COOLING FACILITY FOR AN ELECTRONIC COMPONENT
Cooling facilities for an electronic component provide a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation. The cooling facility consists of a body defining a coolant passage including an inlet and an outlet, a pumping chamber with a variable volume changeable from a greater volume to a lesser volume in fluid communication with the inlet and the outlet, and a flow restriction facility in fluid communication with the inlet and the outlet. The flow restriction facility provides limited flow resistance to coolant flow in a first direction from the inlet to the outlet and provides increased resistance to coolant flow in the opposite direction from the outlet to the inlet. Therefore, repeated reciprocation of the pumping chamber between a greater volume and a lesser volume generates a net fluid flow from the inlet to the outlet.
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The subject application claims priority from U.S. Provisional Patent Application Ser. No. 60/957,153 entitled, APPARATUS FOR SMALL VOLUME SPOT COOLING APPLICATIONS, (Staley) filed on 21 Aug. 2007, and incorporated herein in its entirety.
FIELD OF THE INVENTIONThe present invention relates to a cooling facility for an electronic component for use in connection with moving a fluid such as water or air. The cooling facility for an electronic component has particular utility in connection with providing a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation.
BACKGROUND OF THE INVENTIONCooling facilities for an electronic component are desirable for providing a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation. Modern semiconductors tend to generate greater heat than ever when carrying out their respective functions at ever greater speeds. Failure to properly cool such electrical components can result in component malfunction, requiring thousands of dollars to be spent in their replacement and/or repair. Common cooling devices, currently used to dissipate heat from semiconductors, range from simple forced air cooling to devices utilizing liquid nitrogen as a heat transfer mechanism. Unfortunately, these devices become less practical and less common as their physical size requirements are decreased to the order of 100 mm3 (cubic millimeters).
The movement of air for the purpose of electrical component cooling can be straightforward when off-the-shelf cooling devices, such as fans, can be used. However, as the electrical components to be cooled become smaller and smaller, or as the volume of the enclosure surrounding the electrical components to be cooled decreases, one finds that off-the-shelf cooling devices become unsuitable for use because of their relatively large size. In short, practical designs for small volume cooling devices must conform to available power, required air capacity, physical volume, physical orientation, and cost limits that may preclude the use of off-the-shelf cooling devices.
What is needed is a practical apparatus and a realizable method of moving a cooling fluid, such as air or a liquid coolant, where the apparatus occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation.
The use of piezoelectric diaphragm pumps is known in the prior art. For example, a valveless diffuser pump has previously been developed and published by Anders Olsson, Peter Enoksson, Goran and Erik Stemme in Simulation Studies of Diffuser and Nozzle Elements for Valve-less Micropumps, International Conference on Solid State Sensors and Actuators, Proceedings, v2, 1997, p 1039-1042. This prior art diffuser pump is also a piezoelectric diaphragm pump in which passive check valves are replaced by diffuser elements. The diffuser is a channel in which the cross-section diverges in the diffuser direction and converges in the nozzle direction. However, this prior art piezoelectric diaphragm pump lacks the throttle valves of the current invention, has diffusers that extend well beyond the perimeter of the diaphragm, which results in a relatively large size, and operates at an excitation voltage of 145V, some 55 times higher than the maximum value of 2.6V required by the current invention. Such an operating voltage would preclude this prior art pump from consideration in many practical applications. For example, in order to avoid creating a shock hazard, a piezoelectric diaphragm pump used in an electronics application would have to operate an excitation voltage of less than 40 V. Furthermore, prior art diaphragm pumps are used in medicine delivery systems to transfer relatively large volumes of liquids and are themselves significantly larger than the current invention. Prior art diaphragm pumps have not heretofore been used to pump fluids for cooling applications or to pump gases.
Therefore, a need exists for a new and improved cooling facility for an electronic component that can be used for providing a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation. In this regard, the various embodiments of the present invention substantially fulfill at least some of these needs. In this respect, the cooling facility for an electronic component according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in doing so provides an apparatus primarily developed for the purpose of providing a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation.
