Power supply with a cooling function

Abstract

A power supply with a cooling function includes a power supply case, a thermoelectric cooling module and a cold side heat dissipation member. The thermoelectric cooling module disposed at an installation surface opening on the power supply case has a cold side and a hot side. The hot side extends to the inside of the power supply case, and the cold side heat dissipation member for improving heat exchange is coupled with the cold side and extends to the outside of the power supply case.

Description

RELATED APPLICATIONS

The present application is based on, and claims priority from, Taiwan Application Serial Number 94212496, filed Jul. 22, 2005, the disclosure of which is hereby incorporated by reference herein in its entirety.

BACKGROUND

1. Field of Invention

The present invention relates to a power supply. More particularly, the present invention relates to a power supply with a cooling function.

2. Description of Related Art

Power sources of electronic apparatuses are generally transmitted from a power plant to a socket to which a power supply is connected. The power supply rectifies, transforms and filters alternating current and then provides it to apparatuses. Especially in a computer system, a power supply simultaneously provides several apparatuses with power for operation. A power supply is typically disposed near a central processing unit (CPU) in a computer in which the CPU operates independently and has no cooperation with the power supply.

The central processing unit is generally equipped with a heat dissipation apparatus such as a CPU fan for preventing devices in the computer from failure due to a high temperature caused by heat generated during operation of the CPU. The CPU fan draws air from within the computer system to cool the CPU. The cooling effectiveness depends on the temperature of the air; the lower the temperature, the better the cooling. Thus, the internal air circulated by a CPU fan, which is heated by the devices operating in the computer system and is generally much warmer than the external room temperature air, has limited effectiveness in cooling a CPU.

SUMMARY

It is therefore an objective of the present invention to provide a power supply with a cooling function to supply power and cooling simultaneously.

It is another objective of the present invention to provide a power supply with a cooling function to enhance a cooling efficiency for a CPU in a computer system.

In accordance with the foregoing and other objectives of the present invention, a power supply with a cooling function is provided. The power supply with a cooling function includes a power supply case, a thermoelectric cooling module and a cold side heat dissipation member. The thermoelectric cooling module disposed at an installation surface opening of the power supply case has a cold side facing the outside of the power supply case, and a hot side facing the inside of the power supply case. The cold side heat dissipation member coupled with the cold side extends out of the power supply case for heat exchanging with external air outside the power supply case to lower the external air temperature.

According to a preferred embodiment of the present invention, the power supply further includes a heat containment chamber having a first passage opening and a second passage opening. The power supply case further includes an outward opening coupled to the first passage opening and an inward opening coupled to the second passage opening. Also, a fan is installed between the first passage opening and the outward opening to direct heat gathered around the hot side to the outside of the case.

The power supply further integrates a temperature control module for monitoring a temperature data to adjust a fan power source so that a fan speed can be controlled appropriately, and a humidity control module for monitoring a humidity data to adjust a thermoelectric cooling module power source so that an output power of the thermoelectric cooling module can be controlled appropriately.

In conclusion, the power supply of the invention provides an extra function of lowering the temperature inside a system during operation by integrating a thermoelectric cooling module, especially for most present computer systems in which the installation location of the power supply is standardized. The present invention takes advantage of the standardized arrangement of the power supply to allow a CPU fan to draw heat exchanged air of lower temperature so that cooling efficiency for the CPU is raised.

It is to be understood that both the foregoing general description and the following detailed description are by examples and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the present invention will become better understood with regard to the following description, appended claims and accompanying drawings where:

FIG. 1A is an exploded view of a power supply in accordance with a preferred embodiment of the present invention;

FIG. 1B is a schematic plan view of a part of a power supply in accordance with a preferred embodiment of the present invention;

FIG. 2A is a block diagram of a temperature control system in accordance with another preferred embodiment of the present invention;

FIG. 2B is a block diagram of a humidity control system in accordance with another preferred embodiment of the present invention;

FIG. 3 is a schematic view of applying the power supply in a computer system;

FIG. 4A is a schematic view of a cold side heat dissipation member in accordance with another preferred embodiment of the present invention; and

FIG. 4B is a schematic view of another aspect of the cold side heat dissipation member in FIG. 4A.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention discloses a power supply with a cooling function, which not only provides power but also cools a system air. Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts:

FIG. 1A is an exploded view of a power supply in accordance with a preferred embodiment of the present invention. FIG. 1B is a schematic plan view of a part of a power supply in accordance with a preferred embodiment of the present invention.

