Abstract: A display assembly includes a structural framework, a cover forward of an electronic display layer, and an illumination device rearward of the electronic display layer. A rear passageway is provided between a rear portion of the structural framework and a rear surface of the illumination device and is in fluid communication with a front passageway between a rear surface of the cover and a forward surface of the electronic display layer and an illumination device passageway between a rear surface of the electronic display layer and a front surface of the illumination device. A closed loop fan unit adjacent to an entrance to the front passageway and the illumination device passageway creates flows of circulating gas therethrough when activated.

Abstract: This disclosure provides a series connected water cooling structure. Each water cooling head includes a housing, and the housing includes a water inlet and a water outlet. The connecting pipes are connected between the water cooling heads to be in a series manner. The connecting pipes are connected to the water inlets of adjacent water cooling heads to configure the series connected water cooling heads. The water-inlet pipe and the water-outlet pipe are connected to the water inlet and water outlet of the series connected water cooling heads respectively. The water-inlet pump and the water-outlet pump are arranged on the water-inlet pipe and the water-outlet pipe respectively. Therefore, the heat dissipation efficiency is improved.

Abstract: A vehicular heat management system for individually cooling and heating a plurality of air conditioning regions of a vehicle includes a plurality of refrigerant circulation lines configured to cool and heat the air conditioning regions individually shared by the refrigerant circulation lines. The refrigerant circulation lines are provided with one or more air conditioning units for individually cooling and heating the respective air conditioning regions, and are configured to supply a refrigerant to the corresponding air conditioning units to individually cool and heat the air conditioning regions corresponding to the air conditioning units.

Abstract: A liquid cooling device includes first cold plates, second cold plates, a water divider, a first inlet pipe, a first outlet pipe, first connection pipes, second inlet pipes, second outlet pipes, second connection pipes. The water divider has inner inlet connectors and inner outlet connectors. The first inlet pipe connects one inner inlet connector and one first cold plate. The first outlet pipe connects one inner outlet connector and another one first cold plate. The first connection pipes each connect different two of the other first cold plates. The second inlet pipes respectively connect the other inner inlet connectors and some second cold plates. The second outlet pipes respectively connect the other inner outlet connectors and some second cold plates. The second connection pipes each connect different two second cold plates.

Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to rotate based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: An electronic component heat dissipation apparatus and methods having a heat dissipation housing. The heat dissipation housing having an external wall and an internal wall defining outer chamber therebetween. The internal wall defines an internal chamber having an airflow inlet opening and an airflow outlet opening. The housing is aligned with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of heated air. The external wall has at least one external air opening configured to allow external air into the outer chamber. The internal wall has a plurality of heat dissipation nozzles. Each heat dissipation nozzle has an external air inlet opening located within the internal wall and an external air outlet opening located within the internal chamber. The diameter of the external air inlet opening is greater than the diameter of the external air outlet opening.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A surface heating device and related method includes a heater assembly having a layer of dielectric material, thermal insulation material positioned adjacent to the heater assembly, an encapsulation layer surrounding the thermal insulation material and connected to the heater assembly, and a controller configured to control power delivered to the heater assembly to activate the dielectric material to generate heat.

Abstract: A system for managing liquid leakage comprises a fluid module, which includes a supply fluid connector to receive cooling fluid from a rack manifold coupled to an external fluid source and to supply the cooling fluid to an information technology (IT) load of the server chassis, and a return fluid connector to receive cooling fluid from the IT load of the server chassis and to return the cooling fluid to the rack manifold and then to the external fluid source, forming a fluid loop, packaged with different energy storage units. When a liquid leakage is detected by a sensor in the server chassis, an electromagnetic unit coupled to the supply and return fluid connectors causes the first fluid connector to be pushed away from the rack manifold to disconnect the fluid loop on a supply side, and causes the return fluid connector to be disconnected from the rack manifold on a return side after a predetermined period of time after the supply fluid connector has been disconnected.

Abstract: A heat exchanger body includes at least a first channel wall portion, a second channel wall portion, and a third channel wall portion. A first channel for a first fluid, and a second channel for a second fluid are provided such that heat is allowed to be transferred between the first channel and the second channel via the second channel wall portion. A plurality of first support structures are arranged in the first channel and extend from the first channel wall portion to the second channel wall portion. A plurality of second support structures are arranged in the second channel and extending from the second channel wall portion to the third channel wall portion. The support structures are configured to support the second and third channel wall portions during manufacturing of the heat exchanger.

