Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.

Abstract: A shock indicator is described comprising (A) a base having a first side and a second side; (B) an indicator associated with the first side of the base, the indicator comprising a plurality of indicator subparts, the subparts comprising solid material arranged (i) in a first configuration when the shock indicator is in a first state prior to a shock event, and (ii) in a second configuration when the shock indicator is in a second state following a shock event; and (C) means associated with the second side of the base for attachment of the shock indicator to a surface. A method of manufacture is also provided.

Abstract: An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent being present in the mixture. The mixture is mixed at a temperature from about 130° C. to about 200° C. and sufficiently to form an iodine/iodide-containing hot melt coatable adhesive. Alternatively, the iodide may be generated in situ. The adhesive so prepared may be packaged for coating on a substrate at a later time, or may be immediately coated to form an adhesive composite. Adhesive composites, particularly surgical incise drapes, are provided incorporating this hot melt coatable adhesive.

Abstract: A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.

Abstract: The present invention provides a fire retardant, multi-layer article, comprising: a first adhesive layer comprising a pressure sensitive adhesive; a core layer having an outer surface, the first adhesive layer adhered to at least a portion of the outer surface; a fire retardant disposed in at least one of the first adhesive layer or the core layer, the fire retardant comprising a brominated phosphate and being essentially free of antimony fire retardants and polybrominated biphenyls; and the tape being cleanly removable.

Abstract: Polyurethane-based pressure sensitive adhesives comprising the reaction product of: an isocyanate-reactive component comprising at least two isocyanate-reactive materials, an isocyanate-functional component; a reactive emulsifying compound; a chain capping agent and an optional chain extending agent. The adhesives, which are preferably pressure sensitive adhesives, can be prepared from 100% solids, waterborne or solventborne systems.

Abstract: Pressure sensitive adhesive compositions comprising an unreactive mixture of polydiorganosiloxane polyurea copolymer, diluent, and silicate tackifying resin. The compositions are useful for articles such as medical devices.

Abstract: The present invention provides a multi-layer tape, comprising: a first adhesive layer comprising a pressure sensitive adhesive; a core layer having an outer surface, the first adhesive layer adhered to at least a portion of the outer surface; and fibrous reinforcing material dispersed within the core layer, the fibrous reinforcing material imparting stretch release properties to the tape. The tape may comprise a second adhesive layer wherein the outer surface comprises a first major surface and a second major surface, the first adhesive layer being adhered to the first major surface, and the second adhesive layer being adhered to the second major surface. A fire retardant may be disposed in any of the first adhesive layer, the second adhesive layer, and the core layer. The tape may be cleanly removable.

Abstract: A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.

Abstract: A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.

Abstract: The invention provides an assembly for the control and removal of fluids, the assembly comprising: A fluid control layer having a top side and a bottom side, the top side constructed to facilitate the evaporation or the flow of a fluid disposed thereon; a fire retardant material having a first major surface and a second major surface, the first major surface associated with the bottom side of the fluid control layer, the fire retardant material comprising a polymer; and an adhesive layer associated with the second major surface of the fire retardant material. A fluid management system for aircraft and a method for the use of the system in aircraft are also described.

Abstract: Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.

Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.

Abstract: This invention is directed to a fiber reinforced adhesive composition comprising a pressure sensitive adhesive matrix and a fibrous reinforcing material within the pressure sensitive adhesive matrix. The adhesive composition has a yield strength and a tensile strength. The tensile strength is at least about 150% of the yield strength. Generally, the adhesive composition exhibits these properties at least 50% elongation when measured according to ASTM D 882-97 at a crosshead speed of 12 inches/minute (30 centimeters/minute).

Abstract: Pressure sensitive adhesives and methods wherein the pressure sensitive adhesives include a silicone tackifying resin having no greater than about 1.5 wt-% Si—OH functional groups and a polydiorganosiloxane polyurea copolymer.

Abstract: A polymeric composition includes a first polymeric material, for example, an adhesive material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically. The polymeric composition is optionally disposed on a substrate and can be used, for example, to extract light from a light guide or to asymmetrically alter the viewing angle of a display.

Abstract: The present invention is directed to an article comprising a backing, the backing comprising a first major surface and a second major surface, wherein the first major surface comprises a microstructured surface comprising microstructure elements; and a low-flow adhesive layer opposite the microstructured surface. Additionally, the present invention is directed to multi-layer embodiments that are linerless.

Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.

Abstract: An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent being present in the mixture. The mixture is mixed at a temperature from about 130° C. to about 200° C. and sufficiently to form an iodine/iodide-containing hot melt coatable adhesive. Alternatively, the iodide may be generated in situ. The adhesive so prepared may be packaged for coating on a substrate at a later time, or may be immediately coated to form an adhesive composite. Adhesive composites, particularly surgical incise drapes, are provided incorporating this hot melt coatable adhesive.

Abstract: The invention provides an assembly for the control and removal of fluids, the assembly comprising: A fluid control layer having a top side and a bottom side, the top side constructed to facilitate the evaporation or the flow of a fluid disposed thereon; a fire retardant material having a first major surface and a second major surface, the first major surface associated with the bottom side of the fluid control layer, the fire retardant material comprising a polymer; and an adhesive layer associated with the second major surface of the fire retardant material. A fluid management system for aircraft and a method for the use of the system in aircraft are also described.