Referring to FIG. 1A and FIG. 1B, a power supply with a cooling function includes a power supply case 100, a thermoelectric cooling module 120 and a cold side heat dissipation member 130. The power supply case 100 has an installation surface opening 106 at which the thermoelectric cooling module 120 is disposed. The thermoelectric cooling module 120 includes a hot side 124 extending into the inside of the power supply case 100 and a cold side 122 coupled with the cold side heat dissipation member 130. The cold side heat dissipation member 130 extends out of the power supply 100 for advancing heat exchange on the cold side 122.

In the embodiment, a power supply with a cooling function includes a power supply case 100, a power supply unit 110 and a heat containment chamber 140. The power supply case 100 includes a first cover 100a and a second cover 100b having a first outward opening 102a, a second outward opening 102b and an inward opening 104, wherein the second outward opening 102b has a mesh structure. The power supply unit 110 disposed in the power supply case 100 includes a supply fan 114 and a circuit module 112 on which the supply fan 114 is installed, for example, on the edge of power supply unit 110 and adjacent to or protruding from the first outward opening 102a. The power supply switch 174 determines the start of the power supply and/or supply fan 114.

The heat containment chamber 140 has a heat passage 144, a first passage opening 144a and a second passage opening 144b. The first passage opening 144a and the second passage opening 144b are on both ends of the heat containment chamber 140 respectively, and are adjacent to or protruding from the second outward opening 102b and the inward opening 104 respectively. An installation surface 108 of the first cover 100a has an installation surface opening 106 at which the thermoelectric cooling module 120 is disposed. A cold side 122 of the thermoelectric cooling module 120 is coupled with a cold side heat dissipation member 130; preferably, the cold side heat dissipation member 130 includes at least a concave structure 132 and a projection whereby cold energy is accumulated.

A hot side 124 of the thermoelectric cooling module 120 is further coupled with a hot side heatsink 136 extending into the inside of the power supply case 100. Further, a chamber sidewall 142 of the heat containment chamber 140 is coupled with a connecting sidewall 146 so that the hot side heatsink 136 is enclosed and heat is gathered in the heat passage 144, reducing or even preventing heat from spreading to the power supply unit 110. Preferably, the connecting sidewall 146 and/or the chamber sidewall 142 is made of heat insulating material. An aluminum foil 148 can be attached inside the heat containment chamber 140 for reducing heat radiation.

A first fan 150a and a second fan 150b are disposed at two openings 144a and 144b on both ends of the heat containment chamber 140, with the first fan 150a disposed at the first passage opening 144a and the second fan 150b disposed at the second passage opening 144b. The second fan 150b draws air from a computer system to the heat passage 144 and also helps forcing the air in the heat passage 144 toward the first fan 150a, and then the first fan 150a directs the air to the outside of the system.

The power supply further includes a thermoelectric cooling module switch 176 which controls the start and stop of the thermoelectric cooling module 120. The thermoelectric cooling module switch 176 is also connected to a lighting device 180 through a circuit. When the thermoelectric cooling module switch 176 is turned on, the circuit is also active and the lighting device 180 shines to suggest the actuation of the thermoelectric cooling module 120 to users.

When the power supply is installed in an electronic system, outward openings 102a and 102b face an external environment and the inward opening 104 faces the inside of the system. In a computer system, the installation surface 108 is near a CPU.

FIGS. 2A and 2B are block diagrams of a temperature control system and a humidity control system in accordance with another preferred embodiment of the present invention. The power supply further integrates a temperature control module 210a and a humidity control module 210b to constitute a temperature control system and a humidity control system. The temperature control module 210a monitors an environment temperature and controls a fan power source 230a; for example, several temperature levels can be established to correspond to different fan speeds for controlling noise from the fan 240a.

In the embodiment, the temperature control module 210a includes a temperature sensor 212a for measuring the environment temperature data and a temperature regulator 214a. As shown in FIG. 1B, the temperature sensor 170b is disposed near or on the hot side heatsink. The temperature sensor 212a transmits the temperature data to the temperature regulator 214a, and then the temperature regulator 214a adjusts a supply of power from the fan power source 230a according to the temperature data, such as by raising or lowering current or voltage to control a fan speed of the fan 240a. Specifically, the fan is the first fan 150a or the second fan 150b in FIG. 1A.