SUMMARY OF THE INVENTIONThe present invention provides an improved cooling facility for an electronic component, and overcomes the above-mentioned disadvantages and drawbacks of the prior art. As such, the general purpose of the present invention, which will be described subsequently in greater detail, is to provide an improved cooling facility for an electronic component that has all the advantages of the prior art mentioned above.
To attain this, the preferred embodiment of the present invention essentially comprises a body defining a coolant passage including an inlet and an outlet, a pumping chamber with a variable volume changeable from a greater volume to a lesser volume in fluid communication with the inlet and the outlet, and a flow restriction facility in fluid communication with the inlet and the outlet. The flow restriction facility provides limited flow resistance to coolant flow in a first direction from the inlet to the outlet and provides increased resistance to coolant flow in the opposite direction from the outlet to the inlet. Therefore, repeated reciprocation of the pumping chamber between a greater volume and a lesser volume generates a net fluid flow from the inlet to the outlet. There are, of course, additional features of the invention that will be described hereinafter and which will form the subject matter of the claims attached.
There has thus been outlined, rather broadly, the more important features of the invention in order that the detailed description thereof that follows may be better understood and in order that the present contribution to the art may be better appreciated.
The same reference numerals refer to the same parts throughout the various figures.
DESCRIPTION OF THE CURRENT EMBODIMENTA preferred embodiment of the cooling facility for an electronic component of the present invention is shown and generally designated by the reference numeral 10.
The diffuser assembly 16 has a suction nozzle 20 on one end and a discharge nozzle 24 on its opposing end. Suction nozzle 20 is generally triangular in cross-section with a wide inlet opening 38 adjacent to one end of the IC package 18 that tapers to a narrower outlet opening 40. The wide inlet opening 38 of suction nozzle 20 is in fluid communication with one end of the IC package 18, which is open to atmosphere in an air-cooled embodiment and open to a supply of coolant fluid in other embodiments. The narrower outlet opening 40 of suction nozzle 20 is in fluid communication with a suction compartment 22. Suction compartment 22 is defined by a generally rectangular indentation in the top of IC package 18.
Discharge nozzle 24 is generally triangular in cross-section with a wide inlet opening 42 adjacent to suction compartment 22 that tapers to a narrower outlet opening 44. The narrower opening 44 of discharge nozzle 24 is in fluid communication with the opposing end of the IC package 18, which is opposite the wide inlet opening 38 of suction nozzle 20. The narrower opening 44 of discharge nozzle 24 serves to exhaust air to atmosphere or communicates with a coolant supply loop for cooling in another facility prior to be recycled to the illustrated assembly. Suction nozzle 20 and discharge nozzle 24 are generally triangular in cross-section in order to utilize the vena contracta principle, which effectively makes suction nozzle 20 and discharge nozzle 24 one-way valves or valves with different flow resistances in different directions for a gas or liquid flowing through them.
A compression chamber manifold element 14 is attached above the diffuser assembly 16. In the illustrated embodiment, the compression chamber manifold element 14 is a separate element attached to the IC package 18. However, in alternative embodiments, it may be formed by any of a wide range of additive or subtractive processes, including casting, etching, and sequential layering processes used to generate complex miniature shapes. The compression chamber manifold element 14 defines two holes forming suction throttle 28 and discharge throttle 26. Suction throttle 28 is positioned above and in fluid communication with suction compartment 22. Discharge throttle 26 is positioned above and in fluid communication with the wide inlet opening 42 of discharge nozzle 24. Piezoelectric bending element 12 is attached above the compression chamber manifold 14 with the piezoelectric bending element 12 completely covering suction throttle 28 and discharge throttle 26 so that the piezoelectric bending element 12 defines an enclosed chamber in which the only openings are the suction throttle 28 and discharge throttle 26 apertures.
