COVERS FOR ELECTRONIC DEVICES

Abstract

The present disclosure is drawn to covers for electronic devices. In one example, a substrate can include a metal alloy. An acid anodizing layer can be formed on the substrate. A dye application can be applied on the acid anodizing layer. A first nickel-free sealing layer can be formed on the dye application. An alkaline anodizing layer can be formed on the first sealing layer. A second nickel-free sealing layer can be formed on the alkaline anodizing layer.

Description

BACKGROUND

The use of personal electronic devices of all types continues to increase. Cellular phones, including smart phones, have become nearly ubiquitous. Tablet computers have also become widely used in recent years. Portable laptop computers continue to be used by many for personal, entertainment, and business purposes. For portable electronic devices in particular, much effort has been expended to make these devices more useful and more powerful while at the same time making the devices smaller, lighter, and more durable. The aesthetic design of personal electronic devices is also of concern in this competitive market. Devices such as mobile phones, tablets and portable computers are generally provided with a casing. The casing typically provides a number of functional features, e.g. protecting the device from damage.

BRIEF DESCRIPTION OF THE DRAWING

FIGS. 1A-1B are cross-sectional views illustrating example covers for electronic devices in accordance with examples of the present disclosure;

FIGS. 2A-2B are cross-sectional views illustrating an example cover for an electronic device with a milled edge in accordance with examples of the present disclosure;

FIG. 3 is a top down view and a partial cross-sectional view taken at 90 degrees of an example cover for an electronic device in accordance with the present disclosure;

FIG. 4 is a cross-sectional view of an example electronic device with a cover in accordance with the present disclosure;

FIG. 5 is a flowchart illustrating an example method of making a cover for an electronic device in accordance with the present disclosure; and

FIGS. 6A-6H are cross-sectional views depicting an example method of making a cover for an electronic device in accordance with the present disclosure.

DETAILED DESCRIPTION

The present disclosure describes covers for electronic devices. In one example, theover includes a substrate including a metal alloy. The cover includes an acid anodizing layer on the substrate. The cover includes a dye application on the acid anodizing layer. The cover includes a first nickel-free sealing layer on the dye application. The cover includes an alkaline anodizing layer on the first sealing layer. The cover includes a second nickel-free sealing layer on the alkaline anodizing layer. The metal alloy can be an aluminum alloy, a magnesium alloy, or hybrid where a first portion of the substrate is composed of an aluminum alloy and a second portion is composed of a magnesium alloy. The cover can further include a milled edge formed along a corner of the substrate to expose a portion of the substrate after the first sealing layer is formed and before the alkaline anodizing layer is formed, wherein the alkaline anodizing layer covers the milled edge. The milled edge can be a chamfered edge formed by computer numeric control, diamond cutting, or laser engraving. The alkaline anodizing layer can be formed using about 3 wt % to about 10 wt % of borax and about 2 wt % to about 8 wt % of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent. The first sealing layer and the second sealing layer can include aluminum fluoride, cerium fluoride, cerium acetate, chromium(III) hydroxide, and/or aluminum acetate. The dye application can include a dye selected from methylene blue, basic fuchsin, crystal violet, eosin, acid fuchsin, congo red, gentian violet, methyl violet, brilliant crystal glue, romanowsky dye, anthraquinone dyes, acridine orange, quinone-imine dyes, xanthene dyes, 2-amino-4-(azoyl)-azo-thiazole, or a combination thereof. The substrate can be degreased before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate. The substrate can be neutralized before the add anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.

In another example, an electronic device includes an electronic component. The electronic device further includes a cover enclosing a portion or all of the electronic component. The cover includes an acid anodizing layer on the substrate. The cover includes a dye application on the acid anodizing layer. The cover includes a first nickel-free sealing layer on the dye application. The cover includes an alkaline anodizing layer on the first sealing layer. The cover includes a second nickel-free sealing layer on the alkaline anodizing layer. The electronic device can be a laptop, a desktop computer, a keyboard, a mouse, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a combination thereof, and wherein a milled edge is located at an edge of a touchpad, an edge of a fingerprint scanner, sidewall, or an edge of a logo.