Abstract: This invention relates to a method and system of applying a fluid material to a roofing surface. By modifying a peristaltic pump-driven sprayer device, a fluid material having a viscosity of 10,000 to 40,000 centipoise at 25° C. can be effectively sprayed onto a roofing surface. Additionally, the use of a modified peristaltic pump-driven sprayer device allows for the fluid material to be applied onto the roofing surface at a faster rate than other spraying methods.

Abstract: To reduce influence of external force on a current collection tab lead and a current collection tab in a laminated cell type battery. A single film of an exterior body contacts and covers a top surface, a bottom surface, and two side surfaces of a battery perpendicular to an end surface of the battery from which a current collection tab and a current collection tab lead are provided to extend, covers the end surface of the battery from which the current collection tab and the current collection tab lead protrude, and is folded in from both short sides of the end surface such that triangular pyramid-shaped spaces are formed on both sides. A reinforcement member is arranged in and joined to each triangular pyramid-shaped space.

Abstract: A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

Abstract: A thermal storage system includes a container, a thermal exchange device, a first thermal storage material, and a second thermal storage material. The first thermal exchange device is disposed in the container. The first thermal storage material is disposed in the container and is spaced apart from the thermal exchange device. The second thermal storage material is also disposed in the container in contact with the thermal exchange device. The first and second thermal storage materials are immiscible. The second thermal storage material is less reactive with the construction material of the thermal exchange device as compared to the first thermal storage material. Optionally, a second thermal exchange device can be submerged in the second thermal storage material. The first thermal exchange device is configured to supply heat to the second thermal storage material and the second thermal exchange device facilitates extraction of heat from the second thermal storage material.

Abstract: A compressor may include first and second scrolls, and an axial biasing chamber. Spiral wraps of the scrolls mesh with each other and form compression pockets including a suction-pressure compression pocket, a discharge-pressure compression pocket, and intermediate-pressure compression pockets. The axial biasing chamber may be disposed axially between the second end plate and a component. Working fluid disposed within the axial biasing chamber may axially bias the second scroll toward the first scroll. The second end plate includes outer and inner ports. The outer port is disposed radially outward relative to the inner port. The outer port may be open to a first one of the intermediate-pressure compression pockets and in selective fluid communication with the axial biasing chamber. The inner port may be open to a second one of the intermediate-pressure compression pockets and in selective fluid communication with the axial biasing chamber.

Abstract: This disclosure details integrated thermal management systems for thermally managing electrified vehicle components. Exemplary integrated thermal management systems may include a thermal module assembly that may be integrated into a front end structure of a flexible modular platform of the electrified vehicle. The integrated thermal management systems may be controlled in a plurality of distinct thermal control modes for thermal managing various subcomponents and for addressing various vehicle auxiliary loads (e.g., passenger cabin heating loads, passenger cabin cooling loads, etc.).

Abstract: A system for collecting waste heat from computing components and delivering the collected heat for useful applications is provided. At least a first heat exchanger is provided to collect the waste heat generated by the computing components. A further heat exchanger is provided to transfer the heat collected by the first heat exchanger and deliver it for useful applications. The useful applications can include providing heat to a building (e.g., residential, commercial, agricultural building). A controller is provided to operation of the components of the heat exchangers (e.g., fans, pumps, valves) to ensure that the computing components are maintained at a suitable temperature.

Abstract: A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

Abstract: A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.

Abstract: A server includes a chassis; a base panel fixedly coupled to the chassis; a movable panel coupled to the base panel; and a locking member fixedly coupled to the movable panel. The movable panel is movable relative to the base panel in a moving direction between an unlocked position where the locking member is configured to be disengaged with a locking panel of an electronic rack, and a locked position where the locking member is configured to be engaged with the locking panel of the electronic rack.

Abstract: An energy storage system converts variable renewable electricity (VRE) to continuous heat at over 1000° C. Intermittent electrical energy heats a solid medium. Heat from the solid medium is delivered continuously on demand. An array of bricks incorporating internal radiation cavities is directly heated by thermal radiation. The cavities facilitate rapid, uniform heating via reradiation. Heat delivery via flowing gas establishes a thermocline which maintains high outlet temperature throughout discharge. Gas flows through structured pathways within the array, delivering heat which may be used for processes including calcination, hydrogen electrolysis, steam generation, and thermal power generation and cogeneration. Groups of thermal storage arrays may be controlled and operated at high temperatures without thermal runaway via deep-discharge sequencing. Forecast-based control enables continuous, year-round heat supply using current and advance information of weather and VRE availability.

