HEAT-CONDUCTING ASSEMBLY

Abstract

A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat-conducting assembly, and in particular to a heat-conducting assembly that is applicable to electronic products.

2. Description of Prior Art

With the development of science and technology, electronic products and electronic elements are made more and more compact with a light weight. Accordingly, heat dissipation of an electronic product or electronic element becomes an important issue. Insufficient heat dissipation not only affects the operation of the electronic product or the electronic element, but also affects its lifetime. Thus, it is an important issue for those skilled in this field to improve the heat dissipation.

A common electronic product, such as an industrial computer, is provided therein with a heat-generating element, a heat-dissipating plate and a heat-conducting assembly. The heat-conducting assembly is located between the heat-generating element and the heat-dissipating plate. The bottom surface of the heat-conducting assembly abuts the heat-generating element, and its top surface abuts the heat-dissipating plate. Via this arrangement, the heat generated by the heat-generating element can be conducted to the heat-dissipating plate for subsequent heat dissipation. Since the industrial computers can be designed into various standards, the pitch between the heat-generating element and the heat-dissipating plate will be different (or the pitch between the heat-generating element and the heat-dissipating element will be changed due to design tolerances among various standards). Thus, it is necessary to design various heat-conducting assemblies for the respective standards.

The heat-conducting assembly is constituted of a heat-conducting block made of copper or aluminum. After the heat-conducting block is made into a final product based on the desired pitch between the heat-generating element and the heat-dissipating plate, this heat-conducting block cannot be applied to other kinds of industrial computers in which the pitch between the heat-generating element and the heat-dissipating plate is different. However, in manufacturing, a slight tolerance may be inevitably generated between individual electronic products. Thus, the heat-conducting block cannot be adjusted finely to compensate for the slight tolerance of pitch. As a result, if the heat-conducting block is larger than the pitch, it cannot be used. On the other hand, if the heat-conducting block is smaller than the pitch, gaps will be generated so as to affect the heat-conducting effect.

In view of the above, the present Inventor proposes a reasonable and novel structure based on delicate researches and expert principles.

SUMMARY OF THE INVENTION

The present invention is to provide a heat-conducting assembly. With a first heat-conducting block, a second heat-conducting block and an elastic element, the total height of the first and second heat-conducting blocks can be adjusted freely between a heat-generating element and a heat-dissipating plate, so that the first and second heat-conducting blocks can abut tightly the heat-generating element and the heat-dissipating plate respectively. Via this arrangement, the heat generated by the heat-generating element can be conducted to the heat-dissipating plate efficiently, thereby increasing the heat-conducting efficiency of the heat-conducting assembly.

The present invention is to provide a heat-conducting assembly mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly is constituted of a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove.

Furthermore, the present invention is to provide a heat-conducting assembly mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly is constituted of a base, a first heat-conducting block, a second heat-conducting block, a fixing element and an elastic body. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing hole penetrating the first slope. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a restricting groove corresponding to the fixing hole. The second slope is slidingly disposed on the first slope. The fixing element penetrates the restricting groove and the fixing hole to be fixed onto the first heat-conducting block. The elastic body has an abutting end and a compressed end formed on the other end of the abutting end. The abutting end abuts in the restricting groove, and the compressed end is fixed on the fixing element.

Therefore, via the heat-conducting assembly of the present invention, the poor contact of the heat-conducting block in prior art caused by the tolerance of pitch between the heat-generating element and the heat-dissipating plate and in turn the deterioration of heat-conducting efficiency of the heat-conducting block can be avoided. Thus, the present invention indeed improves the heat-conducting efficiency and has industrial applicability.

BRIEF DESCRIPTION OF DRAWING

FIG. 1 is an exploded perspective view of the present invention;

FIG. 2 is an assembled perspective view of the present invention;

FIG. 3 is a schematic view (I) showing an operating state of the present invention;

FIG. 4 is a schematic view (II) showing an operating state of the present invention;

FIG. 5 is a schematic view (III) showing an operating state of the present invention;

FIG. 6 is a view showing the second embodiment of the present invention;

FIG. 7 is a view showing the third embodiment of the present invention;

FIG. 8 is a schematic view (I) showing an operating state of FIG. 7; and

FIG. 9 is a schematic view (II) showing an operating state of FIG. 7.