At rest, which is depicted in
Discharge throttle 26 and suction nozzle 28 are also generally triangular or tapered in cross-section, like suction nozzle 20 and discharge nozzle 24, to provide additional opportunities for the vena contracta effect to create essentially one-way valves or valves with different flow resistances in different directions. In three dimensions, discharge throttle 26 and suction nozzle 28 are cones with opposing open ends. In the current embodiment, the compression chamber manifold element 14 and diffuser assembly 16 are manufactured from stainless steel and are each coated with a uniform nominally 0.002 inch thick layer of silicone RTV and pressed together.
When the electric potential is removed from piezoelectric bending element 12, piezoelectric bending element 12 flattens, returning to its at rest position depicted in
A compression chamber manifold element 114 is attached above the diffuser assembly 116. The compression chamber manifold element 114 defines two holes forming suction throttle 128 and discharge throttle 126. Suction throttle 128 is positioned above and in fluid communication with suction compartment 122. Discharge throttle 128 is positioned above and in fluid communication with the wide inlet opening 142 of discharge nozzle 124. Piezoelectric bending element 112 is attached above the compression chamber manifold element 114 with the piezoelectric bending element 112 completely covering suction throttle 128 and discharge throttle 126 so that the piezoelectric bending element 112 defines an enclosed chamber in which the only openings are the suction throttle 128 and discharge throttle 126 apertures. In the current embodiment, the invention is about 0.25″L×0.10″W×0.25″H, and the diffuser assembly 116 and backing plate 146 are thermally conductive. Furthermore, in the current embodiment the invention accelerates air to a velocity of at least 200 linear feet per minute, preferably more than about 500 linear feet per minute, and preferably consumes no more than about 0.25 W.
The invention also includes a method of cooling and electronic component and a method of manufacturing a cooling facility for an electronic component. The method of cooling electronic component consists of the following steps: obtaining the cooling facility for an electronic component; attaching the cooling facility for an electronic component to an electronic component to be cooled, wherein the coolant passage is in thermal communication with the electronic component; heating a fluid to a second temperature by drawing a fluid at a first temperature into a compression chamber through the inlet and the flow restriction facility by applying an electrical charge to the movable diaphragm, thereby causing the movable diaphragm to deform upwards and define the compression chamber, wherein the coolant passage and flow restriction facility are at a third temperature that is higher than the first temperature; and cooling the electronic component by expelling the fluid at a second temperature through the flow restriction facility and the outlet by removing the electrical charge from the movable diaphragm, thereby causing the movable diaphragm to spring back against the flow restriction facility and collapse the compression chamber.
The method of manufacturing a cooling facility for an electronic component consists of the following steps: obtaining a first planar layer; defining a coolant passage having an inlet and outlet in the first planar layer; obtaining a third planar layer; defining first and second apertures tapered in opposite directions in the third planar layer; affixing the third planar layer over the coolant passage such that the first aperture is in fluid communication with the inlet and the second aperture is in fluid communication with the outlet; and obtaining a movable diaphragm and affixing the movable diaphragm over the first and second apertures to form a second planar layer.
While current embodiments of the cooling facility for an electronic component have been described in detail, it should be apparent that modifications and variations thereto are possible, all of which fall within the true spirit and scope of the invention. With respect to the above description then, it is to be realized that the optimum dimensional relationships for the parts of the invention, to include variations in size, materials, shape, form, function and manner of operation, assembly and use, are deemed readily apparent and obvious to one skilled in the art, and all equivalent relationships to those illustrated in the drawings and described in the specification are intended to be encompassed by the present invention. For example, any suitable sturdy and thermally conductive material such as other types of metals or a variety of semiconductor may be used for the stainless steel diffuser assembly and backing plate described. Also, the silicone bead may also be made of any suitably flexible and heat resistant bonding material. And although providing a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation has been described, it should be appreciated that the cooling facility for an electronic component herein described is also suitable for pumping small volumes of liquids or gases in other applications requiring a microfluidic pump. Furthermore, the piezoelectric element could be replaced at smaller scales with an element employing capacitive deflection.
Therefore, the foregoing is considered as illustrative only of the principles of the invention. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the invention to the exact construction and operation shown and described, and accordingly, all suitable modifications and equivalents may be resorted to, falling within the scope of the invention.