Abstract: An energy storage system converts variable renewable electricity (VRE) to continuous heat at over 1000° C. Intermittent electrical energy heats a solid medium. Heat from the solid medium is delivered continuously on demand. An array of bricks incorporating internal radiation cavities is directly heated by thermal radiation. The cavities facilitate rapid, uniform heating via reradiation. Heat delivery via flowing gas establishes a thermocline which maintains high outlet temperature throughout discharge. Gas flows through structured pathways within the array, delivering heat which may be used for processes including calcination, hydrogen electrolysis, steam generation, and thermal power generation and cogeneration. Groups of thermal storage arrays may be controlled and operated at high temperatures without thermal runaway via deep-discharge sequencing. Forecast-based control enables continuous, year-round heat supply using current and advance information of weather and VRE availability.

Abstract: The present disclosure relates to an enclosure of a vapor compression system, where a component is disposed within the enclosure. The component is fluidly coupled to the vapor compression system and configured to discharge a flow of fluid. The enclosure includes a hole within a portion of the enclosure and a relief valve disposed within the hole of the enclosure, where the relief valve is configured to discharge the flow of fluid in a first direction through a passage within the relief valve. The passage extends from an interior region of the enclosure to an environment external of the enclosure. The relief valve is configured to block a second flow of fluid through the passage in a second direction, where the second direction is opposite of the first direction.

Abstract: An energy storage system converts variable renewable electricity (VRE) to continuous heat at over 1000° C. Intermittent electrical energy heats a solid medium. Heat from the solid medium is delivered continuously on demand. An array of bricks incorporating internal radiation cavities is directly heated by thermal radiation. The cavities facilitate rapid, uniform heating via reradiation. Heat delivery via flowing gas establishes a thermocline which maintains high outlet temperature throughout discharge. Gas flows through structured pathways within the array, delivering heat which may be used for processes including calcination, hydrogen electrolysis, steam generation, and thermal power generation and cogeneration. Groups of thermal storage arrays may be controlled and operated at high temperatures without thermal runaway via deep-discharge sequencing. Forecast-based control enables continuous, year-round heat supply using current and advance information of weather and VRE availability.

Abstract: An air-cooled energy storage module including a box body, a plurality of support beams, a baffle plate, a plurality of battery modules, an axial fan, and an end cover. The box body is a hollow structure including a first side plate, a second side plate, a bottom plate, and an opening formed by the first side plate, the second side plate, and the bottom plate. The axial fan is disposed on the first side plate. The plurality of support beams is disposed apart on the bottom plate longitudinally; a longitudinal direction refers to a direction along a connection line of the first side plate and the second side plate. The baffle plate is disposed on the plurality of support beams; and a space is disposed between the baffle plate and the bottom plate of the box body for air circulation.

Abstract: An electronic rack includes a condensing unit to be coupled to a first distribution manifold to circulate single-phase cooling fluid received from a first cooling fluid source. The electronic rack further includes a server chassis unit positioned underneath the condensing unit, and the server chassis unit is coupled to a second distribution manifold to receive two-phase cooling fluid from a second cooling fluid source. The second distribution manifold fills the server chassis which contains one or more electronic devices to at least partially submerged the electronics devices in the two-phase cooling fluid, wherein the two-phase cooling fluid is to extract heat from the electronic devices and to evaporate into vapor upwardly into the condensing unit, and wherein the condensing unit is to condense the vapor into a fluid phase and to return the fluid downwardly back into the server chassis unit.

Abstract: A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.

Abstract: A water production system including a radiative cooling/heating unit comprising an oscillating heat pipe (OHP) heat spreader. The radiative cooling/heating unit lowers the temperature of the OHP heat spreader below the temperature of the ambient environment. The system additionally including a first OHP heat exchanger thermally connected to the OHP heat spreader such that the first OHP heat exchanger will acquire substantially the same temperature as the OHP heat spreader, a second OHP heat exchanger thermally connected to the OHP heat spreader such that the second OHP heat exchanger will acquire substantially the same temperature as the OHP heat spreader, and a rotatable OHP water absorption bed disposed in thermal contact with the radiative cooling/heating unit such that the OHP absorption bed will acquire substantially the same temperature as the OHP heat spreader.

