HEAT SINK

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A heat sink for dissipating heat of a heat-generating element on a circuit board includes a base, a linear fastener and a heat-dissipating fin set. The linear fastener includes a fixing section disposed on the base and an engaging section extending from the fixing section. The engaging section extends out of the base to be fixed on the circuit board. The heat-dissipation fin set is combined on the base and has stamped fins. The bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The fixing section is disposed in the receiving means and clamped between the heat-dissipation fin set and the base. The linear fastener is used to combine the heat-dissipating fin set on the circuit board to increase the heat-dissipating efficiency of the heat sink to the heat-generating element.

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Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat sink, and in particular to a heat sink having a linear fastener.

2. Description of Prior Art

With the rapid advancement of science and technology, the function and performance of modern electronic products are improved greatly. Accordingly, the heat generated by the electronic elements in such a modern electronic product is increased to a greater extent. Thus, a heat sink is provided for dissipating the heat generated by the electronic elements, thereby controlling the working temperature of the electronic element and maintaining its normal operation.

Traditionally, the connection between a heat sink and an electronic element is achieved by a fastener. The fastener is used to maintain good heat conduction between the heat sink and the electronic element. Among the fasteners, linear fastener has a simple structure for easy installation. In use, a groove is provided on the heat sink. Then, the linear fastener having a hook is tightly fitted in the groove. Since the linear fastener is formed by bending a metal wire, the inherent elasticity of the metal wire allows the linear fastener to generate an elastic deformation, so that the hook of the linear fastener can be hooked to a circuit board of the electronic element. In this way, the heat sink can be tightly connected onto the electronic element.

The conventional linear fastener is often applied to an aluminum-extruded heat sink. Taiwan Patent Publication No. M379978 discloses a heat-dissipating module, in which heat-dissipating fins are integrally formed on a heat-dissipating plate. A groove is provided on the heat-dissipating plate and the linear fastener is fitted into the groove. In this way, the heat sink can be fixed onto the electronic element in an easy and convenient manner.

However, the increase in the heat generated by the electronic element requires the heat sink to have a higher heat-dissipating efficiency. Thus, another kind of heat sink having stamped fins is gradually used to replace the traditional aluminum-extruded heat sink. FIG. 1 shows a conventional heat sink having stamped fins. The heat sink 100 comprises a plurality of stamped fins 101 arranged in parallel to each other. These stamped fins 101 are engaged with each other and then combined with the heat-dissipating plate 102. Since the heat sink having stamped fins possesses a larger heat-dissipating area, it exhibits a higher heat-dissipating efficiency and thus is widely used in various heat sinks.

However, unlike the aluminum-extruded heat-dissipating fins, the stamped fins are not integrally formed on the heat-dissipating plate. Thus, without changing the design of electronic elements and the circuit board, it is an important issue to combine the linear fastener with the heat sink having stamped fins, and to combine the heat sink 100 with a heat-generating element. Further, when the heat-dissipating plate is combined with heat pipes, the heat-dissipating plate has to be further provided with a plurality of troughs for allowing the heat pipes to be combined therein. Thus, if the heat-dissipating plate is provided with grooves for allowing the linear fastener to be disposed therein, the strength of the heat-dissipating plate may be insufficient.

In view of the above, the present Inventor proposes a reasonable and practicable structure to solve the above-mentioned problems based on his expert knowledge and deliberate researches.

SUMMARY OF THE INVENTION

The present invention is to provide a heat sink, in which a linear fastener is used to combine heat-dissipating fins with the circuit board to enhance the heat-dissipating efficiency of the heat sink to a heat-generating element.

The present invention provides a heat sink, configured for heat dissipation of a heat-generating element on a circuit board and including a base, a pair of linear fasteners and a heat-dissipating fin set. Each of the linear fasteners comprises a fixing section and an engaging section bent to extend from the fixing section. The fixing section is disposed on the base. The engaging section extends out of the base to be fixed onto the circuit board. The heat-dissipating fin set is combined on the base and constituted of a plurality of stamped fins engaged with each other. The bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The fixing section is disposed in the receiving means and clamped between the heat-dissipating fin set and the base.

In another aspect, the present invention provides a heat sink, configured for heat dissipation of a heat-generating element on a circuit board and including a base, linear fasteners and a heat-dissipating fin set. Each of the linear fasteners comprises a fixing section and an engaging section bent to extend from the fixing section. The fixing section is located on the base. The engaging section extends out of the base to be fixed onto the circuit board. The heat-dissipating fin set is combined on the base and constituted of a plurality of stamped fins engaged with each other. The bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The fixing section is disposed in the receiving means and clamped between the heat-dissipating fin set and the base.

The present invention is to provide a heat sink, in which a linear fastener is used to combine the heat-dissipating fin set on the circuit board, thereby maintaining the strength of the base of the heat sink.

