Abstract: A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 ?m and the resistance layer of Ni alloy layer containing at least 8 to 18 wt % of P is formed on the roughening treated side.

Abstract: A hybrid system for a vehicle which can ensure a braking stability on a slippery road is provided. Therefore, the system is provided with a motor 2 a rotation force of which is transmitted to a rear wheel 7, braking actuators 57, 67 which brake the front wheel 6 and the rear wheel 7, and proportional valves 53, 63 controlling a braking force introduced into each braking actuator 57, 67. A control unit 20 is so provided that the control unit 20 calculates a required braking energy based upon a vehicle operating condition in demanding a braking and operates the motor 2 as a power generator to generate a power so as to produce the calculated braking energy, as well as controls a braking force of the front wheel 6.

Abstract: In a gateway system for connecting a telephone network utilizing a common channel signaling system No. 7 to an IP (Internet Protocol) network, the gateway system includes a media gateway and a media gateway controller group including a plurality of media gateway controllers which are assigned a common point code. Any one of the media gateway controllers is for terminating a No. 7 signal representative of a control signal of the common channel signaling system No. 7 in the telephone network and for carrying out call control and connection control to the IP network by controlling the media gateway through the IP network so that a communication path is established between the telephone network and the media gateway. Each of the media gateway controllers comprises a No. 7 signal processing portion for terminating the No.

Abstract: An ink comprises 100 parts by weight of an aluminum flake containing aluminum flakes of 0.5 ?m or less, more preferably 0.3 ?m or less, in thickness and 20 ?m2 to 2,000 ?m2 in flake area in a content of 75% or more, 3 to 200 parts by weight of a binding agent, and 600 to 4,000 parts by weight of a solvent, wherein the solvent is the one containing 20 wt % or more of 3-methyl-3-methoxy-1-butanol (MMB).

Abstract: An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 ?m and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 ?m, preferably 6 to 35 thereof are uniformly distributed in a 25 ?m of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 ?m and not more than twice of 25 ?m divided by the number of projections in the 25 ?m surface length.

Abstract: An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided.

Abstract: An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 ?m, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 ?m by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Abstract: A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

Abstract: The present invention provides a semiconductor integrated circuit device equipped with at least one pulse generator which generates a pulse of a pulse with shorter than a rising time up to the full amplitude of a transfer signal.

Abstract: An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided.

Abstract: An ink is provided which meets the purpose of concurrently resolving the drawback <1>, drawback <2> and drawback <3>.

Abstract: In a gateway system for connecting a telephone network (101) utilizing a common channel signaling system No. 7 to an IP (Internet Protocol) network (102), the gateway system includes a media gateway (3) and a media gateway controller group (1) including a plurality of media gateway controllers(11-13) which are assigned with a common point code. Any one of the media gateway controllers is for terminating a No. 7 signal representative of a control signal of the common channel signaling system No. 7 in the telephone network and for carrying out call control and connection control to the IP network by controlling the media gateway through the IP network so that a communication path (100) is established between the telephone network and the media gateway. Each of the media gateway controllers comprises a No. 7 signal processing portion for terminating the No.

Abstract: In a positioning device, expandable bodies which expand and contract by air pressure are disposed at opposite sides of a movable member in its moving direction, the movable member being able to reciprocate, and a valve device for holding the expandable bodies in their extended states by valve-closing action is provided in an air path device which supplies air from an air supplying device to the expandable bodies. In a massager including this positioning device, the movable member is movably guided in up and down directions by a guide member provided in a back rest of a chair body, and the movable member is provided with a massage element which is projected from a surface of the back rest and is abutted against a body of a person sitting on the chair body.

Abstract: Provided is a method for manufacturing a reflow-plated member, which comprises a process for forming a plated layer of Sn or Sn alloy on the surface of a base material, at least the surface of which is formed of Cu or Cu alloy, by electroplating, and a process for running the base material at a traveling speed equivalent to 80% to 90% of the lowest traveling speed that said plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature. The obtained reflow-plated member is excellent in any of properties including solderability, heat resistance, bendability, wear resistance, and corrosion resistance.

Abstract: An ink jet recording device in which an ink carrier film is formed to have a plurality of pores or recesses, the pores or recesses are filled with ink, the film filled at their pores or recesses with the ink is quickly heated by such a heat supply source as a thermal head according to picture image information to generate bubbles within the ink in the heated pores or recesses and to eject the ink onto a recording medium under influence of the pressure of the bubbles for recording. The ink carrier film comprises at least two layers one of which on a side of the heat supply source is made of a heat-insulating, low-friction material, thus improving the thermal efficiency of the ink carrier film and minimizing the frictional wear of the heat supply source.