Abstract: A thermal management system may include: a cooling apparatus of circulating a coolant in a coolant line to cool at least one electrical component provided in the coolant line; a battery cooling apparatus of circulating the coolant to the battery module; a chiller for heat-exchanging the coolant with a refrigerant to control a temperature of the coolant; a heater that heats an interior of the vehicle using the coolant; a branch line; a chiller connection line connecting the chiller and the valve; and wherein the reservoir tank is provided in the coolant line between the radiator and the valve, and is connected to the coolant line connecting the valve and the first water pump through a supply line, and wherein a condenser included in the air conditioner is connected to the coolant line to pass the coolant circulating through the cooling apparatus.

Abstract: A heat dissipation device includes a console box, multiple casings and two flow-spilt assemblies. The casings are vertically superposed on the console box. Each casing has a heat dissipation loop. The two flow-split assemblies are disposed outside the casings. Each flow-split assembly has a water reservoir, a connecting tube communicated between the console box and the water reservoir and multiple curved tubes disposed on the water reservoir. The water reservoir is of a rod shape along a direction of the superposing of the casings. The curved tubes are arranged sequentially and spacedly along the water reservoir to communicate between the water reservoir and each casing correspondingly and connect each of the heat dissipation loops.

Abstract: Disclosed is a thermal storage solution which can operate without any internal tubing or mechanical pumping in the heat reservoir, and features a heat transfer technology based on evaporation and condensation of heat transfer fluids that will prevent hot and cold zones in the thermal storage reservoir. The main advantage is that the reservoir will have a much lower cost, have more degrees of freedom regarding the interplay between storage capacity, input and output power, and can operate without any mechanical or pressurized parts.

Abstract: Integrated systems comprising both i) heat and mass exchange systems and ii) electrolysis stacks are disclosed, together with related methods of use. The disclosed systems cool and/or dehumidify air using two streams of salt solutions as liquid desiccants.

Abstract: Example implementations relate to a leak mitigation system for a cooling system in a computing infrastructure. The leak mitigation system may include tank that is pre-pressurized, a valve unit fluidly coupled to the tank and a cooling loop, and controller operatively coupled to the valve unit. The cooling loop comprises one or more tubes to facilitate a flow of a coolant to cool one or more computing devices. The controller may detect a leak of the coolant from the cooling loop, and in response to detection of the leak of the coolant, the controller may operate the valve unit to establish a fluid coupling between the tank and the cooling loop to transfer at least a portion of the coolant away from the cooling loop.

Abstract: A temperature control system includes a fluid chiller, an air dryer, and a plurality of test stations positioned at remote locations from the fluid chiller and the air dryer. The fluid chiller is configured to generate a chilled fluid stream. The air dryer is configured to generate a dry air stream. Each local test station includes a heat exchanger and thermal control unit. The heat exchanger is configured to selectively cool the dry air stream with the chilled fluid stream to generate an output stream. The thermal control unit is configured to control distribution of the output stream to a local test site.

Abstract: An apparatus for storing organic materials includes: a body having an opening for receiving the organic materials to be stored; an outlet formed in the body through which the organic materials are unloaded from the body; and a cooling fluid circuit for circulating cooling fluid through the organic material collected by the hopper.

Abstract: A system for fabricating a semiconductor device structure includes a tool comprising a chamber and a platform within the chamber configured to receive a semiconductor device structure thereon. The tool further includes a heating and cooling system in operable communication with the platform and configured to control a temperature of the platform.

Abstract: Heat exchanger assemblies for electronic devices and related methods are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways, and a cover structure attached to the heat transfer body that encloses the open passageways, thereby forming enclosed fluid conduits. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. Related methods include forming open passageways by selectively removing material from a face of a heat transfer body. Multiple heat transfer bodies may be formed simultaneously by forming multiple groups or patterns of open passageways across a larger area of a heat transfer body material, and subsequently singulating the heat transfer body material into multiple heat transfer bodies. Cover structures as previously described may be formed on the heat transfer bodies before or after singulation.

Abstract: Solid-state thermoclines with internal baffle structures are used in place of heat exchangers in a closed thermodynamic cycle power generation or energy storage system, such as a closed Brayton cycle system. The baffles limit the conductive and/or radiative transfer of heat between a solid thermal medium within different zones defined by the baffle structures.

Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

Abstract: A liquid cooling device includes a base (1), a passive impeller (3) and a cold plate (4). The base (1) includes a division plate (11), a chamber (12) and a flow guiding pole (13). The division plate (11) divides the chamber (12) into a catchment portion and a heat exchanging portion (17). The flow guiding pole (13) communicates with both the catchment portion (16) and the heat exchanging portion (17). The passive impeller (3) is received in the chamber (12) and radially driven to rotate by the working fluid. The cold plate (4) is arranged correspondingly to the heat exchanging portion (17) and fastened to the base (1).