In comparison with prior art, the present invention has advantageous features as follows. The heat-dissipating fin set is constituted of a plurality of stamped fins and is separated from the base. In order to combine the base and the heat-dissipating fin set with the heat-generating element by means of the linear fastener, the bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The receiving means is used to position the fixing section. Further, it is unnecessary to provide a groove on the base for allowing the linear fastener to be fixed therein. If heat pipes are to be combined on the base, only troughs are provided on the base for receiving the heat pipes. Thus, the strength of the base can be kept sufficiently. Without changing the design of the electronic elements of the circuit board, the heat-dissipating fin set having stamped fins according to the present invention can be used to replace the conventional aluminum-extruded heat sink directly, thereby improving the heat-dissipating efficiency of the heat sink to the heat-generating element. Therefore, the practicability of the present invention is increased greatly.

BRIEF DESCRIPTION OF DRAWING

FIG. 1 shows a conventional heat sink having stamped fins;

FIG. 2 is an exploded perspective view showing the heat sink of the present invention;

FIG. 3 is a perspective view showing the external appearance of the heat sink of the present invention;

FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with a heat-generating element;

FIG. 5 is an assembled perspective view showing that the heat sink of the present invention is combined with the heat-generating element;

FIG. 6 is a cross-sectional view showing that the heat sink of the present invention is combined with the heat-generating element;

FIG. 7 is a schematic view showing another embodiment of the heat sink of the present invention; and

FIG. 8 is a schematic view showing a further embodiment of the heat sink of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The detailed description and technical contents of the present invention will become apparent with the following detailed description accompanied with related drawings. It is noteworthy to point out that the drawings is provided for the illustration purpose only, but not intended for limiting the scope of the present invention.

FIG. 2 is an exploded perspective view showing the heat sink of the present invention, and FIG. 3 is a schematic view showing the external appearance of the heat sink of the present invention. The heat sink 1 of the present invention includes a base 10, a pair of linear fasteners 20, 20′, and a heat-dissipating fin set 30.

The base 10 is a metallic plate having good heat conductivity. In practice, the base 10 is provided with troughs for allowing heat pipes to be disposed therein.

The pair of linear fasteners 20, 20′ are arranged symmetrically and each has the same structure. In the following, the linear fastener 20 is described as an example. The linear fastener 20 is made by bending a metal wire. The linear fastener 20 comprises a fixing section 21 and an engaging section 22 bent to extend from the fixing section 21. The fixing section 21 is located on the base 10. The engaging section 22 extends out of the base 10. In the present embodiment, the linear fastener 20 comprises a fixing section 21 and two engaging sections 22 bent to extend from both ends of the fixing section 21 toward the same direction. Each engaging section 22 comprises a locking arm 221 and a hook 222 formed on the distal end of the locking arm 221. The locking arm 221 extends upwardly and obliquely from a connecting portion 212 of the fixing section 21. The hook 222 is bent toward the inner side of the linear fastener 20. Similarly, another linear fastener 20′ comprises a fixing section 21′ and two engaging sections 22′.

The heat-dissipating fin set 30 is combined on the base 10 and constituted of a plurality of stamped fins 31 engaged with each other. Each of the stamped fins 31 has an abutting piece 311 adhered to the base 10 and a plurality of engaging pieces 312 engaged with each other. The abutting pieces 311 of adjacent two stamped fins 31 abut against each other to form a heat-dissipating channel 310 therebetween. Further, the bottom of a portion of the stamped fins 31 is provided with a receiving means 313 respectively at a position corresponding to the fixing sections 21, 21′. The fixing sections 21, 21′ are located in the receiving means 313 and clamped between the heat-dissipating fin set 30 and the base 10.

Taking the linear fastener 20 as an example again, the structural relationship between the receiving means 313 will be described in detail. The fixing section 21 comprises a pressing portion 211 and two connecting portions 212 extending from both ends of the pressing portion 211 in opposite directions. The pressing portion 211 is located between the engaging pieces 312. The two connecting portions 212 extend out of the engaging pieces 312.

The pressing portion 211 comprises a longitudinal rod 2111 substantially perpendicular to the pressing piece 311. The receiving means 313 is a groove 313′. The longitudinal rod 2111 is disposed in the groove 313′ to abut against the bottom of the groove 313′. In the present embodiment, the pressing portion 211 further comprises two transverse rods 2112 substantially parallel to the pressing piece 311. At this time, the receiving means 313 is a hollowed trough 313″. The two transverse rods 2112 are located in the hollowed trough 313″. Similarly, the fixing section 21′ of the other linear fastener 20′ is located in the receiving means 313 in the same manner.