In another example, a method of making a cover for an electronic device includes, for example, forming an enclosure with a substrate. The method further includes applying an acid anodizing layer on the substrate. The method further includes applying a dye application on the acid anodizing layer. The method further includes applying a first nickel-free sealing layer on the dye application. The method further includes applying an alkaline anodizing layer on the first sealing layer. The method further includes applying a second nickel-free sealing layer on the alkaline anodizing layer. The method can further include milling an edge along a corner of the substrate to expose a portion of the substrate after the first sealing layer is applied and before the alkaline anodizing layer is applied, wherein the alkaline anodizing layer covers the milled edge. The method can further include degreasing the substrate before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate. The method can further include neutralizing the substrate before the add anodizing layer is formed using a neutralization compound including sulfuric add, nitric acid, hydrophilic acid, and/or phosphate acid.

It is noted that when discussing the cover, the electronic device, or the method of making the cover, such discussions of one example are to be considered applicable to the other examples, whether or not they are explicitly discussed in the context of that example. Thus, in discussing a metal alloy in the context of the cover, such disclosure is also relevant to and directly supported in the context of the electronic device, the method of making a cover for an electronic device, and vice versa.

Covers for Electronic Devices

The present disclosure describes covers or enclosures for electronic devices that can apply an alkaline anodizing process in a secondary anodizing treatment to a cover. A first acid anodizing treatment can be applied to a substrate. Then the first acid anodizing treatment or layer can be subjected to a dyeing application. A first nickel-free sealing process can then be applied to the dye application. A corner of the cover can then be diamond cut or milled through the first acid anodizing layer, the dye application, and the first nickel-free sealing layer to form a chamfer and expose a portion of the substrate. The secondary alkaline anodizing layer can then be applied to the exposed surface of the substrate and the remaining exposed surfaces of the first nickel-free sealing layer. The secondary alkaline anodizing layer can then be covered with a second nickel-free sealing layer. The secondary alkaline anodizing layer can resolve potential discoloration and dye migration issues after dyeing the first nickel-free sealing layer and the diamond cutting on the substrate. The secondary alkaline anodizing layer can be used to achieve a high glossy surface appearance and provide a stabilized color tone for the enclosure. An enclosure of the present technology can be capable of passing a 96-hour salt fog test.

The substrate can be formed from an aluminum alloy, a magnesium alloy or a hybrid substrate that can be formed from a first portion of alkaline anodizing layer and a second portion of magnesium ahoy, Using a hybrid substrate with both a magnesium alloy portion and an aluminum alloy portion provides a solution that is lighter in weight compared to a solution that employs an aluminum alloy substrate without a magnesium alloy portion. The aluminum alloy portion of the hybrid substrate also can provide more mechanical strength compared to a substrate that employs a magnesium alloy without an aluminum alloy.

FIG. 1A shows an example cover 100 for an electronic device. The cover 100 includes a substrate composed of a metal alloy including a first portion 110. The metal alloy can include an aluminum alloy, a magnesium alloy or a combination thereof. The aluminum alloy can include any number or combinations of magnesium, lithium, zinc, titanium, niobium, stainless, copper, or alloys thereof. In one example, the aluminum alloy includes more than about 50 wt % aluminum. In one example, the aluminum alloy includes about 50 wt % to about 70 wt % of aluminum. The magnesium alloy can include any number or combinations of aluminum, lithium, zinc, titanium, niobium, stainless, copper, or alloys thereof. A magnesium alloy can include more than about 50 wt % magnesium. In one example, a magnesium alloy includes a minimum of about 55 wt % of magnesium.

An acid anodizing layer 120 can be applied to a surface of the substrate. In one example, one surface of the substrate can be anodized. In one example, all exposed surfaces of the substrate can be anodized. The acid anodizing layer can be performed in an acidic solution. For example, the acid solution may be composed of sulfuric acid or chromic acid, which can slowly dissolve a portion of the metal alloy. In one example, the substrate can be composed of an aluminum alloy and the acidic solution can dissolve aluminum oxide associated with the aluminum alloy. The acid anodizing layer can have a thickness of about 5 μm to about 15 μm.

