Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.

Abstract: A laminated coil component includes an element body, a coil, and a pair of conductors. The pair of conductors is disposed on the element body. Each of the pair of conductors has an L shape when viewed from the third direction. Each of the pair of conductors includes a first conductor portion and a second conductor portion. The first conductor portion is disposed on one of first side faces. The second conductor portion is disposed on a pair of end faces. The coil includes a first coil portion and a second coil portion. The first coil portion includes a first straight portion and a pair of second straight portions. The pair of second straight portions is connected to both ends of the first straight portion. The second coil portion is curved as a whole.

Abstract: A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

Abstract: A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

Abstract: An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.

Abstract: An electronic component includes an element body, a conductor provided on the element body, a plating layer provided on the conductor, and a glass layer provided on the conductor along an outer edge of the plating layer.

Abstract: An electronic-component manufacturing method is for simultaneously manufacturing a plurality of electronic components each including an element body and a conductor. The electronic-component manufacturing method includes the steps of forming laminates to be the plurality of electronic components on a plurality of regions set apart from each other on a surface of a first substrate, releasing the laminates from the plurality of regions, and performing heat treatment to the laminates. The forming the laminates includes a first step of forming element-body patterns on the plurality of regions and a second step of forming conductor patterns on the plurality of regions. The element-body patterns contain a constituent material of the element bodies and are patterned for the plurality of regions. The conductor patterns contain a constituent material of the conductors and are patterned for the plurality of regions.

Abstract: An electronic component includes an element provided with a first recess, and a mounting conductor including a first conductor portion disposed in the first recess. The first conductor portion has a first face opposed to a bottom face of the first recess, a second face opposed to the first face, and a third face connecting the first face and the second face. The third face has a region overlapping with the second face as viewed from an opposing direction of the bottom face of the first recess and the first face.

Abstract: In a multilayer coil component, an end of a lower coil layer and an end of a connecting part are directly overlapped, and the end of the lower coil layer includes a contact edge positioned on a side of the connecting part and being in contact with the connecting part and a non-contact edge positioned on a side opposite to the connecting part and not being in contact with the connecting part. Then, the contact edge and the non-contact edge are not overlapped when viewed from a laminated direction. Consequently, a propagation distance of a crack becomes longer as compared with the case where an end face is parallel to the laminated direction, effectively suppressing advance of the crack. Suppressed advance of a crack in this manner makes the multilayer coil component provide a high component strength as a whole.

Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.

Abstract: A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

Abstract: A multilayer coil component includes an element body including soft magnetic metal powders and a coil disposed in the element body. The coil includes a plurality of internal conductors electrically connected to each other. The plurality of internal conductors are separated from each other in a first direction and are adjacent to each other in the first direction. An average particle diameter of the soft magnetic metal powders located at an inner side of the coil when viewing from the first direction is larger than an average particle diameter of the soft magnetic metal powders located between the internal conductors adjacent to each other in the first direction.

Abstract: A soft magnetic metal powder includes a plurality of soft magnetic metal grains composed of an Fe—Si based alloy. A content of P in the Fe—Si based alloy is 110 to 650 ppm provided that a total content of Fe and Si is 100 mass %. A soft magnetic metal fired body includes soft magnetic metal fired grains composed of an Fe—Si based alloy. A content of P in the Fe—Si based alloy is 110 to 650 ppm provided that a total content of Fe and Si is 100 mass %.

Abstract: In the laminated coil component, the grain diameter of the coil conductors is 10 ?m to 22 ?m after baking is completed. When the grain diameter of the coil conductors is set to be 10 ?m or larger after baking is completed, surface roughness of the coil conductors can be reduced to such an extent that a satisfactory Q value can be obtained at a high frequency. In addition, when the grain diameter of the coil conductors is set to be 22 ?m or smaller after baking is completed, metal of the coil conductors can be refrained from being rapidly melted down during baking. Accordingly, a high Q value can be obtained while a high quality is ensured.

Abstract: A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

Abstract: In the laminated coil component, the grain diameter of the coil conductors is 10 ?m to 22 ?m after baking is completed. When the grain diameter of the coil conductors is set to be 10 ?m or larger after baking is completed, surface roughness of the coil conductors can be reduced to such an extent that a satisfactory Q value can be obtained at a high frequency. In addition, when the grain diameter of the coil conductors is set to be 22 ?m or smaller after baking is completed, metal of the coil conductors can be refrained from being rapidly melted down during baking. Accordingly, a high Q value can be obtained while a high quality is ensured.