The humidity control module 210b monitors an environment humidity in the system such as a relative humidity. When the relative humidity reaches 100%, dew forms, and higher relative humidity corresponds to higher dew point temperature. Therefore, the humidity control module 210b is adapted for adjusting a supply of power from a thermoelectric cooling module power source 230b. When detecting a humidity higher than a predetermined value, the humidity control module 210b adjusts the thermoelectric cooling module power source 230b to lower an output power of the thermoelectric cooling module 240b so that the temperature in the system is prevented from reaching the dew point temperature.

In the embodiment, the humidity control module 210b includes a humidity sensor 212b and a humidity regulator 214b. The humidity sensor 212b measures the environment humidity data. Preferably, as shown in FIG. 1B, a humidity sensor 170a is disposed at a gap 160 formed by the cold side heat dissipation member 130 and the first cover 100a; for example, the humidity sensor 170a may be attached on the first cover 100a or on the cold side heat dissipation member 130, which generally renders a lower temperature by its structural uniqueness. The humidity regulator 214b receives and utilizes the environment humidity data to adjust the supply of power from the thermoelectric cooling module power source 230b so that the output power of the thermoelectric cooling module 240b can be changed appropriately.

The thermoelectric cooling module power source and the fan power source above may be powered by the power supply unit or by individual power sources, and it can be known and carried out without difficulty by those skilled in the art. Further, in the embodiment, the humidity control module and the temperature control module are integrated into a control circuit board 170 (shown in FIG. 1A).

Referring to FIG. 3, which illustrates a schematic view of applying the power supply of the present invention in a computer system. When a power supply of the present invention is installed in a computer system such as a desktop computer system, the power supply 310 is disposed at an upper part of a chassis 300 and is oriented so that a side having the cold side heat dissipation member 314 faces a CPU fan 330 (in the figure, it is above the CPU fan 330).

When the thermoelectric cooling module 312 is operating, the cold side lowers a surrounding temperature and the cold side heat dissipation member 314 advances a heat exchange with a system air 340 nearby. Therefore, the CPU fan 330 installed on a main board 320 draws the system air 340, a part of which comes from a heat-exchanged and low-temperature air surrounding the cold side, and thus the effect on cooling the CPU is improved.

FIG. 4A illustrates a schematic view of a cold side heat dissipation member in accordance with another preferred embodiment of the present invention. The cold side heat dissipation member extendedly approaching a CPU 470 includes a base 402, a connecting part 404 and a heat dissipation body 406. The base 402 is coupled with a cold side 422 of a thermoelectric cooling module 420, and the connecting part 404 is connected to the base 402. Preferably, the connecting part 404 is pivoted at the base 402 so that a rotation in a first rotation direction 412 by a tuner 408 is allowed. The heat dissipation body 406 is coupled with the connecting part 404 and is rotationally relative to the connecting part 404 in a second rotating direction 414.

Further, an end 406a of the heat dissipation body 406 forms a structure with a passing hole 430 for improving heat exchange. The cold side heat dissipation member is made of heat conductive material, and preferably, surfaces of the base 402, the connecting part 404 and a portion of the heat dissipation body 406 are coated with heat-insulated leather paint for heat insulation and cold energy dissipation occurring at the end 406a. The cold energy from the cold side 422 is transmitted through the base 402 and the connecting part 404 and eventually to the heat dissipation body 406, which is a way of distributing more cooled system air to the CPU 470 to help cool it.

FIG. 4B is a schematic view of another aspect of the cold side heat dissipation member in FIG. 4A. In accordance with the embodiment in FIG. 4A, another aspect of the cold side heat dissipation member is that the heat dissipation body 406 is coupled with a CPU heatsink 472 for the CPU 470. For example, the end 406a may be inserted in the CPU heatsink 472 so that cold energy is transmitted directly to the CPU heatsink 472 and is utilized efficiently to cool the CPU heatsink 472, which also improves the cooling of the CPU 470. The end 406a is made of heat conductive material and may be wrapped from an original type of wire for more convenient extension. Copper wires or aluminum wires may be chosen to be wrapped with a heat insulating elastic material, and a part of which are exposed to be inserted in the CPU heatsink 472.

