Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

Abstract: A dual-axis tuning fork gyroscope includes four open-ended tuning forks arranged coplanarly in two opposite pairs, a first pair of open-ended tuning forks being arranged opposite one another along a first axis, a second pair of open-ended tuning forks being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another. The four open-ended tuning forks are mechanically coupled together so that all four tuning forks vibrate in the same manner in terms of frequency and phase.

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to one or more microelectromechanical ring resonator structures having a circular or substantially circular outer surface and a circular or substantially circular inner surface. The microelectromechanical ring resonator(s) include an anchor support element having an impedance matching structure coupled to at least one substrate anchor. The impedance matching structure may be a beam, having a predetermined length, which couples the ring resonator(s) to substrate anchor. In one embodiment, the impedance matching structure operates in a bulk-elongation mode. In another embodiment, the impedance matching structure operates in a flexure mode. In operation, when induced, the microelectromechanical ring resonator structure oscillates in an elongating/compressing or breathing mode (or in a primarily or substantially elongating or breathing mode).

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

Abstract: A plurality of mechanically coupled MEMS resonators that are arranged in an N×M MEMS array structure. Each MEMS resonators includes a plurality of straight (or substantially straight) elongated beam sections that are connected by curved/rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved/rounded sections thereby forming a geometric shape (e.g., a rounded square). Further, each resonator is mechanically coupled to at least one other adjacent resonator of the array via a resonator coupling section. The resonator coupling sections may be disposed between elongated beam sections of adjacent resonators. The resonators, when induced, oscillate at the same or substantially the same frequency. The resonators oscillate in a combined elongating (or breathing) mode and bending mode; that is, the beam sections exhibit an elongating-like (or breathing-like) motion and a bending-like motion.

Abstract: An arrangement for use with a micro-mechanical beam, in which a plurality of support structures are configured to directly attach to the micro-mechanical beam to increase bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness. At least two of the support structures are arranged to touch each upon reaching a predetermined bending action of the micro-mechanical beam and prevent a further bending action of the micro-mechanical beam, and at least two of the support structures are non-identical.

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to one or more microelectromechanical ring resonator structures having a circular or substantially circular outer surface and a circular or substantially circular inner surface. The microelectromechanical ring resonator(s) include an anchor support element having an impedance matching structure coupled to at least one substrate anchor. The impedance matching structure may be a beam, having a predetermined length, which couples the ring resonator(s) to substrate anchor. In one embodiment, the impedance matching structure operates in a bulk-elongation mode. In another embodiment, the impedance matching structure operates in a flexure mode. In operation, when induced, the microelectromechanical ring resonator structure oscillates in an elongating/compressing or breathing mode (or in a primarily or substantially elongating or breathing mode).

Abstract: An arrangement for a micro-mechanical beam includes a support structure to provide an increase in bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness, where the support structure is configured to directly attach to the micro-mechanical beam.

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

Abstract: A plurality of mechanically coupled MEMS resonators that are arranged in an N×M MEMS array structure. Each MEMS resonators includes a plurality of straight (or substantially straight) elongated beam sections that are connected by curved/rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved/rounded sections thereby forming a geometric shape (e.g., a rounded square). Further, each resonator is mechanically coupled to at least one other adjacent resonator of the array via a resonator coupling section. The resonator coupling sections may be disposed between elongated beam sections of adjacent resonators. The resonators, when induced, oscillate at the same or substantially the same frequency. The resonators oscillate in a combined elongating (or breathing) mode and bending mode; that is, the beam sections exhibit an elongating-like (or breathing-like) motion and a bending-like motion.

Abstract: Methods of fabricating micromachined devices are disclosed, as are micromachined (MEMS) devices fabricated using such methods. According to one embodiment, the method includes forming a composite thin film layer stack on a substrate such that composite thin film layer stack comprises a plurality of etch-resistant layers, directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer thereof, and directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer. These steps may result in the formation of a composite thin film microstructure.

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

Abstract: A device for levitating a disk including three bottom electrodes situated below the disk and equidistantly around a top circle and three top electrodes situated above the disk, opposite the three bottom electrodes, and situated equidistantly around a bottom circle. Two bottom reference electrodes are situated below the disk, a first bottom reference electrode forming a bottom inner circle on a bottom inner perimeter of the set of three bottom electrodes, a second bottom reference electrode forming a bottom outer circle on a bottom outer perimeter of the set of three bottom electrodes. Two top reference electrodes are situated above the disk, a first top reference electrode forming a top inner circle on a top inner perimeter of the set of three top electrodes, a second top reference electrode forming a top outer circle on a top outer perimeter of the set of three top electrodes.

Abstract: A monolithic integrated 3-axis accelerometer chip includes a single crystal substrate, the substrate including at least one single crystal membrane layer portion. A single sensor microstructure made from the single crystal membrane senses acceleration in each of the three orthogonal directions. At least one electronic circuit can also be disposed on the chip, such as a circuit for driving, detecting, controlling and signal processing.

Abstract: A device for levitating a disk including three bottom electrodes situated below the disk and equidistantly around a top circle and three top electrodes situated above the disk, opposite the three bottom electrodes, and situated equidistantly around a bottom circle. Two bottom reference electrodes are situated below the disk, a first bottom reference electrode forming a bottom inner circle on a bottom inner perimeter of the set of three bottom electrodes, a second bottom reference electrode forming a bottom outer circle on a bottom outer perimeter of the set of three bottom electrodes. Two top reference electrodes are situated above the disk, a first top reference electrode forming a top inner circle on a top inner perimeter of the set of three top electrodes, a second top reference electrode forming a top outer circle on a top outer perimeter of the set of three top electrodes.

Abstract: Methods of fabricating micromachined devices are disclosed, as are micromachined (MEMS) devices fabricated using such methods. According to one embodiment, the method includes forming a composite thin film layer stack on a substrate such that composite thin film layer stack comprises a plurality of etch-resistant layers, directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer thereof, and directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer. These steps may result in the formation of a composite thin film microstructure.

Abstract: An arrangement for a micro-mechanical beam includes a support structure to provide an increase in bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness, where the support structure is configured to directly attach to the micro-mechanical beam.

Abstract: An apparatus is described to reduce a play occurring in a micro-mechanical gear arrangement, the apparatus having a moveable hub coupled to a gear of the micro-mechanical gear arrangement, the moveable hub configured to permit a movement of the gear that reduces the play. A push rod is coupled to the moveable hub and at least one buckling beam is tethered to the push rod so that a force is exerted upon the push rod to cause the movement of the gear, the force being transferable to the gear via the moveable hub.