Abstract: A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.

Abstract: [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability. [Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.

Abstract: A method for manufacturing a liquid crystal display element, includes: providing a long sheet material including a laminate of an optical film containing a polarizer, a pressure-sensitive adhesive layer, and a carrier film temporarily bonded to the pressure-sensitive adhesive layer; cutting the long sheet material at predetermined intervals, while maintaining the continuity of the carrier film; peeling off the carrier film by a tensile force; and continuously bonding the resulting optical film pieces to liquid crystal panels, respectively, through the pressure-sensitive adhesive layer exposed by the peeling off, while feeding the resulting optical film pieces, wherein the cutting is performed to such a depth as to substantially reach the carrier film, and the carrier film is cut to a depth less than half of the thickness of the carrier film at least both end portions in the width direction of the carrier film.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.

Abstract: A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.

Abstract: A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.

Abstract: Provided are a cutting information determination method that can use a simpler process to improve yield, and a strip-shaped polarizing sheet manufacturing method using such a method, an optical display unit manufacturing method using such a method, a strip-shaped polarizing sheet, and a polarizing sheet material. A cutting position in the width direction A2, in which a polarizing sheet material MP is to be cut along its longitudinal direction A1, is determined based on the numbers of defects counted with respect to plural points in the width direction A2 of the polarizing sheet material MP. This makes it possible to determine the cutting position in such a way that a region with many defects does not fall within the cut width, so that a higher-yield cutting position can be determined. The cutting position can also be determined using a simple process in which defects are counted with respect to plural points in the width direction A2.

Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

Abstract: Provided is a pressure-sensitive adhesive polarizing plate, including: a polarizer (P); a transparent protective film (E) provided on only one side of the polarizer (P) with an adhesive layer (G) interposed therebetween; a pressure-sensitive adhesive layer (B) provided on another side of the polarizer (P) with a protective layer (H) having a tensile modulus of 100 MPa or more interposed therebetween. The pressure-sensitive adhesive polarizing plate satisfies durability even under harsh environments at a low temperature and a high temperature.

Abstract: A method for manufacturing a liquid crystal display element is provided which simultaneously achieves the object of cutting an optical film without causing degradation in appearance and the object of preventing the film from being broken in a continuous bonding process, and includes: providing a long sheet material including a laminate of an optical film containing a polarizer, a pressure-sensitive adhesive layer, and a carrier film temporarily bonded to the pressure-sensitive adhesive layer; cutting the long sheet material at predetermined intervals, while maintaining the continuity of the carrier film; peeling off the carrier film by a tensile force; and continuously bonding the resulting optical film pieces to liquid crystal panels, respectively, through the pressure-sensitive adhesive layer exposed by the peeling off, while feeding the resulting optical film pieces, wherein the cutting is performed to such a depth as to substantially reach the carrier film, and the carrier film is cut to a depth less than