A dye application 130 can be applied to a surface of the acid anodizing layer 120. The dye application can be used to provide color to the cover or enclosure. Dye materials can include methylene blue, basic fuchsin, crystal violet, eosin, acid fuchsin, congo red, gentian violet, methyl violet, brilliant crystal glue, romanowsky dye, anthraquinone dyes, acridine orange, quinone-imine dyes, xanthene dyes, and 2-amino-4-(azoyl)-azo-thiazole.

A first nickel-free sealing layer 140 can be applied onto the dye application 130. The first nickel-free sealing layer can be composed of materials that seal the acid anodizing layer 120. The first nickel-free sealing layer can be composed of material that does not include nickel. A nickel-free sealing material may be selected for the environmental benefits of a sealant that is free of nickel. The first nickel-free sealing layer can be composed of materials that are about 0.5 wt % to about 5.0 wt % and can include aluminum fluoride, cerium fluoride, cerium acetate, chromium(III) hydroxide, and/or aluminum acetate. The first nickel-free sealing layer can be applied or cured at a temperature of about 25 to about 100 degrees Celsius for a time period of about 15 to about 180 seconds. The nickel-free sealing solution can contain about 0.3 wt % to about 2 wt % of surfactant in deionized water.

An alkaline anodizing layer 150 can be applied to the first nickel-free sealing layer 140. The alkaline anodizing layer can be referred to as a secondary anodizing layer or process meaning secondary to the acid anodizing layer 120. A solution for the alkaline anodizing layer can be formed of about 3 wt % to about 10 wt % of borax (sodium tetraborate) and about 2 wt % to about 8 wt % of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent. The alkaline anodizing layer can be applied at a voltage of about 100 to about 300 volts with a current of about 20 to about 40 amps with a frequency of about 30 to about 80 Hertz. The solution of the alkaline anodizing layer can have a pH balance of about 9 to about 13. The alkaline anodizing layer can be applied at a temperature of about 15 to about 50 degrees Celsius for a time period of about 20 to about 50 minutes.

A second nickel-free sealing layer 160 can be applied to the alkaline anodizing layer 150. The second nickel-free sealing layer can have all of the same properties, techniques, processes, solutions, chemicals, and materials of the first nickel-free sealing layer 130.

Before the acid anodizing layer 120 is applied. The substrate can be subjected to a degreasing process and a neutralization process. A degreasing compound can have a pH control of about 9 to about 13 by sodium carbonate and NaOH. The degreasing compound can include a surfactant of about 0.3 wt % to about 1.5 wt % sodium carbonate and NaOH, and the surfactant can include sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate. The degreasing process can be performed at a temperature of about 25 to about 60 degrees Celsius for a time period of about 30 to about 180 seconds.

A neutralization compound for the neutralization process can include sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid. The neutralization process can have a pH control of about 3 to about 5. The neutralization process can be performed with a bath temperature of about 25 to about 60 degrees Celsius for a time period of about 30 to about 120 seconds.

After the acid anodizing layer 120 is applied and before the dye application 130 is applied, the enclosure may be subjected to washing or ultrasonic cleaning. The washing or ultrasonic cleaning can be performed for a time period of about 30 to about 90 seconds.

After the second nickel-free sealing layer 160 is applied, the enclosure may be subjected to warm washing. The warm washing may be performed at a temperature of about 60 to about 80 degrees Celsius for a time period of about 30 to about 60 seconds. After the warm washing, the enclosure can be subjected to a drying process. The drying process can be performed at a temperature of about 70 to about 105 degrees Celsius for a time period of about to about 15 minutes.

FIG. 1B shows an example cover 170 for an electronic device. The cover depicts a hybrid substrate including a first portion 110 and a second portion 115. The first portion can be composed of an aluminum alloy and the second portion can be composed of a magnesium alloy.

