Patents by Inventor Yuu Sugimoto
Yuu Sugimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230209721Abstract: In a plating method, a laminate made of stainless steel, and copper or a copper alloy is prepared. Plating underlayers made of nickel are formed on a first plated portion provided at the stainless steel and a second plated portion provided at the copper or the copper alloy at the same time with use of a hydrochloric acid electrolytic solution.Type: ApplicationFiled: December 16, 2022Publication date: June 29, 2023Inventors: Shotaro NAGAOKA, Yuu SUGIMOTO
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Publication number: 20230151813Abstract: A compressor includes a compression mechanism, an electric motor unit, a drive shaft and a housing. A portion of the drive shaft, which is located on one side in an axial direction, is rotatably supported by a main bearing, which is formed integrally in one-piece with or is fixed to a main bearing member of the compression mechanism. Another portion of the drive shaft, which is located on another side in the axial direction, is rotatably supported by a sub-bearing, which is formed integrally in one-piece with or is fixed to an inside of a body portion of a sub-bearing member. The sub-bearing member is formed separately from the housing and is fixed to a bottom surface of a bottom portion of the housing.Type: ApplicationFiled: January 20, 2023Publication date: May 18, 2023Applicant: DENSO CORPORATIONInventors: Yoshitaka Akiyama, Yasuhiro Oki, Tadashi Hotta, Toyohiro Kanou, Yuu Sugimoto
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Patent number: 11091850Abstract: A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.Type: GrantFiled: January 22, 2018Date of Patent: August 17, 2021Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe
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Patent number: 11026334Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.Type: GrantFiled: April 28, 2020Date of Patent: June 1, 2021Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
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Patent number: 10808329Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.Type: GrantFiled: January 22, 2018Date of Patent: October 20, 2020Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe
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Publication number: 20200260588Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.Type: ApplicationFiled: April 28, 2020Publication date: August 13, 2020Applicant: NITTO DENKO CORPORATIONInventors: Yuu SUGIMOTO, Hiroyuki TANABE, Yoshito FUJIMURA
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Patent number: 10687427Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.Type: GrantFiled: April 4, 2017Date of Patent: June 16, 2020Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
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Patent number: 10558121Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.Type: GrantFiled: May 25, 2017Date of Patent: February 11, 2020Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
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Patent number: 10524363Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.Type: GrantFiled: June 20, 2017Date of Patent: December 31, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
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Patent number: 10520817Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.Type: GrantFiled: May 25, 2017Date of Patent: December 31, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
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Publication number: 20190394882Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.Type: ApplicationFiled: January 22, 2018Publication date: December 26, 2019Applicant: NITTO DENKO CORPORATIONInventors: Yuu SUGIMOTO, Hiroyuki TANABE
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Patent number: 10257926Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.Type: GrantFiled: March 20, 2017Date of Patent: April 9, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Yoshito Fujimura, Hiroyuki Tanabe
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Patent number: 10251263Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.Type: GrantFiled: September 22, 2017Date of Patent: April 2, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Yoshito Fujimura, Hiroyuki Tanabe
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Patent number: 10201077Abstract: A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.Type: GrantFiled: July 13, 2016Date of Patent: February 5, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe, Naohiro Terada
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Patent number: 10172234Abstract: The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.Type: GrantFiled: December 21, 2016Date of Patent: January 1, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe
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Publication number: 20180358037Abstract: The suspension board with circuits can mount a slider and an electronic component, and includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a first conductive layer including an electronic component-connection terminal for electrically connecting with the electronic component, and a first wire disposed on the first insulating layer; a second conductive layer including a magnetic head-connection terminal for electrically connecting with a magnetic head provided in the slider, and a second wire, wherein at least a portion of the second wire is disposed on the second insulating layer. The suspension board with circuits has a pedestal supporting the slider. The pedestal includes the first insulating layer, second insulating layer, third insulating layer, and one of the first wire and second wire.Type: ApplicationFiled: June 4, 2018Publication date: December 13, 2018Applicant: NITTO DENKO CORPORATIONInventors: Yoshito FUJIMURA, Hiroyuki TANABE, Yuu SUGIMOTO
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Patent number: 10143088Abstract: The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist.Type: GrantFiled: December 21, 2016Date of Patent: November 27, 2018Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe
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Patent number: 10121503Abstract: A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.Type: GrantFiled: August 29, 2017Date of Patent: November 6, 2018Assignee: NITTO DENKO CORPORATIONInventors: Yuu Sugimoto, Hiroyuki Tanabe
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Publication number: 20180209058Abstract: A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.Type: ApplicationFiled: January 22, 2018Publication date: July 26, 2018Applicant: NITTO DENKO CORPORATIONInventors: Yuu SUGIMOTO, Hiroyuki TANABE
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Patent number: 10028378Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.Type: GrantFiled: December 9, 2016Date of Patent: July 17, 2018Assignee: NITTO DENKO CORPORATIONInventors: Hiroyuki Tanabe, Naohiro Terada, Yuu Sugimoto, Daisuke Yamauchi