Abstract: A thermal management device for a vehicle includes heat medium circuits, a reserve tank, and a connector. The heat medium circulates through the heat medium circuits separately. The reserve tank is configured to separate an air bubble contained in the heat medium from the heat medium. The connector allows the reserve tank to come in communication with the heat medium circuits selectively. As such, an occurrence of the heat loss in the degassing performed in the reserve tank can be suppressed with the thermal management device for a vehicle including the heat medium circuits.

Abstract: A heat exchange component including: a pillar-shaped honeycomb structure; and a casing arranged so as to cover an outer circumferential face of the honeycomb structure. The casing includes an inner cylinder arranged so as to be fitted to the outer circumferential face of the honeycomb structure, a middle cylinder arranged so as to cover the inner cylinder, and an outer cylinder arranged so as to cover the middle cylinder such that a circumferential flow path serving as a flow path of a second fluid is formed between the inner cylinder and the outer cylinder. The circumferential flow path includes an inner circumferential flow path and an outer circumferential flow path. At least one communication hole that communicates the inner circumferential flow path and the outer circumferential flow path is formed in a portion of the middle cylinder that covers the honeycomb structure.

Abstract: A heat recovery device may include a circuit. During operation of the heat recovery device, a working medium may circulate. The circuit may include a conveyor to convey the working medium. An evaporator may be arranged downstream of the conveyor and may evaporate the working medium. An expander may be arranged downstream of the evaporator and may expand the working medium. The expander may have a shaft that may pick up a torque at the expander. A condenser may be arranged downstream of the expander and may condense the working medium. A tank may be connected to the circuit. The tank may define a volume for the working medium. An adjustor may change the volume of the tank for the working medium. A non-return valve may be arranged between the tank and the condenser, and may prevent a flow of the working medium in a direction of the condenser.

Abstract: A method of assembling a direct-contact, liquid-cooled (DL) Rack Information Handling System (RIHS) includes inserting a leak containment barrier in a node enclosure provisioned with heat-generating functional components. The method also includes attaching a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. A trough of the leak containment barrier underlays a portion of the system of conduits of an LC node and forms a drain path to a drain port of the node enclosure. The method further includes mounting the LC node insertably received in one node-receiving slot having a rear section configured for blind mating of the node inlet and outlet ports to a node-receiving liquid inlet port and a node-receiving liquid outlet port positioned to be inwardly facing to the couplings of the LC node.

Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.

Abstract: Systems and methods for air conditioning include an air conditioning matrix, a cooling fluid reservoir having a plurality of holes, and a pocket configured to receive the cooling fluid reservoir. The cooling fluid reservoir is configured to deliver a cooling fluid to the air conditioning matrix. The air conditioning matrix is coupled to the pocket. The air conditioning matrix is configured to adsorb and retain the cooling fluid seeped from the plurality of holes of the cooling fluid reservoir. In some embodiments, the air conditioning system provides one or more of cooling, air filtering, and/or sound reduction for an information handling system. In some embodiments, the air conditioning matrix includes an adsorbent coolant strip matrix and a supporting material. In some embodiments, the systems and methods further include a cooling fluid collector. The cooling fluid collector is configured to collect excess cooling fluid from the air conditioning matrix.

Abstract: A gel electrophoresis apparatus for single cell gel electrophoresis, including a chamber for receiving a gel electrophoresis buffer, a functional cover for closing the chamber, at least one pair of electrodes for generating a homogeneous electric field in the chamber and at least one retaining element for receiving and positioning at least one support plate. The at least one retaining element positions the at least one support plate in the homogeneous electric field generated by the at least one pair of electrodes.

Abstract: A central distribution unit (CDU) for circulating coolant is disclosed. The CDU may operate under negative pressure and can have a number of operation modes including: normal operation, pump priming, fill, drain, purge and vacuum test. The CDU includes various valves, pumps and sensors, the placement and actuation of which transitions the CDU into the various modes.

Abstract: A nuclear reactor in one embodiment includes a cylindrical body having an internal cavity, a nuclear fuel core, and a shroud disposed in the cavity. The shroud comprises an inner shell, an outer shell, and a plurality of intermediate shells disposed between the inner and outer shells. Pluralities of annular cavities are formed between the inner and outer shells which are filled with primary coolant such as demineralized water. The coolant-filled annular cavities may be sealed at the top and bottom and provide an insulating effect to the shroud. In one embodiment, the shroud may comprise a plurality of vertically-stacked self-supported shroud segments which are coupled together.