In one example, the hybrid substrate can include about 55 wt % to about 90 wt % of the second portion 115 (the magnesium alloy) and about 10 wt % to about 45 wt % of the second portion 110 (the aluminum alloy). It is appreciated that the hybrid substrate can include more than two portions or regions including magnesium alloy and aluminum alloy. For example, corners or edges of the hybrid substrate can include aluminum ahoy including openings such as openings in the cover for a track pad or a fingerprint scanner. Thus, individual corners or edges of the hybrid substrate can include a portion or region of the aluminum alloy while portions between the corners and edges can include the magnesium alloy. The portions of the hybrid substrate that include the aluminum alloy can provide additional strength to the resulting cover as compared to a cover including a substrate of only a magnesium alloy. The hybrid substrate can be described as a light metal substrate. For example, light metals can include magnesium, aluminum, lithium, zinc, titanium, niobium, stainless, copper, or an alloy thereof. The hybrid substrate can have a thickness of about 0.3 mm to about 2.0 mm.

The hybrid substrate can be formed by joining the first portion 110 to the second portion 115. For example, the aluminum alloy can be shaped using a process such as computer numeric control (CNC). The aluminum alloy can then be welded to the magnesium alloy. The magnesium alloy can be shaped using techniques such as forging or thixo-molding. In another example, the magnesium alloy can be insert molded into a shaped aluminum alloy. The insert molding can be accomplished using thixo-molding. Once the second portion and the first portion are joined together, the joined first and second portion can be shaped using CNC and then polished to form the hybrid substrate.

The aluminum alloy portion may be sandblasted before being joined to the magnesium alloy portion using insert molding. After the aluminum alloy portion is joined to the magnesium alloy to form the hybrid substrate, the hybrid substrate may be further shaped using a technique such as CNC. In one example, the surfaces of the hybrid substrate can be polished prior to depositing the acid anodizing layer 120

FIG. 2A shows an example cover 200 for an electronic device with a substrate including a first portion 210. The first portion can include an aluminum alloy, a magnesium alloy, or a combination thereof. The first portion is depicted as being a corner section of the substrate and the cover. For example, the depicted cross section of the first portion is depicted as an L shape. The substrate can include any number of corners for edges of the cover or edges of features and components such as trackpads or fingerprint scanners. The cover is depicted with an acid anodizing layer 220 over a surface of the first portion. A dye application 230 is applied to the acid anodizing layer. A first nickel-free sealing layer 240 is applied to the dye application. After the first nickel-free sealing layer is deposited or applied, the corner of the first portion can be milled along an edge of the corner to form a milled edge or chamfer. The chamfer can remove a portion of the substrate, the acid anodizing layer, the dye application, and the first nickel-free sealing layer. The chamfer can expose a surface of the substrate. The remaining exposed portions of the substrate, the acid anodizing layer, the dye application, to and the first nickel-free sealing layer can then be covered with an alkaline anodizing layer 250. A second nickel-free sealing layer 260 can be applied to the alkaline anodizing layer. The chamfer or milled edge can be formed using computer numeric control (CNC), diamond cutting, laser engraving, or a combination thereof.

FIG. 2B shows an example cover 270 for an electronic device with a hybrid substrate including a first portion 210 and a second portion 215. The first portion can be composed of an aluminum alloy and the second portion can be composed of a magnesium alloy. The first portion is depicted as being a corner section of the hybrid substrate and the cover. For example, the depicted cross section of the second portion is depicted as an L shape. The first or second portion can also be formed into other shapes.

FIG. 3 shows another example cover 300 for an electronic device. This example is a top cover for the keyboard portion of a laptop (sometimes referred to as a “laptop cover C”). The cover includes key openings 360 for the keyboard buttons (not shown) to be positioned therethrough, hinge recesses 362 to receive a hinge (not shown), a track pad opening 364 to receive a track pad (not shown), and a fingerprint scanner opening 366 to receive a fingerprint scanner (not shown). These are merely examples of structures that may be present, and are illustrative of many of a number of other structural components used with this type of top cover. The cover can be mostly made up of a substrate 310. Surfaces of the substrate can be covered with an acid anodizing layer 320. The acid anodizing layer can be covered by a dye application 330. The dye application can be covered by a first nickel-free sealing layer 340. A milled edge can be formed that cuts through the substrate, the acid anodizing layer, the dye application, and the first nickel-free sealing layer to expose a portion of the substrate. The exposed portion of the substrate and the first nickel-free sealing layer can then be covered with an alkaline anodizing layer 350. The alkaline anodizing layer can be covered with a second nickel-free sealing layer 360.

