STACKED DIE PACKAGE
The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed.
The present application is a continuation of U.S. patent application Ser. No. 13/231,953, filed on Sep. 13, 2011, entitled “STACKED DIE PACKAGE”, which is a Divisional of U.S. application Ser. No. 11/852,904, filed on Sep. 10, 2007, entitled “STACKED DIE PACKAGE”, now issued U.S. Pat. No. 8,044,497, issued on Oct. 25, 2011.
BACKGROUNDAs performance increases and electronic device sizes decrease, problems relating to the connections between multiple die structures and between die structures and other elements have developed. For example, such problems may relate to the undesirably long path that metal traces travel to reach active regions on a die, due to the system architecture. Problems may also relate to the lower die in a stacked die structure carrying the entire power source for the upper die(s), which can create undesirable thermal stresses. Conventional stacked die structures may also have problems relating to the height of the assembly, with the interconnection between the stacked die structures being undesirably large.
Embodiments are described by way of example, with reference to the accompanying drawings, which are not drawn to scale, wherein:
Certain embodiments relate to electronic device assemblies and methods for their manufacture. Embodiments may include the use of first and second die structures stacked with the backside metallization surface of the second die structure positioned on the backside metallization surface of the first die structure.
As illustrated in
The stacked die structures 20, 30 may be positioned on a substrate 40, and coupled to the substrate 40 using any suitable technique, for example, using solder bump connections 42. The substrate 40 may be formed from materials including, but not limited to, polymer and ceramic materials. A suitable underfill material 44 may be positioned around and between the die structure 20 and the substrate 40. In the embodiment illustrated in
The active region 28 of the die structure 20 (the lower die structure in
Operations such as described above and illustrated in
Assemblies as described in embodiments above may find application in a variety of electronic components. In certain embodiments, a device or devices in accordance with the present description may be embodied in a computer system including a video controller to render information to display on a monitor coupled to the computer. The computer system may comprise one or more of a desktop, workstation, server, mainframe, laptop, handheld computer, handheld gaming device, handheld entertainment device (for example, a video player), PDA (personal digital assistant), telephony device (wireless or wired), etc. Alternatively, a device or devices in accordance with the present description may be embodied in a computing device that does not include a video controller, such as a switch, router, etc.
Certain embodiments as described herein may include one or more advantages, including, but not limited to: (i) enabling a shorter path between active regions on multiple die structures, which can improve communication speed and efficiency; (ii) enabling the integration of different types of devices into a single assembly package; (iii) enabling efficient vertical connections between devices; (iv) providing efficient electronic connection to stacked dies; (v) minimizing thermal expansion mismatch and stresses between stacked die structures; and (vi) forming of a compact assembly package integrating multiple die structures. It will be appreciated that not all embodiments provide all the advantages mentioned above, and other advantages may also be apparent to one of ordinary skill.
The storage 406 may comprise an internal storage device or an attached or network accessible storage. Programs in the storage 406 may be loaded into the memory 404 and executed by the CPU 402 in a manner known in the art. The architecture may further include a network adapter or controller 408 to enable communication with a network, such as an Ethernet, a Fibre Channel Arbitrated Loop, etc. Further, the architecture may, in certain embodiments, also include a video controller 409, to render information on a display monitor, where the video controller may be embodied on a video card or integrated on integrated circuit components mounted on the motherboard, for example. Other controllers may also be present to control other devices.
An input device 410 may be used to provide input to the CPU 402, and may include, for example, a keyboard, mouse, pen-stylus, microphone, touch sensitive display screen, or any other suitable activation or input mechanism. An output device 412 including, for example, a monitor, printer, speaker, etc., capable of rendering information transmitted from the CPU 402 or other component, may also be present.
While certain exemplary embodiments have been described above and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive, and that embodiments are not restricted to the specific constructions and arrangements shown and described since modifications may occur to those having ordinary skill in the art.