DETAILED DESCRIPTION OF THE INVENTION

The characteristics and technical contents of the present invention will be explained in detail with reference to the following preferred embodiments and the accompanying drawings. However, it should be noted that the drawings are illustrative only but not to limit the scope of the present invention.

First Embodiment

Please refer to FIGS. 1, 2 and 5. The heat-conducting assembly of the present invention is mounted in an electronic product 70. The electronic product 70 comprises a frame 71, a heat-conducting plate 72 located above the frame 71, a motherboard 73 provided on the frame 71, and a heat-generating element 74 located on the motherboard 73. The heat-conducting assembly is constituted of a base 10, a first heat-conducting block 20, a second heat-conducting block 30, and an elastic element 40.

The base 10 is attached on the heat-generating element 74. The base 10 comprises a plurality of through-holes 11 for allowing a plurality of positioning pieces 12 to pass through respectively. The positioning piece 12 may be a pin or bolt. The base 10 can be formed into an L shape. The base 10 can be formed differently based on the number and positions of the heat-generating elements 74, so that the base 10 can be applied to conduct the heat of a plurality of heat-generating elements 74. In this way, the heat conduction can be performed to conform to the economic benefits.

The first heat-conducting block 20 is provided on the base 10. The first heat-conducting block 20 can be formed integrally with the base 10. Alternatively, the first heat-conducting block 20 and the base 10 can be formed separately and then both members are assembled together. The first heat-conducting block 20 has a first slope 21 and a fixing groove 22 located on one side of the first slope 21. The angle between the first slope 21 and the base 10 is in a range from 0 to 90 degrees. In the present embodiment, the angle between the first slope 21 and the base 10 is preferably 45 degrees, so that the first heat-conducting block 20 of the same volume can have a larger area of first slope 21 to increase the area for heat conduction. The first heat-conducting block 20 is a trapezoid or triangular body. The cross section of the fixing groove 22 is formed into a U shape.

The second heat-conducting block 30 abuts on the heat-dissipating plate 72. The second heat-conducting block 30 has a second slope 31 and a locking groove 32 located on one side of the second slope 31. The second slope 31 is slidingly disposed on the first slope 21, so that the first heat-conducting block 20 and the second heat-conducting block 30 can slide with respect to each other to generate a vertical relative displacement. The second heat-conducting block 30 is also a trapezoid body or triangular body. The cross section of the locking groove 32 is formed into a U shape or circular.

The elastic element 40 has a fixed end 41 and buckling ends 42 formed on both ends of the fixed end 41. The fixed end 41 is fixed into the fixing groove 22. The buckling ends 42 are buckled into the locking groove 32. The elastic element 40 may be an elastic piece.

It should be understood that the electronic product 70 is an industrial computer, desktop computer, notebook computer or server. The heat-generating element 74 is a CPU, semiconductor packaging, chip or other electronic elements that generate high heat. Furthermore, the heat-dissipating plate 72 may be a heat-dissipating fin, heat pipe, metallic casing or the combination of the heat pipe and the heat-dissipating fins via the metallic casing.

Please refer to FIGS. 3 to 5. When the heat-conducting assembly of the present invention is to be mounted in an electronic product 70, the base 10 fixed with the first heat-conducting block 20 is attached to the heat-generating element 74. With the positioning pieces 12 passing through the through-holes 11 and a plurality of holes 75 located on the motherboard 73, the base 10 can be fixed on the motherboard 73. At this time, the buckling ends 42 of the elastic element 40 are buckled in the locking groove 32, so that the first and second slopes 21, 31 of the first and second heat-conducting blocks 20, 30 contact with each other. In this way, the fixed end 41 of the elastic element 40 is received in the fixing groove 22 with the second heat-conducting block 30 being disposed on the first heat-conducting block 20. At this time, if an abutting portion 33 on the second heat-conducting block 30 is pressed, the second heat-conducting block 30 can slide on the first heat-conducting block 20 to generate a vertical relative displacement, thereby increasing or reducing the distance between the abutting portion 33 and the base 10. Finally, the heat-dissipating plate 72 is combined on the frame 71 with the heat-dissipating plate 71 tightly abuts the abutting portion 33 of the second heat-conducting block 30.