To show the various materials in this example more clearly, a partial cross-sectional view is shown along plane “A” designated further by the dashed and dotted lines/arrows. This cross-sectional view shows the chamfer 324 which is bordering the track pad opening 364 and forms the track pad milled edge 333. The chamfer cuts through the acid anodizing layer 320, the dye application 330, and the first nickel-free sealing layer 340 as depicted. As shown in the figure, in this example the milled edge includes a sloping face that slopes downward toward the track pad opening. When the cover is assembled with other components to make a complete laptop, this chamfered edge can provide a more comfortable edge around the track pad compared to a sharp 90° edge. Similarly, the milled edge around the fingerprint scanner can slope downward toward the fingerprint scanner in some examples.

As used herein, “cover” refers to the exterior shell of an electronic device that includes or is in the form of an enclosure, and a portion thereof (or the structure thereof) includes a light metal substrate. In other words, the cover can be adapted to contain the internal electronic components of the electronic device. The cover can be an integral part of the electronic device. The term “cover” is not meant to refer to the type of removable protective cases that are often purchased separately for an electronic device (especially smart phones and tablets) and placed around the exterior of the electronic device. Covers as described herein can be used on a variety of electronic devices, for example, a laptop, a desktop, a keyboard, a mouse, a printer, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a combination thereof. In various examples, the hybrid substrate for these covers can be formed by molding, casting, machining, bending, working, stamping, CNC, forging, or another process.

In one example, the cover can be made from multiple panels as depicted in FIG. 4. For example, laptop covers sometimes include four separate cover pieces forming the complete cover of the laptop. The four separate pieces of the laptop cover are often designated as cover A (back cover of the monitor portion of the laptop), cover B (front cover of the monitor portion), cover C (top cover of the keyboard portion) and cover D (bottom cover of the keyboard portion). Covers can also be made for smart phones and tablet computers with a single metal piece or multiple metal panels.

As used herein, a layer that is referred to as being “on” a lower layer can be directly applied to the lower layer, or an intervening layer or multiple intervening layers located between the layer and the lower layer. Generally, the covers described herein can include a substrate coated with an acid anodizing layer, a dye application, a first nickel-free sealing layer, an alkaline anodizing layer, and a second nickel-free sealing layer. Accordingly, a layer that is “on” a lower layer can be located further from the substrate. A “higher” layer applied “on” a “lower” layer may be located farther from the substrate and closer to a viewer viewing the cover from the outside. Furthermore, a layer may include multiple layers.

It is noted that when discussing covers for electronic devices, the electronic devices themselves, or methods of making covers for electronic devices, such discussions can be considered applicable to one another whether or not they are explicitly discussed in the context of that example. Thus, for example, when discussing the metals used in the hybrid substrate in the context of one of the example covers, such disclosure is also relevant to and directly supported in the context of the electronic devices and/or methods, and vice versa. It is also understood that terms used herein will take on their ordinary meaning in the relevant technical field unless specified otherwise. In some instances, there are terms defined more specifically throughout or included at the end of the present disclosure, and thus, these terms are supplemented as having a meaning described herein.

Electronic Devices

A variety of electronic devices can be made with the covers described herein. In various examples, such electronic devices can include various electronic components enclosed by the cover. As used herein, “encloses” or “enclosed” when used with respect to the covers enclosing electronic components can include covers completely enclosing the electronic components or partially enclosing the electronic components. Many electronic devices include openings for charging ports, input/output ports, headphone ports, and so on. Accordingly, in some examples the cover can include openings for these purposes, Certain electronic components may be designed to be exposed through an opening in the cover, such as display screens, keyboard keys, buttons, track pads, fingerprint scanners, cameras, and so on. Accordingly, the covers described herein can include openings for these components. Other electronic components may be designed to be completely enclosed, such as motherboards, batteries, sim cards, wireless transceivers, memory storage drives, and so on. Additionally, in some examples a cover can be made up of two or more cover sections, and the cover sections can be assembled together with the electronic components to enclose the electronic components. As used herein, the term “cover” can refer to an individual cover section or panel, or collectively to the cover sections or panels that can be assembled together with electronic components to make the complete electronic device.