Claims
1. An assembly comprising:
- first and second semiconductor die structures each including a front side and a backside, the front side including an active region;
- a plurality of vias in each of the first and second semiconductor die structures, the vias forming electrical connections between the active region and the backside; and
- the first and second semiconductor die structures being stacked together wherein the vias in the first semiconductor die structure are substantially aligned with the vias in the second semiconductor die structure.
2. The assembly of claim 1, wherein the first die structure is disposed on a substrate and wherein the second die is coupled to the substrate by a wire bond.
3. The assembly of claim 1, wherein the first die structure is a first central processing unit and wherein the second die structure is a second central processing unit.
4. The assembly of claim 1, wherein the first die structure is a central processing unit die and wherein the second die structure is a memory chip.
5. The assembly of claim 1, further including a third die structure disposed on the second die structure.
6. The assembly of claim 1, wherein the first die structure is disposed on a substrate; wherein the first die is a first central processing unit; and wherein the second die structure is a second central processing unit.
7. The assembly of claim 1, wherein the first die structure is disposed on a substrate; wherein the first die is a central processing unit; and wherein the second die structure is a memory chip.
8. The assembly of claim 1, wherein the first die structure is disposed on a substrate; wherein the wherein the first die structure is a memory chip; and wherein the second die structure is a memory chip.
9. An assembly comprising:
- first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions thereon;
- a plurality of vias in each of the first and second semiconductor die structures, the vias forming electrical connections between the active region and the backside metal regions; and
- the first and second semiconductor die structures being stacked together wherein the vias in the first semiconductor die structure are substantially aligned with the vias in the second semiconductor die structure.
10. The assembly of claim 9, wherein the first die structure is disposed on a substrate and wherein the second die is coupled to the substrate by a wire bond.
11. The assembly of claim 9, wherein the first die structure is a first central processing unit and wherein the second die structure is a second central processing unit.
12. The assembly of claim 9, wherein the first die structure is a central processing unit die and wherein the second die structure is a memory chip.
13. The assembly of claim 9, further including a third die structure disposed on the second die structure.
14. The assembly of claim 9, wherein the first die structure is disposed on a substrate; wherein the first die is a first central processing unit; and wherein the second die structure is a second central processing unit.
15. The assembly of claim 9, wherein the first die structure is disposed on a substrate; wherein the first die is a central processing unit; and wherein the second die structure is a memory chip.
16. The assembly of claim 9, wherein the first die structure is disposed on a substrate; wherein the wherein the first die structure is a memory chip; and wherein the second die structure is a memory chip.
17. An assembly comprising:
- first and second semiconductor die structures each including a front side and a backside, the front side including an active region;
- at least one via in each of the first and second semiconductor die structures, the vias forming electrical connections between the active region and the backside; and
- the first and second semiconductor die structures being stacked together wherein the at least one via in the first semiconductor die structure is electrically connected with the vias in the second semiconductor die structure.
18. The assembly of claim 17, wherein the first die structure is disposed on a substrate and wherein the second die is coupled to the substrate by a wire bond.
19. The assembly of claim 17, wherein the first die structure is a first central processing unit and wherein the second die structure is a second central processing unit.
20. The assembly of claim 17, wherein the first die structure is a central processing unit die and wherein the second die structure is a memory chip.
21. The assembly of claim 17, further including a third die structure disposed on the second die structure.
22. The assembly of claim 17, wherein the first die structure is disposed on a substrate; wherein the first die is a first central processing unit; and wherein the second die structure is a second central processing unit.
23. The assembly of claim 17, wherein the first die structure is disposed on a substrate; wherein the first die is a central processing unit; and wherein the second die structure is a memory chip.
24. The assembly of claim 17, wherein the first die structure is disposed on a substrate; wherein the wherein the first die structure is a memory chip; and wherein the second die structure is a memory chip.
Type: Application
Filed: Feb 26, 2014
Publication Date: Jun 26, 2014
Inventors: Bok Eng Cheah (Penang), Shanggar Periaman (Penang), Kooi Chi Ooi (Penang), Yen Hsiang Chew (Penang)
Application Number: 14/190,218
International Classification: H01L 25/065 (20060101); H01L 25/18 (20060101); H01L 23/48 (20060101);