Patents by Inventor Yuuichi Matsumoto
Yuuichi Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110192187Abstract: There are provided a refrigeration cycle system which ensures adequate lubrication in a compressor and operates at a satisfactory coefficient of performance despite use of a working fluid containing a lubricant and a refrigerant that separate from each other in a condenser, and an automotive air-conditioning system including the refrigeration cycle system. A refrigeration cycle system (12) comprises a compressor (28), a condenser (24), an expansion valve (26) and an evaporator (28) disposed in a circulation path (14) along which a working fluid containing a lubricant and a refrigerant that separates from each other at temperatures higher than a two-layer separation temperature flows, serially in a specified flow direction of the working fluid, and a lubricant return means for preventing the lubricant from accumulating in the condenser (24).Type: ApplicationFiled: October 23, 2009Publication date: August 11, 2011Inventor: Yuuichi Matsumoto
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Publication number: 20110120175Abstract: A refrigeration circuit provided with a scroll compressor for compressing a refrigerant, characterized in that R1234yf is used as the refrigerant and a polyol ester is used as a lubricating oil for the refrigeration circuit. In this refrigeration circuit, an undesirable reaction product can be prevented from accumulating. The refrigeration circuit hence is reduced in environmental burden and has the same operating stability as in conventional ones.Type: ApplicationFiled: July 23, 2009Publication date: May 26, 2011Inventors: Hiromitsu Kamishima, Tomoaki Matsuzaki, Yuuichi Matsumoto
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Publication number: 20110113819Abstract: Provided is a refrigeration cycle wherein a compressor, a condenser, a depressurizing/expanding means and an evaporator are provided. The refrigeration cycle uses R1234 as a refrigerant, and has an oil separating means, which forcibly separates the refrigerant and oil one from the other, in a two-phase separation region wherein the refrigerant and the oil exist in a separated state without being dissolved with each other. The refrigerant and the oil can be forcibly separated suitably at a suitable position even when the refrigerant is changed to the new refrigerant R1234yf, and the refrigeration cycle can be operated at a high efficiency as a whole.Type: ApplicationFiled: June 9, 2009Publication date: May 19, 2011Inventor: Yuuichi Matsumoto
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Publication number: 20110056236Abstract: In a refrigeration cycle comprising a compressor, a condenser, a pressure reduction and expansion means, and an evaporator, R1234yf is used as the refrigerant, the refrigerant at the exit side of the evaporator is controlled in a superheated condition, and the refrigeration cycle is operated in a range of 5 to 16 degrees of superheat, and preferably in a range of 10 to 16 degrees of superheat. When the refrigerant used is changed to the new refrigerant R1234yf, while high advantage for improving the coefficient of performance can be achieved, the rise in temperature of the discharged refrigerant is appropriately suppressed so that deterioration of refrigerating machine oil in the refrigerant can be prevented, and a high-efficiency operation can be realized as the entirety of the refrigeration cycle.Type: ApplicationFiled: April 27, 2009Publication date: March 10, 2011Inventor: Yuuichi Matsumoto
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Patent number: 7690219Abstract: A module, such as a module configured to be used in a refrigeration system, includes a gas-liquid separator which is configured to receive a first refrigerant, to separate the first refrigerant into a gas portion of the first refrigerant and a liquid portion of the first refrigerant, and to transmit the gas portion of the first refrigerant. The module also includes a heat exchanger which is configured to receive a second refrigerant and to exchange heat between the second refrigerant and the gas portion of the first refrigerant and/or the liquid portion of the first refrigerant. Moreover, the heat exchanger is disposed within the gas-liquid separator.Type: GrantFiled: January 17, 2007Date of Patent: April 6, 2010Assignee: Sanden CorporationInventors: Kenichi Suzuki, Masato Tsuboi, Yuuichi Matsumoto
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Publication number: 20080173042Abstract: A vapor compression refrigeration circuit comprises a compressor, a heat radiator, a high-temperature section of an internal heat exchanger, a pressure reducer, an evaporator, an accumulator and a low-temperature section of the internal heat exchanger disposed in this order in a circulation passage through which a refrigerant circulates, when viewed along a direction of flow of the refrigerant. The pressure reducer, the accumulator and the internal heat exchanger are integrally formed.Type: ApplicationFiled: June 7, 2007Publication date: July 24, 2008Applicant: Sanden CorporationInventors: Yuuichi Matsumoto, Masato Tsuboi, Kenichi Suzuki