FIG. 4 shows a cross-sectional schematic view of an example electronic device 400 in accordance with examples of the present disclosure. This example includes a top cover 402 and a bottom cover 404 enclosing an electronic component 412. The top cover includes a substrate 410 and the bottom cover includes a substrate 414. The substrates 410 and 414 can be composed of an aluminum alloy, a magnesium alloy, a combination thereof, or a hybrid substrate. The substrate 410 is depicted as having corner or L shaped pieces. The substrates of the top and bottom covers are covered with an acid anodizing layer 420. The acid anodizing layer is covered with a dye application 430. The dye application is covered with a first nickel-free sealing layer 440. The corners of the substrate 410 are milled along two edges to form chamfer 470 and chamfer 480 to expose two surfaces of the substrate 410. The chamfers also cut through portions of the acid anodizing layer, the dye application, and the first nickel-free sealing layer. The exposed surfaces of the substrate and the first nickel-free sealing layer are then covered with an alkaline anodizing layer 450. The alkaline anodizing layer is then covered with a second nickel-free sealing layer 460.

In further examples, the electronic device can be a laptop, a desktop, a keyboard, a mouse, a printer, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a variety of other types of electronic devices. In certain examples, the chamfered edge or edges can be located in decorative locations on the cover. Some examples include chamfered edges around track pads, around fingerprint scanners, around an edge of a logo, and so on. In further detail, there may be outer periphery locations of the hybrid substrate that can be similarly chamfered.

Methods of Making Covers for Electronic Devices

In some examples, the covers described herein can be made from an aluminum alloy, a magnesium alloy, a combination thereof, or a hybrid substrate with a first portion of aluminum alloy and a second portion of magnesium alloy. This can be accomplished using a variety of processes, including CNC milled, molding, insert molding, forging, casting, machining, stamping, bending, working, and so on. An aluminum alloy portion can then be joined to a magnesium alloy portion to form a hybrid substrate for the cover. It should be appreciated that a cover or a panel for a cover may include a plurality of aluminum alloy portions and a plurality of magnesium alloy portions meaning that the hybrid substrate could have more than one portion including aluminum alloy and more than one portion including magnesium alloy. In one example, the aluminum alloy portion is joined to the magnesium alloy portion by welding the aluminum alloy portion onto an extrusion of magnesium alloy. In such an example, the hybrid substrate can then be further shaped using CNC milling. The hybrid substrate can then be polished.

In another example, the aluminum alloy portion is first formed using CNC milling and then sandblasted. The magnesium alloy portion is insert molded onto the aluminum alloy portion using thixo-molding to form the hybrid substrate. Prior to the insert molding, the aluminum alloy portion can be shaped using the CNC milling to form an interlock structure used for the insert molding process. After the aluminum alloy portions and the magnesium alloy portions have been joined to form the hybrid substrate, the hybrid substrate can be CNC milled to further shape the hybrid substrate.

FIG. 5 is a flowchart illustrating an example method 500 of making a cover for an electronic device. The method includes forming 510 an enclosure with a substrate. The method further includes applying 520 an acid anodizing layer on the substrate. The method further includes applying 530 a dye application on the acid anodizing layer. The method further includes applying 540 a first nickel-free sealing layer on the dye application. The method further includes applying 550 an alkaline anodizing layer on the first sealing layer. The method further includes applying 560 a second nickel-free sealing layer on the alkaline anodizing layer. The method can further include milling an edge along a corner of the substrate to expose a portion of the substrate after the first sealing layer is applied and before the alkaline anodizing layer is applied, wherein the alkaline anodizing layer covers the milled edge. The method can further include degreasing the substrate before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate. The method can further include neutralizing the substrate before the acid anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.