The present invention has the following advantage. The present invention integrates a thermoelectric cooling module into a power supply and provides a function of cooling system air during the operation of a computer system so that the CPU fan draws a low temperature air to cool the CPU. Consequently, heat dissipation efficiency is raised. Through the humidity control system, dewing is prevented to better protect the system.

It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims

1. A power supply with a cooling function, comprising:

a power supply case having an installation surface opening;

a thermoelectric cooling module disposed at the installation surface opening and having a cold side and a hot side, wherein the hot side extends into the inside of the power supply case; and

a cold side heat dissipation member coupled with the cold side and extending out of the power supply case.

2. The power supply of claim 1, further comprising a hot side heatsink coupled to the hot side.

3. The power supply of claim 1, further comprising:

an outward opening on the power supply case;

an inward opening on the power supply case;

a first fan adjacent to the outward opening; and

a heat containment chamber having a first passage opening at which the first fan is disposed and a second passage opening adjacent to the inward opening.

4. The power supply of claim 3, further comprising an aluminum foil attached inside the heat containment chamber.

5. The power supply of claim 3, further comprising a second fan disposed at the second passage opening.

6. The power supply of claim 3, further comprising a temperature control module connected with a fan power source for detecting a temperature and adjusting a supply of power from the fan power source to control a fan speed.

7. The power supply of claim 1, further comprising a humidity control module connected with a thermoelectric cooling module power source for detecting a humidity and adjusting a supply of power from the thermoelectric cooling module power source to control an output power of the thermoelectric cooling module.

8. The power supply of claim 7, wherein the humidity control module comprises a humidity sensor disposed at a gap formed by the cold side heat dissipation member and the power supply case.

9. The power supply of claim 1, wherein the cold side heat dissipation member comprises a concave structure and a projection.

10. The power supply of claim 1, wherein the cold side heat dissipation member extendedly approaches a CPU.

11. The power supply of claim 1, wherein the cold side heat dissipation member comprises a base coupled with the cold side, a connecting part coupled with the base and a heat dissipation body coupled with the connecting part.

12. The power supply of claim 1, wherein a portion of the cold side heat dissipation member is inserted in a CPU heatsink.

13. A power supply with a cooling function, comprising:

a power supply case having an installation surface opening;

a power supply unit disposed inside the power supply case;

a thermoelectric cooling module disposed at the installation surface opening, powered by the power supply unit and having a cold side and a hot side, wherein the hot side extends into the inside of the power supply case;

a hot side heatsink coupled to the hot side; and

a cold side heat dissipation member coupled with the cold side and extending out of the power supply case.

14. The power supply of claim 13, further comprising a humidity control module connected with a thermoelectric cooling module power source, comprising:

a humidity sensor for detecting an environment humidity data; and

a humidity regulator receiving the environment humidity data and adjusting a supply of power from the thermoelectric cooling module power source according to the environment humidity data.

15. The power supply of claim 13, further comprising:

an outward opening on the power supply case;

an inward opening on the power supply case;

a first fan adjacent to the outward opening; and

a heat containment chamber having a first passage opening at which the first fan is disposed and a second passage opening adjacent to the inward opening.

16. A computer system, comprising:

a chassis;

a power supply case disposed inside the chassis and having an installation surface opening;

a thermoelectric cooling module disposed at the installation surface opening and having a cold side and a hot side extending to the inside of the power supply case;

a cold side heat dissipation member coupled with the cold side and extending out of the power supply case for heat exchanging with a system air; and

a CPU fan disposed under the cold side heat dissipation member and drawing the system air to cool a CPU.

17. The computer system of claim 16, further comprising a hot side heatsink coupled with the hot side.

18. The computer system of claim 16, further comprising:

an outward opening on the power supply case;

an inward opening on the power supply case;

a first fan adjacent to the outward opening; and

a heat containment chamber having a first passage opening at which the first fan is disposed and a second passage opening adjacent to the inward opening.

19. The computer system of claim 18, further comprising a temperature control module connected with a fan power source, comprising:

a temperature sensor for detecting a temperature data; and

a temperature regulator receiving the temperature data and adjusting a supply of power from the fan power source according to the temperature data.

20. The computer system of claim 16, further comprising a humidity control module connected with a thermoelectric cooling module power source, comprising:

a humidity sensor for detecting a humidity data; and

a humidity regulator receiving the humidity data and adjusting a supply of power from the thermoelectric cooling module power source according to the humidity data.