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Patent number: 7370493Abstract: A vapor compression refrigerating system having a compressor, a radiator, a first pressure reducing mechanism for reducing a pressure of refrigerant cooled by the radiator, a refrigerant branching means for dividing refrigerant (m) reduced in pressure by the first pressure-reducing mechanism into portions, a second pressure reducing mechanism for reducing a pressure of one portion of refrigerant (m1), and a third pressure reducing mechanism for reducing a pressure of another portion of refrigerant (m2). One portion and pressure reduced refrigerant (m1?) exchanges heat in a cooler with refrigerant present between the first and third pressure reducing mechanisms, and another portion and pressure reduced refrigerant (m2?) is evaporated by an evaporator. The evaporated refrigerant (m2?) and the refrigerant (m1?) having passed through the cooler are mixed by a gas/liquid separator, and the mixed refrigerant is introduced into the compressor.Type: GrantFiled: December 6, 2006Date of Patent: May 13, 2008Assignee: Sanden CorporationInventors: Kenichi Suzuki, Masato Tsuboi, Yuuichi Matsumoto
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Publication number: 20070277549Abstract: An automotive air-conditioning system has a gas-liquid separator, a compressor and a radiator, which are interposed in a first flow channel of a refrigerant which extends within an engine room in the order in the flowing direction of the refrigerant. The system also includes a pressure reducer and an evaporator, which are interposed in a second flow channel of the refrigerant which extends within a vehicle interior in the order in the flowing direction of the refrigerant. The system also has a connecting device disposed near a partition wall that separates the engine room from the vehicle interior. The connecting device circularly connects the first to the second flow channel, and includes a first connecting portion formed at the downstream end of the second flow channel and a second connecting portion that is formed at the inlet of the gas-liquid separator and is connected to the first connecting portion.Type: ApplicationFiled: June 5, 2007Publication date: December 6, 2007Applicant: Sanden CorporationInventors: Masato Tsuboi, Kenichi Suzuki, Yuuichi Matsumoto
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Publication number: 20070163296Abstract: A module, such as a module configured to be used in a refrigeration system, includes a gas-liquid separator which is configured to receive a first refrigerant, to separate the first refrigerant into a gas portion of the first refrigerant and a liquid portion of the first refrigerant, and to transmit the gas portion of the first refrigerant. The module also includes a heat exchanger which is configured to receive a second refrigerant and to exchange heat between the second refrigerant and the gas portion of the first refrigerant and/or the liquid portion of the first refrigerant. Moreover, the heat exchanger is disposed within the gas-liquid separator.Type: ApplicationFiled: January 17, 2007Publication date: July 19, 2007Inventors: Kenichi Suzuki, Masato Tsuboi, Yuuichi Matsumoto
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Publication number: 20070144201Abstract: An air conditioning system for a vehicle includes a first refrigeration cycle, an expander, and a second refrigeration cycle. The first refrigeration cycle includes a first compressor, a first radiator, a first pressure reducer, an evaporator, and a gas/liquid separator. The expander is disposed on a first fluid communication path between the first radiator and the first pressure reducer. The second refrigeration cycle, which is provided as a cascade cycle, includes a second compressor powered by energy harnessed from adiabatic expansion of the refrigerant at the expander, thereby obviating the need for an additional power source for the second refrigeration cycle. A heat exchanger further is provided on a second fluid communication path in the second refrigeration cycle. The heat exchanger is configured to provide a heat exchange between refrigerant disposed within each of the respective first and second fluid communication paths.Type: ApplicationFiled: December 26, 2006Publication date: June 28, 2007Applicant: SANDEN CORPORATIONInventors: Yuuichi Matsumoto, Masato Tsuboi, Kenichi Suzuki
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Publication number: 20070144206Abstract: A pressure reducer module includes an oil separator configured to receive a lubricant and a refrigerant and to separate the lubricant from the refrigerant. The pressure reducer module also includes a pressure reducer connected to and formed integral with the oil separator. The pressure reducer is configured to receive the refrigerant from the oil separator and to reduce a pressure of the refrigerant.Type: ApplicationFiled: December 22, 2006Publication date: June 28, 2007Applicant: SANDEN CORPORATIONInventors: Masato Tsuboi, Kenichi Suzuki, Yuuichi Matsumoto
