materials. A first insertion position of the first current collector plate is spaced at a first distance from the centerline of the lid, the first distance extending in a direction parallel to a top surface of the lid from the centerline toward the first wide surface. A second insertion position of the second current collector plate is spaced at a second distance from the centerline, the second distance extending in a direction parallel to the top surface of the lid.

Abstract: An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

Abstract: A semiconductor component includes: a semiconductor device; an insulating molded portion configured to encapsulate the semiconductor device; a terminal connected to the semiconductor device, the terminal being configured to project out from the insulating molded portion; and a cooler mounted with the insulating molded portion such that the semiconductor device is cooled; wherein a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion.

Abstract: Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.

Abstract: There are provided an active ester composition that has high curability and that provides a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance; a cured product of the composition; and a semiconductor sealing material and a printed wiring board that are formed from the composition. Specifically, an active ester composition containing an active ester compound and a benzoxazine compound as essential components is provided. Because the active ester composition containing the active ester compound and the benzoxazine compound as essential components is characterized by having high curability with a curing agent and providing a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance, the active ester composition is suitable for use as a resin material for semiconductor sealing materials and printed wiring boards.

Abstract: A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).

Abstract: A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

Abstract: Provided are an active ester composition capable of exhibiting high curability and forming a cured product with various excellent properties such as low dielectric properties, a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition. The active ester composition includes, as essential components, an active ester compound (A) and a phenolic hydroxyl group-containing compound (B), in which the active ester compound (A) is an esterification product of a compound having one phenolic hydroxyl group in the molecular structure (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2). Also provided are a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition.

Abstract: Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (?); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1): (where in chemical formula (1), Ar1 is a substituted or unsubstituted first aromatic ring group, and each Ar2 is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar1 and Ar2 has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.

Abstract: An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

Abstract: A power module includes: a first conductive plate (23u, 23v, 23w) on which first switching devices (29u, 29v, 29w) and first rectifying devices (20c) are mounted, the first conductive plate having an alternating-current terminal (100u, 100v, 100w) for alternating-current electrical power; a second conductive plate (23a) on which second switching devices (28u, 28v, 28w) and second rectifying devices (20c) are mounted, the second conductive plate having a direct-current positive electrode terminal (120a) for direct-current electric power; and a third conductive plate (23b) connected to the first switching devices and the first rectifying devices, the third conductive plate having a direct-current negative electrode terminal for direct-current electric power, wherein a first direction in which a plurality of the first switching devices are arranged is perpendicular to a second direction in which a plurality of the first rectifying devices are arranged, and the alternating-current terminal extends in the second d

Abstract: There is provided an epoxy compound whose melt viscosity is low and which exhibits heat resistance and flame retardancy of a cured product; an epoxy resin which includes the same; curable composition and cured product; and semiconductor sealing material. The epoxy compound has a molecular structure represented by the following Formula (I): in the formula, G represents a glycidyl group, and X represents a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k represents an integer of 1 to 3, m represents 1 or 2, Ar represents a structural site represented by the following Structural Formula (Ar1) or (Ar2), and when k or m represents 2 or greater, a plurality of Ar's may be the same as or different from each other: in Formula (3) or (4), G represents a glycidyl group, and p and r each independently represent 1 or 2.