Abstract: The present invention provides a multi-layer tape, comprising: a first adhesive layer comprising a pressure sensitive adhesive; a core layer having an outer surface, the first adhesive layer adhered to at least a portion of the outer surface; and fibrous reinforcing material dispersed within the core layer, the fibrous reinforcing material imparting stretch release properties to the tape. The tape may comprise a second adhesive layer wherein the outer surface comprises a first major surface and a second major surface, the first adhesive layer being adhered to the first major surface, and the second adhesive layer being adhered to the second major surface. A fire retardant may be disposed in any of the first adhesive layer, the second adhesive layer, and the core layer. The tape may be cleanly removable.

Abstract: A flame retardant article foamed substrate is described, the article comprising a polymeric foam material comprising a polymer, antimony-free fire retardant and a plurality of microspheres, the foam material having an outer surface; and an adhesive layer on the outer surface, the adhesive layer is preferably formulated without fire retardant. The polymeric foam material is selected from the group consisting of elastomers, rubbers, thermoplastic elastomers, rubber based and acrylic adhesives, polyolefin polymers, acrylate polymers and methacrylate polymers, acrylate and methacrylate copolymers, and combinations thereof. The adhesive layer may comprise a pressure sensitive adhesive, a heat-activated adhesive, or the like. Viscoelastic or elastic microfibers may be incorporated into the foam material, into the adhesive layer, or both to impart stretch release properties to the finished article.

Abstract: A foam adhesive article is provided comprising a polymeric foam material having an outer surface, the outer surface of the polymeric foam material having adhesive properties; and fibrous reinforcing material, the fibrous reinforcing material dispersed within the polymeric foam material and imparting stretch release properties to the article. A method for preparing the foam adhesive article is also described comprising (a) melt mixing a foamable polymer composition, and a fiber forming resin to form an expandable extrudable composition; and (b) extruding the expandable extrudable composition through a die to provide the foam adhesive article.

Abstract: The invention relates to a hot melt processable pressure sensitive adhesive comprising at least one elastomer, organophilic clay plate-like particles, and at least one non-volatile organophilic exfoliating agent. Also disclosed are articles prepared therefrom and methods pertaining thereto.

Abstract: Priming compositions and methods, wherein the compositions include a polydiorganosiloxane polyurea copolymer comprising electron rich groups.

Abstract: The present invention is directed to a primer composition. The primer composition comprises a maleated thermoplastic elastomer, a non-halogenated polyolefin, and a resin. In some embodiments, the primer comprises a crosslinking agent, for example 2,4-bis(trichloromethyl)-6-4′-methoxyphenyl-sym-triazine. In other embodiments, the primer comprises an epoxy.

Abstract: Pressure sensitive adhesives and methods wherein the pressure sensitive adhesives include a silicone tackifying resin having no greater than about 1.5 wt- % Si—OH functional groups and a polydiorganosiloxane polyurea copolymer.

Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.

Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.

Abstract: This invention is directed to a reinforced adhesive fiber that includes a pressure sensitive adhesive component and a reinforcing material within the pressure sensitive adhesive component.

Abstract: The invention relates to a hot melt processable pressure sensitive adhesive comprising at least one elastomer, organophilic clay plate-like particles, and at least one non-volatile organophilic exfoliating agent. Also disclosed are articles prepared therefrom and methods pertaining thereto.

Abstract: Pressure sensitive adhesive articles and methods, particularly stretch removable adhesive articles that are preferably for use in adhering to skin or like delicate surfaces. Preferably, stretch removability of the article occurs as a result of the selection of a stretch removable pressure sensitive adhesive. In one embodiment of the articles and methods, the adhesive and backing delaminate upon removal. In another embodiment of the articles and methods, the backing includes a predefined tab located in a central location of the backing.

Abstract: This invention is directed to a fiber reinforced adhesive composition comprising a pressure sensitive adhesive matrix and a fibrous reinforcing material within the pressure sensitive adhesive matrix. The adhesive composition has a yield strength and a tensile strength. The tensile strength is at least about 150% of the yield strength. Generally, the adhesive composition exhibits these properties at least 50% elongation when measured according to ASTM D 882-97 at a crosshead speed of 12 inches/minute (30 centimeters/minute).

Abstract: A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.

Abstract: This invention is directed to a fiber reinforced adhesive composition comprising a pressure sensitive adhesive matrix and a fibrous reinforcing material within the pressure sensitive adhesive matrix. The adhesive composition has a yield strength and a tensile strength. The tensile strength is at least about 150% of the yield strength. Generally, the adhesive composition exhibits these properties at least 50% elongation when measured according to ASTM D 882-97 at a crosshead speed of 12 inches/minute (30 centimeters/minute).

Abstract: A polymeric composition includes a first polymeric material, for example, an adhesive material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically. The polymeric composition is optionally disposed on a substrate and can be used, for example, to extract light from a light guide or to asymmetrically alter the viewing angle of a display.

Abstract: Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon--carbon double bonds; (b) optionally, an effective amount of a crosslinkable diluent; (c) optionally, an effective amount of a source of free radical initiators; and (d) optionally, an effective amount of a resin to react with remnant carboxylic acid moieties. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used.

Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) optionally, an effective amount of a crosslinkable diluent; (c) optionally, an effective amount of a source of free radical initiators; and (d) optionally, an effective amount of a resin to react with remnant carboxylic acid moieties. By employing an acrylate, methacrylate, or phenol in the structure of the adhesive flux, the cure temperature and moisture absorption characteristics can be significantly improved. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically.