Method for manufacturing a midplane
A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a layer with a channel formed therein to define a perimeter of a connector area is provided. The layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multi-layer board and a layer. The multi-layer board has a connection assembly. The layer has a channel formed therein to define a perimeter of a connector area. The layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the layer is pre-formed with the channel prior to formation of the rigid multi-layer.
Latest VIASYSTEMS GROUP, INC. Patents:
The present patent application claims priority to the provisional patent application filed on Jul. 8, 2003 and identified by U.S. Ser. No. 60/485,765, the entire content of which is hereby incorporated herein by reference.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENTNot Applicable.
SUMMARY OF THE INVENTIONIn general, the present invention relates to method for manufacturing a mid-plane. In the method, a multi-layer board and a layer are provided. The layer is preferably a dielectric layer. The multi-layer board has a connection assembly. The layer has a channel formed therein to define a perimeter of a connector area. The layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. Then, at least a portion of the connector area in the layer is removed to expose the connection assembly of the multi-layer board.
The present invention also relates to a rigid multilayer. The rigid multilayer includes a multi-layer board and a layer. The layer is preferably a dielectric layer. The multi-layer board has a connection assembly. The layer has a channel formed therein to define a perimeter of a connector area. The layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing to expose the connection assembly of the multi-layer board. As will be understood by one skilled in the art, the depth tolerance is not critical because the layer is pre-formed with the channel prior to formation of the rigid multi-layer.
The layer is preferably bonded to the multi-layer board with a non-flowable adhesive or a low flowable adhesive. The non-flowable adhesive or low flowable adhesive can be certain types of pre-preg known in the art. The channel pre-formed in the layer prevents any flow of the adhesive from entering the connector area. Thus, the adhesive does not interfere with or otherwise damage the connection assembly formed in the multi-layer board.
Other advantages and features of the present invention will become apparent to one skilled in the art when the following detailed description is read in conjunction with the attached drawings and the appended claims.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
Referring to the drawings, and in particular to
The mid-plane 10 is also provided with first and second metallic foils 30 and 32. The first metallic foil 30 is connected to the multi-layer board 16a via a bonding material 34. The second metallic foil 32 is connected to the multi-layer board 16b via a bonding material 36. The multi-layer board 16a is connected to the multi-layer board 16b by way of a bonding material 38. The bonding materials 34, 36 and 38 can be any suitable material capable of rigidly affixing the metallic foils 30 and 32, and the multi-layer boards 16a and 16b together to form the mid-plane 10 as a rigid structure. For example, the bonding materials 34, 36 and 38 can be an uncured pre-preg material. The bonding materials 34 and 36 are preferably low flowable adhesives or non-flowable adhesives, such as certain types of pre-preg known in the art.
It should be noted that the first and second metallic foils 30 and 32 can be provided with predetermined conductive patterns thereon including vias or other types of electrical interconnections for connecting the first and second metallic foils 30 and 32 to the respective multi-layer boards 16a and 16b so that at least two independent circuits are formed on either side of the mid-plane 10. In other words, the first metallic foil 30 is electrically interconnected with the multi-layer board 16a to form at least one independent circuit. Likewise, the second metallic foil 32 is interconnected with the multi-layer board 16b to form at least one independent circuit. It should be noted that the circuits on the multi-layer boards 16a and 16b can be interconnected, if desired, by vias or other suitable conductive paths formed in the mid-plane 10.
Shown in
The multi-layer boards 16a and 16b can be characterized as buried via products complete with a surface finish (not shown) such as an ENIG finish.
Shown in
The bonding materials 34 and 36 are provided adjacent to the dielectric layer 52 and extend generally about the dielectric layer 52, with the exception of the portions of the dielectric layer 52 provided in the connector areas 20a, 20b, 20c and 20d.
Shown in
In another embodiment a rigid multi-layer 62a can be produced, as shown in
As shown in
The mid plane 10 can then be used in a well known manner. That is, the connectors 22 with the press fit connectors 26 are connected through the rigid multi-layer by inserting the press fit connectors 26 in through the holes 42 and 48 in the rigid multi-layer 62. The use of mid planes is known in the art, and no more comments are believed necessary to teach one skilled in the art how to use the mid plane 10 in view of the other detailed description contained herein.
It should be understood that the foregoing sets forth examples of the present invetion. Thus, changes may be made in the construction and operation of the various components, elements and assemblies described herein and changes may be made in the steps or the sequence of steps of the methods described hereinwithout departing from the spirit and the scope of the invention as defined in the following claims.
Claims
1. A method for manufacturing a mid-plane, comprising the steps of:
- providing a multi-layer board having a connection assembly;
- providing a layer with a channel formed therein to define a perimeter of a connector area;
- bonding the layer to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board; and
- removing at least a portion of the connector area in the layer to expose the connection assembly of the multi-layer board.
2. The method of claim 1, wherein the layer is bonded to the multi-layer board so as to form a space between the layer and the connection assembly of the multi-layer board.
3. The method of claim 1, wherein the layer is bonded to a conductive layer to form a metallic foil.
4. The method of claim 3, wherein the metallic foil is a single sided copper clad laminate whereby the conductive layer is formed of copper and the layer is applied to only one side of the conductive layer of copper.
5. The method of claim 1, wherein the step of removing at least a portion of the connector area is defined further as removing the connector area by depth controlled routing along the channel.
6. The method of claim 1, wherein the multi-layer board is coated with a surface finish prior to the step of bonding the layer to the multi-layer board.
7. A method for manufacturing a mid-plane, comprising the steps of:
- providing two multi-layer boards with each having a connection assembly;
- providing first and second layers with each having a channel formed therein to define a perimeter of a connector area;
- bonding the first layer to one of the multi-layer boards and the second layer to the other one of the multi-layer boards such that the connector areas overlap the respective connection assemblys of the multi-layer boards;
- bonding the multi-layer boards together to form a rigid multilayer wherein the first layer is positioned on one side of the rigid multilayer and the second layer is positioned on an opposite side of the rigid multilayer; and
- removing at least a portion of the connector areas in the first and second layers to expose the respective connection assemblys.
8. The method of claim 7, wherein each of the layers are bonded to the multi-layer boards so as to form a space between the layer and the connection assembly of the multi-layer board.
9. The method of claim 7, wherein the layer is bonded to a conductive layer to form a metallic foil.
10. The method of claim 9, wherein the metallic foil is a single sided copper clad laminate whereby the conductive layer is formed of copper and the layer is applied to only one side of the layer of copper.
11. The method of claim 7, wherein the step of removing at least a portion of the connector areas is defined further as removing the connector areas by depth controlled routing along the channels.
12. The method of claim 7, wherein the multi-layer boards are coated with a surface finish prior to the step of bonding the layer to the multi-layer board.
13. A rigid multilayer, comprising:
- a multi-layer board having a connection assembly;
- a layer having a channel formed therein to define a perimeter of a connector area, the layer bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board.
14. The rigid multilayer of claim 13, wherein the layer has a first side in which the channel is formed and wherein the first side of the layer faces the multi-layer board.
15. The rigid multilayer of claim 13, wherein the connector area of the layer is spaced a distance from the multi-layer board.
16. The rigid multilayer of claim 13, further comprising a conductive layer extending over the layer such that the layer is positioned between the conductive layer and the multi-layer board.
Type: Application
Filed: Jul 8, 2004
Publication Date: Dec 14, 2006
Applicant: VIASYSTEMS GROUP, INC. (St. Louis, MO)
Inventor: Gerald Hermkins (Echt)
Application Number: 10/564,215
International Classification: H05K 7/06 (20060101);