Claims
1. A cooling facility for an electronic component, the facility comprising:
- a body defining a coolant passage, wherein the coolant passage includes an inlet and an outlet;
- a pumping chamber in fluid communication with the inlet and the outlet, wherein the pumping chamber has a variable volume changeable from a greater volume to a lesser volume; and
- a flow restriction facility in fluid communication with the inlet and the outlet, wherein the flow restriction facility is operable to provide limited flow resistance to coolant flow in a first direction from the inlet to the outlet and to provide greater resistance to coolant flow in the opposite direction from the outlet to the inlet, such that repeated reciprocation of the pumping chamber between a greater volume and a lesser volume generates a net fluid flow from the inlet to the outlet.
2. The cooling facility for an electronic component as defined in claim 1, wherein at least a portion of the coolant passage is defined in the body of an electronic component.
3. The cooling facility for an electronic component as defined in claim 1, wherein the flow restriction facility is located between the inlet and the pumping chamber.
4. The cooling facility for an electronic component as defined in claim 3, further comprising a second flow restriction facility between the pumping chamber and the outlet.
5. The cooling facility for an electronic component as defined in claim 1, wherein the inlet and the outlet are defined in a first planar layer.
6. The cooling facility for an electronic component as defined in claim 5, wherein the pumping chamber is defined in a second planar layer.
7. The cooling facility for an electronic component as defined in claim 6, wherein the flow restriction facility as defined in a third planar layer between the first and second planar layers, wherein the third planar layer defines a first aperture between the inlet and the pumping chamber and a second aperture between the pumping chamber and the outlet.
8. The cooling facility for an electronic component as defined in claim 7, wherein the first and second apertures are tapered in opposite directions.
9. The cooling facility for an electronic component as defined in claim 1, wherein the pumping chamber includes a movable diaphragm.
10. The cooling facility for an electronic component as defined in claim 9, wherein the diaphragm is piezoelectrically activated.
11. The cooling facility for an electronic component as defined in claim 1, wherein at least a portion of the flow restriction facility is overlaid by the pumping chamber.
12. The cooling facility for an electronic component as defined in claim 1, wherein the cooling facility for an electronic component is of limited size having dimensions no greater than about 0.25″ in length, 0.10″ in width, and 0.25″ in height.
13. The cooling facility for an electronic component as defined in claim 11, wherein the flow restriction facility is completely overlaid by the pumping chamber.
14. A method of cooling an electronic component comprising the steps of:
- providing the cooling facility for an electronic component as defined in claim 9;
- attaching the cooling facility to an electronic component to be cooled, wherein the coolant passage is in thermal communication with the electronic component;
- heating a fluid to a second temperature by drawing a fluid at a first temperature into a compression chamber through the inlet and the flow restriction facility by applying an electrical charge to the movable diaphragm, thereby causing the movable diaphragm to deform upwards and define the compression chamber, wherein the coolant passage and flow restriction facility are at a third temperature that is higher than the first temperature; and
- expelling the fluid at a greater second temperature through the flow restriction facility and the outlet by removing the electrical charge from the movable diaphragm, thereby causing the movable diaphragm to spring back against the flow restriction facility and collapse the compression chamber.
15. A method of manufacturing a cooling facility for an electronic component comprising the steps of:
- obtaining a first planar layer;
- defining a coolant passage having an inlet and outlet in the first planar layer;
- obtaining a third planar layer;
- defining first and second apertures tapered in opposite directions in the third planar layer;
- affixing the third planar layer over the coolant passage such that the first aperture is in fluid communication with the inlet and the second aperture is in fluid communication with the outlet; and
- obtaining a movable diaphragm and affixing the movable diaphragm over the first and second apertures to form a second planar layer.
Type: Application
Filed: Aug 13, 2008
Publication Date: Feb 26, 2009
Applicant: TEKTRONIX, INC. (Beaverton, OR)
Inventor: Thomas Staley (Portland, OR)
Application Number: 12/191,193
International Classification: F28D 15/00 (20060101); B21D 53/02 (20060101);