In the present embodiment, the pair of linear fasteners 20, 20′ are arranged to abut with each other. The heat-dissipating fin set 30 is divided into a first heat-dissipating fin set 30′ and a second heat-dissipating fin set 30″. The two linear fasteners 20, 20′ are disposed on the bottom of the first heat-dissipating fin set 30′ and the second heat-dissipating fin set 30″. The two connecting portions 212, 212′ are disposed in gaps between the first heat-dissipating fin set 30′ and the second heat-dissipating fin set 30″, thereby eliminating the provision of the hollowed trough 313″ and thus increasing the stability after the first heat-dissipating fin set 30′ and the second heat-dissipating fin set 30″ are assembled with each other.

In assembling the heat sink 1, the two linear fasteners 20, 20′ are disposed in the receiving means 313 of the first heat-dissipating fin set 30′ and the second heat-dissipating fin set 30″.

Then, the first heat-dissipating fin set 30′ and the second heat-dissipating fin set 30″ are fixed onto the base 10 by means of a welding process or the like. In this way, the two linear fasteners 20, 20′ can be firmly clamped between the first heat-dissipating fin set 30′, the second heat-dissipating fin set 30″ and the base 10.

FIG. 4 is a schematic view showing that the heat sink of the present invention is to be combined with the heat-generating element. FIG. 5 is a perspective view showing that the heat sink of the present invention is combined with the heat-generating element. FIG. 6 is a cross-sectional view showing that the heat sink of the present invention is combined with the heat-generating element. The heat sink 1 of the present invention is configured for heat dissipation of a heat-generating element 2 on a circuit board 3. The circuit board 3 is provided a plurality of locking rings 4 near the heat-generating element 2.

In use, the heat sink 1 having the linear fasteners 20, 20′ is disposed on the heat-generating element 2. Then, the locking arm 221 of the linear fastener 20 is subjected to a force, so that the engaging section 22 can be fixed on the circuit board 3. In the present embodiment, the hook 222 of the linear fastener 20 is hooked into the locking ring 4 of the circuit board 3. The two linear fasteners 20, 20′ are hooked on two opposite sides of the circuit board, so that the base 10 and the heat-dissipation fin set 30 can be firmly combined onto the circuit board 3 and the base 10 can be tightly adhered to the electronic element 2.

Please refer to FIG. 7, which shows another embodiment of the heat sink of the present invention and the use thereof. In the present embodiment, the heat sink la includes a base 10a, a plurality of linear fasteners 20a, and a heat-dissipation fin set 30a.

The linear fastener 20a comprises a fixing section 21a and an engaging section 22a bent to extend from the fixing section 21a. The fixing section 21a is disposed on the base 10a. The engaging section 22a extends out of the base 10a. The heat-dissipating fin set 30a is combined on the base 10a. Each of the stamped fins 31a has an abutting piece 311a adhered to the base 10a and a plurality of engaging pieces 312a engaged with each other.

The difference between the present embodiment and the first embodiment lies in that: the fixing section 21a is formed into an L shape and comprises a pressing portion 211a and a connecting portion 212a extending from one end of the pressing portion 211a. The pressing portion 211a is located between the engaging pieces 312a. The connecting portion 212a extends out of the engaging pieces 312a. The pressing portion 211a is a longitudinal rod. Thus, the bottom of a portion of the stamped fins 31a is provided with a receiving means 313a at a position corresponding to the pressing portion 211a. The receiving means 313a is a groove. The pressing portion 211a is disposed in the receiving means 313a.

It should be noted that, these linear fasteners 20a are arranged symmetrically between the base 10a and the heat-dissipating fin set 30a. The pressing portion 211a does not have a transverse rod. Thus, the bottom (abutting pieces 311a) of the stamped fins 31a is not provided with a hollowed trough.

Please refer to FIG. 8, which shows another embodiment of the heat sink of the present invention. In the present embodiment, the heat sink 1b includes a base 10b, a linear fastener 20b, and a heat-dissipation fin set 30b. The linear fastener 20b comprises a fixing section 21b and an engaging section 22b bent to extend from the fixing section 21b

The difference between the present embodiment and the first embodiment lies in that: the fixing section 21b is substantially formed into a N shape and comprises a pressing portion 211b and two connecting portions 212b extending from the pressing portion 211b in opposite directions. The receiving means 313b of the heat-dissipating fin set 30b is provided with a groove 313b′ at a position corresponding to the pressing portion 211b. The pressing portion 211b is disposed in the grooves 313b′ to abut against the bottom of the grooves 313b′. Further, the receiving means 313b is provided with a hollowed trough 313b″ at a position corresponding to the two connecting portions 212b. The two connecting portions 212b are disposed in the hollowed trough 313b″.

Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

1. A heat sink, configured for heat dissipation of a heat-generating element on a circuit board and including:

a base;
a pair of linear fasteners each comprising a fixing section and an engaging section bent to extend from the fixing section, the fixing sections being disposed on the base, the engaging sections extending out of the base to be fixed on the circuit board; and
a heat-dissipation fin set, combined on the base and having a plurality of stamped fins engaged with each other, the bottom of a portion of the stamped fins being provided with a receiving means at a position corresponding to the fixing sections, the fixing sections being disposed in the receiving means and clamped between the heat-dissipation fin set and the base.

2. The heat sink according to claim 1, wherein each of the stamped fins has an abutting piece adhered to the base and a plurality of engaging pieces engaged with each other, and the abutting pieces of adjacent two stamped fins abut against each other to form a heat-dissipating channel there between.

3. The heat sink according to claim 2, wherein the linear fastener comprises two engaging sections, and the two engaging sections are bent to extend from both ends of the fixing sections toward the same direction.

4. The heat sink according to claim 3, wherein the fixing section comprises a pressing portion and two connecting portions extending from both ends of the pressing portion in opposite directions, the pressing portion is located between the engaging pieces, and the two connecting portions extend out of the engaging pieces.

5. The heat sink according to claim 2, wherein the fixing section is formed into an L shape and comprises a pressing portion and a connecting portion extending from one end of the pressing portion, the pressing portion is located between the engaging pieces, and the connecting portion extends out of the engaging pieces.

6. The heat sink according to claim 4, wherein the receiving means is a groove, the pressing portion comprises a longitudinal rod substantially perpendicular to the abutting piece, and the longitudinal rod is disposed in the groove to abut against the bottom of the groove.

7. The heat sink according to claim 5, wherein the receiving means is a groove, the pressing portion comprises a longitudinal rod substantially perpendicular to the abutting piece, and the longitudinal rod is disposed in the groove to abut against the bottom of the groove.

8. The heat sink according to claim 4, wherein the receiving means is a hollowed trough, the pressing portion comprises a transverse rod substantially in parallel to the abutting piece, and the transverse rod is disposed in the hollowed trough.

9. The heat sink according to claim 5, wherein the receiving means is a hollowed trough, the pressing portion comprises a transverse rod substantially in parallel to the abutting piece, and the transverse rod is disposed in the hollowed trough.

10. The heat sink according to claim 4, wherein each of the engaging sections comprises a locking arm and a hook formed on the distal end of the locking arm, the locking arm extends upwardly and obliquely from the distal end of the fixing section, and the hook is bent toward the inside of the linear fastener.

11. The heat sink according to claim 5, wherein each of the engaging sections comprises a locking arm and a hook formed on the distal end of the locking arm, the locking arm extends upwardly and obliquely from the distal end of the fixing section, and the hook is bent toward the inside of the linear fastener.

12. The heat sink according to claim 1, wherein the pair of linear fasteners are arranged adjacent to each other, the heat-dissipating fin set is divided into a first heat-dissipating fin set and a second heat-dissipating fin set, the pair of linear fasteners are disposed on the bottom of the first heat-dissipating fin set and the second heat-dissipating fin set, and the connecting portions are disposed between the first heat-dissipating fin set and the second heat-dissipating fin set.

13. A heat sink, configured for heat dissipation of a heat-generating element on a circuit board and including:

a base;
a linear fastener comprising a fixing section and an engaging section bent to extend from the fixing section, the fixing section being disposed on the base, the engaging section extending out of the base to be fixed on the circuit board; and
a heat-dissipation fin set, combined on the base and having a plurality of stamped fins engaged with each other, the bottom of a portion of the stamped fins being provided with a receiving means at a position corresponding to the fixing section, the fixing section being disposed in the receiving means and clamped between the heat-dissipation fin set and the base.

14. The heat sink according to claim 13, wherein each of the stamped fins has an abutting piece adhered to the base and a plurality of engaging pieces engaged with each other, and the abutting pieces of adjacent two stamped fins abut against each other to form a heat-dissipating channel there between.

15. The heat sink according to claim 14, wherein the linear fastener comprises two engaging sections, and the two engaging sections are bent to extend from both ends of the fixing section in opposite directions.

16. The heat sink according to claim 15, wherein the fixing section is formed into a N shape and comprises a pressing portion and two connecting portions extending from the pressing portion in opposite directions.

17. The heat sink according to claim 16, wherein the receiving means is a groove, and the pressing portion is disposed in the groove to abut against the bottom of the groove.

18. The heat sink according to claim 16, wherein the receiving means is a hollowed trough, and the two connecting portions are disposed in the hollowed trough.

Patent History
Publication number: 20130153190
Type: Application
Filed: Jan 11, 2012
Publication Date: Jun 20, 2013
Applicant:
Inventor: Xue-Hui GAN (Hui Zhou City)
Application Number: 13/347,908
Classifications
Current U.S. Class: Heat Transmitter (165/185)
International Classification: F28F 7/00 (20060101);