Therefore, via the first heat-conducting block 20, the second heat-conducting block 30 and the elastic element 40, the total height of the first and second heat-conducting blocks 20, 30 can be adjusted freely between the heat-generating element 74 and the heat-dissipating plate 72, while the first and second heat-conducting blocks 20, 30 can abut tightly onto the heat-generating element 74 and the heat-dissipating plate 72 respectively. In this way, the heat generated by the heat-generating element 74 can be conducted to the heat-dissipating plate 72 efficiently, thereby increasing the heat-conducting efficiency of the heat-conducting assembly of the present invention.

Second Embodiment

Please refer to FIG. 6. The difference between the present embodiment and the first embodiment lies in that the elastic element 40 is a torsion spring 43 for providing a larger elastic force. Via this arrangement, the heat-conducting assembly of the present invention can abut tightly between the heat-generating element 74 and the heat-dissipating plate 72 to conduct the heat generated by the heat-generating element 74 to the heat-dissipating plate 72.

Third Embodiment

Please refer to FIG. 7. The heat-conducting assembly of the present invention is mounted between a heat-generating element 74 and a heat-dissipating plate 72. The heat-conducting assembly is constituted of a base 10, a first heat-conducting block 20, a second heat-conducting block 30, a fixing element 50 and an elastic body 60.

The base 10 is attached on the heat-generating element 74. The base 10 comprises a plurality of through-holes 11 for allowing a plurality of positioning pieces 12 to pass through respectively.

The first heat-conducting block 20 is disposed on the base 10. The first heat-conducting block 20 can be formed integrally with the base 10. Alternatively, the first heat-conducting block 20 and the base 10 can be formed separately and then both members are assembled together. The first heat-conducting block 20 has a first slope 21 and a fixing hole 24 penetrating the first slope 21. The fixing hole 24 is a screw hole.

The second heat-conducting block 30 abuts on the heat-dissipating plate 72. The second heat-conducting block 30 has a second slope 31, a through groove 34 penetrating the second slope 31 and provided to correspond to the fixing hole 24, and a restricting groove 35 penetrating one side surface of the second heat-conducting block 30 and provided to correspond to the through groove 34 and the fixing hole 24. The second slope 31 is slidingly disposed on the first slope 21. The shape of each the restricting groove 35 and the through groove 34 can be elongate.

The fixing element 50 passes through the restricting groove 35 and the fixing hole 24 and is fixed to the first heat-conducting block 20. The fixing element 50 is a bolt.

The elastic body 60 has an abutting end 61 and a compressed end 62 formed on the other end of the abutting end 61. The abutting end 61 abuts in the restricting groove 35, and the compressed end 62 is fixed to the fixing element 50. The elastic body 60 is a compression spring.

Please refer to FIGS. 8 and 9. When the present invention is in use, the first and second slopes 21, 31 of the first and second heat-conducting blocks 20, 30 are brought into contact with each other. Then, the sliding displacement of the first heat-conducting block 20 on the second heat-conducting block 30 can be adjusted, so that the fixing hole 24 on the first heat-conducting block 20 can correspond to the through groove 34 and the restricting groove 35 of the second heat-conducting block 30. Then, the elastic body 60 is put on the fixing element 50. The fixing element 50 with the elastic body 60 put thereon is locked into the fixing hole 24 via the restricting groove 35 and the through groove 34, so that the second heat-conducting block 30 can be disposed on the first heat-conducting block 20. By means of the elastic force provided by the elastic body 60, the second heat-conducting block 30 subjected to the elastic force can be adjusted to slide vertically on the first heat-conducting block 20. Therefore, the present embodiment can achieve the same effect as that of the previous embodiments.