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Publication number: 20070130988Abstract: A vapor compression refrigerating system includes a compressor, a radiator connected to the compressor via a first tube, a first pressure reducing mechanism connected to the radiator via a second tube, and a separator connected to the first pressure reducing mechanism via a third tube and the compressor via a fourth tube. The separator includes an oil separator which is configured to separate an oil from the refrigerant, and a liquid and gas separator formed integral with the oil separator. The liquid and gas separator is configured to separate a liquid portion and a gas portion from the refrigerant, and the separator is further configured to transmit the oil and the gas portion to the compressor via the fourth tube. The system also includes a second pressure reducing mechanism connected to the separator via a fifth tube, and an evaporator connected to the second pressure reducing mechanism via a sixth tube and operationally coupled to the compressor via a seventh tube.Type: ApplicationFiled: December 12, 2006Publication date: June 14, 2007Applicant: SANDEN CORPORATIONInventors: Yuuichi Matsumoto, Masato Tsuboi, Kenichi Suzuki
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Publication number: 20070130989Abstract: A vapor compression refrigerating system includes a compressor configured to compress a refrigerant, and a radiator connected to the compressor, in which the radiator is configured to receive the refrigerant from the compressor and to reduce a temperature of the refrigerant. The system also includes a pressure reducing mechanism connected to the radiator, and the pressure reducing mechanism is configured to receive the refrigerant from the radiator and to reduce a pressure of the refrigerant. The system also includes a separator connected to the pressure reducing mechanism and to the compressor, a pump connected to the separator, and an evaporator connected to the pump and to the separator. The separator is configured to receive the refrigerant from the pressure reducing mechanism, to separate a liquid portion of the refrigerant from a gas portion of the refrigerant, and to transmit the gas portion to the compressor.Type: ApplicationFiled: December 13, 2006Publication date: June 14, 2007Applicant: SANDEN CORPORATIONInventors: Masato Tsuboi, Kenichi Suzuki, Yuuichi Matsumoto
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Publication number: 20070125121Abstract: A vapor compression refrigerating system having a compressor, a radiator, a first pressure reducing mechanism for reducing a pressure of refrigerant cooled by the radiator, a refrigerant branching means for dividing refrigerant (m) reduced in pressure by the first pressure-reducing mechanism into portions, a second pressure reducing mechanism for reducing a pressure of one portion of refrigerant (m1), and a third pressure reducing mechanism for reducing a pressure of another portion of refrigerant (m2). One portion and pressure reduced refrigerant (m1?) exchanges heat in a cooler with refrigerant present between the first and third pressure reducing mechanisms, and another portion and pressure reduced refrigerant (m2?) is evaporated by an evaporator. The evaporated refrigerant (m2?) and the refrigerant (m1?) having passed through the cooler are mixed by a gas/liquid separator, and the mixed refrigerant is introduced into the compressor.Type: ApplicationFiled: December 6, 2006Publication date: June 7, 2007Inventors: Kenichi Suzuki, Masato Tsuboi, Yuuichi Matsumoto
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Publication number: 20070028633Abstract: An air conditioning system for a vehicle includes a compressor, a gas cooler, an expansion means, and a cooler. The system also includes an elevated pressure density detector for detecting or estimating one or more physical values having a correlation with a density of an elevated pressure refrigerant in a refrigeration cycle. An elevated pressure density controller controls the density of the elevated pressure refrigerant. This control is achieved at least in part by using at least one of the one or more physical values.Type: ApplicationFiled: July 31, 2006Publication date: February 8, 2007Inventors: Kenichi Suzuki, Masato Tsuboi, Yuuichi Matsumoto
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Publication number: 20060288721Abstract: An air conditioning system for a vehicle includes an outdoor heat exchanger, an indoor heat exchanger, and an inside heat exchanger. The inside heat exchanger exchanges heat between a refrigerant at a high-pressure and a refrigerant at a low-pressure during a refrigeration cycle. Both the outdoor heat exchanger and the inside heat exchanger include a plurality of tubes, and each of the plurality of tubes has a plurality of holes formed therethrough, which extend parallel to each other in the tubes. A cross-sectional shape of the plurality of tubes in the inside heat exchanger is the same as a cross-sectional shape of the plurality of tubes in the outdoor heat exchanger.Type: ApplicationFiled: June 22, 2006Publication date: December 28, 2006Applicant: Sanden CorporationInventors: Masato Tsuboi, Kenichi Suzuki, Yuuichi Matsumoto
