Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.

Abstract: Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.

Abstract: The preset invention provides a curable resin composition which causes little change in heat resistance after a heat history of cured products and exhibits low thermal expandability, and also provides a cured product of the curable resin composition, a printed circuit board causing little change in heat resistance after a heat history and having excellent low thermal expandability, and an epoxy resin having these performances. The epoxy resin is produced by polyglycidyl-etherification of a reaction product of para-cresol, a ?-naphthol compound, and formaldehyde, the epoxy resin containing a trifunctional compound (x) represented by a structural formula (1) below and a dimer (y) represented by a structural formula (2) below, and the content of the trifunctional compound (x) is 55% or more in terms of ratio by area in GPC measurement.

Abstract: The present invention provides a curable resin composition, a cured product of which has a small change in heat resistance after receiving a thermal history and a low thermal expansion property; a cured product of the curable resin composition; a printed circuit board having a small change in heat resistance: and an epoxy resin which imparts the characteristics described above. The epoxy resin is an epoxy resin which is obtained by polyglycidyl etherification of a reaction product formed from ortho-cresol, a ?-naphthol compound, and formaldehyde and which includes as a necessary component, a dimer (x2) represented by the following structural formula (1), a trifunctional compound (x3) represented by the following structural formula (2), and a tetrafunctional compound (x4) represented by the following structural formula (3). In the above epoxy resin, the total content of those components is 65% or more in terms of the area rate in GPC measurement.

Abstract: Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures.

Abstract: A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1), R2 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area bases in GPC measurement.

Abstract: A phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.

Abstract: Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures.

Abstract: A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1), R2 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area basis in GPC measurement.

Abstract: A phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.

Abstract: A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).

Abstract: Phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.

Abstract: A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).

Abstract: There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility. A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.

Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

Abstract: [Object] A phosphorus-containing oligomer that has high solubility in an organic solvent and exhibits high flame retardancy and heat resistance in the form of a cured product thereof is provided.

Abstract: The present invention relates to an electric compressor integrally including a compression mechanism and an electric motor, and an object thereof is to prevent the housing from being elongated in the axial direction and improve the sealability and the mountability of the compression mechanism. According to the present invention, a hermetic terminal (45) electrically connecting the electric motor (30) and a motor drive circuit (40) is attached within a swelled-space portion (50) swelled toward radial outside of a housing (11) so as to be continuous with a mounting bracket (17) of the housing (11). Accordingly, the distance between the compression mechanism and motor drive circuit can be shortened.

Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).