According to the above, the present invention can improve the heat-conducting efficiency and solve the drawbacks of prior art. Therefore, the present invention really has industrial applicability.

Claims

1. A heat-conducting assembly, comprising:

a base;

a first heat-conducting block disposed on the base, the first heat-conducting block having a first slope and a fixing groove;

a second heat-conducting block having a second slope and a locking groove, the second slope being slidingly disposed on the first slope; and

an elastic element having a fixed end and a buckling end formed on one side of the fixed end, the fixed end being fixed into the fixing groove, and the buckling end being buckled in the locking groove.

2. The heat-conducting assembly according to claim 1, wherein the base is attached on a heat-generating element.

3. The heat-conducting assembly according to claim 2, wherein the heat-generating element is a central processor or a chip.

4. The heat-conducting assembly according to claim 1, wherein the base comprises a plurality of through-holes for allowing a positioning piece to pass through.

5. The heat-conducting assembly according to claim 1, wherein the base is formed into an L shape.

6. The heat-conducting assembly according to claim 1, wherein the first heat-conducting block is a trapezoid body.

7. The heat-conducting assembly according to claim 1, wherein the cross section of the fixing groove is formed in U-shaped or circular.

8. The heat-conducting assembly according to claim 1, wherein the second heat-conducting block abuts on a heat-dissipating plate.

9. The heat-conducting assembly according to claim 8, wherein the heat-dissipating plate includes a heat-dissipating fin, a heat pipe or a metallic casing.

10. The heat-conducting assembly according to claim 1, wherein the second heat-conducting block is a trapezoid body.

11. The heat-conducting assembly according to claim 1, wherein a cross section of the locking groove is formed in U-shaped or circular.

12. The heat-conducting assembly according to claim 1, wherein the elastic element is a torsion spring.

13. A heat-conducting assembly, comprising:

a base;

a first heat-conducting block disposed on the base, the first heat-conducting block having a first slope and a fixing hole penetrating the first slope;

a second heat-conducting block having a second slope and a restricting groove corresponding to the fixing hole, the second slope being slidingly disposed on the first slope; and

a fixing element penetrating the restricting groove and the fixing hole to be fixed on the first heat-conducting block; and

an elastic body having an abutting end and a compressed end formed on the other end of the abutting end, the abutting end abutting in the restricting groove, and the compressed end being fixed on the fixing element.

14. The heat-conducting assembly according to claim 13, wherein the base is attached on a heat-generating element.

15. The heat-conducting assembly according to claim 14, wherein the heat-generating element is a central processor or a chip.

16. The heat-conducting assembly according to claim 13, wherein the base comprises a plurality of through-holes for allowing a positioning piece to pass through respectively.

17. The heat-conducting assembly according to claim 13, wherein the base is formed into an L shape.

18. The heat-conducting assembly according to claim 13, wherein the first heat-conducting block is a trapezoid body.

19. The heat-conducting assembly according to claim 13, wherein the fixing hole is a screw hole.

20. The heat-conducting assembly according to claim 13, wherein the second heat-conducting block abuts on a heat-dissipating plate.

21. The heat-conducting assembly according to claim 20, wherein the heat-dissipating plate includes a heat-dissipating fin, a heat pipe or a metallic casing.

22. The heat-conducting assembly according to claim 13, wherein the second heat-conducting block is a trapezoid body.

23. The heat-conducting assembly according to claim 13, wherein the restricting groove is an elongate groove.

24. The heat-conducting assembly according to claim 13, wherein the second heat-conducting block further has a through groove, the through groove is provided to correspond to the restricting groove and the fixing hole.

25. The heat-conducting assembly according to claim 24, wherein the through groove is elongate.

26. The heat-conducting assembly according to claim 13, wherein the fixing element is a bolt.

27. The heat-conducting assembly according to claim 13, wherein the elastic body is a compression spring.