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Publication number: 20060117791Abstract: An air conditioning system for a vehicle including a vapor compression-type refrigerating cycle and using combustible refrigerant includes a refrigerant recovery vessel in communication with a gas-liquid separator and which of recovers the combustible refrigerant by the communication with the gas-liquid separator, and a valve which controls the communication between the refrigerant recovery vessel and the gas-liquid separator in response to an external signal. When combustible refrigerant is used as refrigerant of a vapor compression-type, refrigerating cycle, leakage of the refrigerant may be reduced, minimized, or eliminated, and the recovery of the refrigerant may be carried out readily and efficiently without requiring significant changes to the system configuration.Type: ApplicationFiled: December 5, 2005Publication date: June 8, 2006Inventors: Kenichi Suzuki, Masato Tsuboi, Yuuichi Matsumoto
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Patent number: 7011717Abstract: According to the present invention, there are provided a method for heat treatment of silicon wafers wherein a silicon wafer is subjected to a heat treatment at a temperature of from 1000° C. to the melting point of silicon in an inert gas atmosphere, and temperature decreasing in the heat treatment is performed in an atmosphere containing 1–60% by volume of hydrogen, a method for heat treatment of silicon wafers under a reducing atmosphere containing hydrogen by using a rapid heating and rapid cooling apparatus, wherein temperature decreasing rate from the maximum temperature in the heat treatment to 700° C. is controlled to be 20° C./sec or less, and a silicon wafer which has a crystal defect density of 1.0×104 defects/cm3 or more in a wafer bulk portion, a crystal defect density of 1.0×104 defects/cm3 or less in a wafer surface layer of a depth of 0.5 ?m from the surface, a crystal defect density of 0.15 defects/cm2 or less on a wafer surface and surface roughness of 1.Type: GrantFiled: August 31, 2004Date of Patent: March 14, 2006Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Norihiro Kobayashi, Shoji Akiyama, Yuuichi Matsumoto, Masaro Tamatsuka
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Publication number: 20050025691Abstract: According to the present invention, there are provided a method for heat treatment of silicon wafers wherein a silicon wafer is subjected to a heat treatment at a temperature of from 1000° C. to the melting point of silicon in an inert gas atmosphere, and temperature decreasing in the heat treatment is performed in an atmosphere containing 1-60% by volume of hydrogen, a method for heat treatment of silicon wafers under a reducing atmosphere containing hydrogen by using a rapid heating and rapid cooling apparatus, wherein temperature decreasing rate from the maximum temperature in the heat treatment to 700° C. is controlled to be 20° C./sec or less, and a silicon wafer which has a crystal defect density of 1.0×104 defects/cm3 or more in a wafer bulk portion, a crystal defect density of 1.0×104 defects/cm3 or less in a wafer surface layer of a depth of 0.5 ?m from the surface, a crystal defect density of 0.15 defects/cm2 or less on a wafer surface and surface roughness of 1.Type: ApplicationFiled: August 31, 2004Publication date: February 3, 2005Applicant: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Norihiro Kobayashi, Shoji Akiyama, Yuuichi Matsumoto, Masaro Tamatsuka
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Patent number: 6809015Abstract: According to the present invention, there are provided a method for heat treatment of silicon wafers wherein a silicon wafer is subjected to a heat treatment at a temperature of from 1000° C. to the melting point of silicon in an inert gas atmosphere, and temperature decreasing in the heat treatment is performed in an atmosphere containing 1-60% by volume of hydrogen, a method for heat treatment of silicon wafers under a reducing atmosphere containing hydrogen by using a rapid heating and rapid cooling apparatus, wherein temperature decreasing rate from the maximum temperature in the heat treatment to 700° C. is controlled to be 20° C./sec or less, and a silicon wafer which has a crystal defect density of 1.0×104 defects/cm3 or more in a wafer bulk portion, a crystal defect density of 1.0×104 defects/cm3 or less in a wafer surface layer of a depth of 0.5 &mgr;m from the surface, a crystal defect density of 0.15 defects/cm2 or less on a wafer surface and surface roughness of 1.Type: GrantFiled: January 9, 2003Date of Patent: October 26, 2004Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Norihiro Kobayashi, Shoji Akiyama, Yuuichi Matsumoto, Masaro Tamatsuka