Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.

Abstract: A multilayer coil component includes an element body, a plurality of coil conductors, a first resistive layer, and a second resistive layer. The plurality of coil conductors are disposed in the element body and electrically connected to each other. The plurality of coil conductors include a first coil conductor and a second coil conductor adjacent to each other. The first resistive layer and the second resistive layer oppose each other between the first coil conductor and the second coil conductor. The first resistive layer is in contact with the first coil conductor.

Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.

Abstract: A laminated coil component includes an element body, a coil, and a pair of conductors. The pair of conductors is disposed on the element body. Each of the pair of conductors has an L shape when viewed from the third direction. Each of the pair of conductors includes a first conductor portion and a second conductor portion. The first conductor portion is disposed on one of first side faces. The second conductor portion is disposed on a pair of end faces. The coil includes a first coil portion and a second coil portion. The first coil portion includes a first straight portion and a pair of second straight portions. The pair of second straight portions is connected to both ends of the first straight portion. The second coil portion is curved as a whole.

Abstract: A multilayer coil component includes an element body including an end surface, a coil disposed in the element body, and an external electrode disposed on an end portion of the element body and connected to the coil. The external electrode includes a conductive resin layer. The conductive resin layer includes resin and a plurality of metal particles and is in contact with the end surface. The conductive resin layer includes a metal particle group. The metal particle group consists a plurality of first metal particles included in the plurality of metal particles, and the plurality of first metal particles is adjacent to the end surface and separated from the end surface.

Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

Abstract: A coil component includes: an element body; a coil including a plurality of coil conductors disposed in the element body and electrically connected to each other; an external electrode disposed on the element body; and a connection conductor that connects the coil and the external electrode. The connection conductor has an end portion exposed from an outer surface of the element body and connected to the external electrode. The end portion has a shape extending outward over an entire circumference.

Abstract: A multilayer coil component includes: an element body; a coil disposed in the element body; and a first external electrode disposed on a surface of the element body in which the first external electrode has a first electrode layer disposed on the surface of the element body and a first plating layer and a second plating layer disposed on the first electrode layer, and the first plating layer and the second plating layer are disposed so as to be scattered in a plurality of places on an edge of the first electrode layer.

Abstract: A multilayer coil component includes: an element body formed by stacking a magnetic body layer containing a plurality of metal magnetic particles of a soft magnetic material; a first coil disposed in the element body and configured to include a plurality of first coil conductors; a second coil disposed in the element body and configured to include a plurality of second coil conductors; a first external electrode to which one end portion of each of the first coil and the second coil is connected; and a second external electrode to which the other end portion of each of the first coil and the second coil is connected.

Abstract: A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.

Abstract: A soft magnetic metal powder or the like from which a soft magnetic metal fired body can be provided has a high magnetic permeability ? and a specific resistance ? and is contained in a coil-type electronic component having sufficiently high inductance L and Q value and unlikely to be plating-extended and short-circuited. A soft magnetic metal powder contains soft magnetic metal particles containing at least Fe and Ni. Said soft magnetic metal powder further contains P, Si, Cr and/or M. M is at least one selected from among B, Co, Mn, Ti, Zr, Hf, Nb, Ta, Mo, Mg, Ca, Sr, Ba, Zn, Al, and rare earth elements. The content of each element is within a predetermined range.

Abstract: A coil-type electronic component comprises an element including a magnetic element body and a coil conductor. A portion of the magnetic element body in between layers of the coil conductor adjacent to each other in an axis direction of the coil conductor includes first soft magnetic metal particles. A portion of the magnetic element body on an outer side along the axis includes second soft magnetic metal particles. The first soft magnetic metal particles have a saturation magnetization (Ms) higher than that of the second soft magnetic metal particles.

Abstract: A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.

Abstract: A method for manufacturing a multilayer coil component 1 includes forming a plurality of insulator layers by a photolithography method using a photosensitive insulator paste, forming a plurality of conductors and via conductors by a photolithography method using a photosensitive conductive paste, a step of forming a first conductor, a step of forming a first insulator layer around the first conductor such that it becomes even with an upper surface of the first conductor, a step of forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.

Abstract: In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.

Abstract: In a multilayer coil component, a coil is configured by electrically connecting coil conductors respectively provided in magnetic body layers constituting an element body and metal magnetic particles have a normal particle having an ellipsoidal shape and flat particles having an ellipsoidal shape flatter in a thickness direction than the normal particle. A plurality of the normal particles and at least one of the flat particles disposed such that a surface (reference surface) including a major axis direction orthogonal to the thickness direction and a minor axis direction is along the forming surface of the coil conductor in the magnetic body layer are arranged in the lamination direction of the magnetic body layers between the coil conductors.

Abstract: A multilayer coil electronic component having improved inductance L, Q, and strength, and which has an element in which a coil conductor and a magnetic element body are stacked. The magnetic element body includes soft magnetic metal particles and a resin. The resin fills a space between the soft magnetic metal particles. Each of soft magnetic metal particles has a soft magnetic metal particle core and an oxide film covering the soft magnetic metal particle core. A layer of the oxide film contacting the soft magnetic metal particle core is made of an oxide including Si.

Abstract: A multilayer coil component includes: an element body containing a plurality of metal magnetic particles; a coil disposed in the element body; and an external electrode disposed on a surface of the element body and electrically connected to the coil. At least a part of a void part between the metal magnetic particles in the element body is filled with a first resin, the external electrode has a resin electrode containing a second resin and a conductor powder dispersed in the second resin, and the second resin connected from the resin electrode extends into the element body.

Abstract: A laminated coil component includes an element body, a coil, and a pair of conductors, the pair of conductors is disposed on the element body. Each of the pair of conductors has an L shape when viewed from the third direction. Each of the pair of conductors includes a first conductor portion and a second conductor portion. The first conductor portion is disposed on one of first side faces. The second conductor portion is disposed on a pair of end faces. The coil includes a first coil portion and a second coil portion. The first coil portion includes a first straight portion and a pair of second straight portions. The pair of second straight portions is connected to both ends of the first straight portion. The second coil portion is curved as a whole.

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.