FIGS. 6A-6H show cross-sectional views illustrating another example method of making a cover for an electronic device. In FIG. 6A, a first portion 610 can include magnesium alloy. The first portion can be formed using forging or insert molding such as thixo-molding. In FIG. 6B, the first portion 610 is joined to a second portion 620 and a third portion 630. The second and third portions can include aluminum alloy and can be formed using CNC milling. The first portion can be joined to the second porting using welding or the first portion can be insert molded onto the second and third portion. The first, second and third portions form a hybrid substrate for the electronic device. It should be appreciated that the first, second, and third portions may alternatively be formed of only one portion or one substrate formed of a material such as an aluminum alloy or a magnesium alloy. In FIG. 6C, the hybrid substrate is coated or covered with an acid anodizing layer 640. The acid anodizing layer can coat all exposed surfaces of the hybrid substrate. In FIG. 6D, a dye application 650 is applied to the acid anodizing layer. In FIG. 6E, the dye application is covered with a first nickel-free sealing layer 660. In FIG. 6F, a corner of the second portion is milled along an edge to form a chamfer 670 that exposes a surface of the second portion. A corner of the third portion is milled along an edge to form a chamfer 680 that exposes a surface of the third portion. The chamfers also cut through the acid anodizing layer, the dye application, and the first nickel-free sealing layer. In FIG. 6G, the chamfers, the exposed portions of the acid anodizing layer, the dye application, and the first nickel-free sealing layer are covered with an alkaline anodizing layer 690. In FIG. 6H, the alkaline anodizing layer is covered with a second nickel-free sealing layer 695.

Light Metal Substrates for Electronic Device Covers

In one example, the substrate can be composed of a light metal substrate. The light metal substrate can be made from a single metal, a metallic alloy, a combination of sections made from multiple metals, or a combination of metal and other materials. In certain examples, the light metal substrate can include aluminum, magnesium, lithium, niobium, titanium, zinc, or an alloy thereof. In further particular examples, the light metal substrate can include aluminum, an aluminum alloy, magnesium, or a magnesium alloy. Non-limiting examples of elements that can be included in aluminum or magnesium alloys can include aluminum, magnesium, titanium, lithium, niobium, zinc, bismuth, copper, cadmium, iron, thorium, strontium, zirconium, manganese, nickel, lead, silver, chromium, silicon, tin, gadolinium, yttrium, calcium, antimony, cerium, lanthanum, or others.

In some examples, the light metal substrate can include aluminum magnesium alloys made up of about 0.5% to about 13% magnesium by weight and 87% to 99.5% aluminum by weight. Examples of specific aluminum magnesium alloys can include 1050, 1060, 1199, 2014, 2024, 2219, 3004, 4041, 5005, 5010, 5019, 5024, 5026, 5050, 5052, 5056, 5059, 5083, 5086, 5154, 5182, 5252, 5254, 5356, 5454, 5456, 5457, 5557, 5652, 5657, 5754, 6005, 6005A, 6060, 6061, 6063, 6066, 6070, 6082, 6105, 6162, 6262, 6351, 6463, 7005, 7022, 7068, 7072, 7075, 7079, 7116, 7129, and 7178.

In further examples, the light metal substrate can include magnesium metal, a magnesium alloy that is 99% or more magnesium by weight, or a magnesium alloy that is from about 50% to about 99% magnesium by weight. In a particular example, the light metal substrate can include an alloy including magnesium and aluminum. Examples of magnesium-aluminum alloys can include alloys made up of from about 91% to about 99% magnesium by weight and from about 1% to about 9% aluminum by weight, and alloys made up of about 0.5% to about 13% magnesium by weight and 87% to 99.5% aluminum by weight. Specific examples of magnesium-aluminum alloys can include AZ63, AZ81, AZ91, AM50, AM60, AZ31, AZ61, AZ80, AE44, AJ62A, ALZ391, AMCa602, LZ91, and Magnox.

The light metal substrate can be shaped to fit any type of electronic device, including the specific types of electronic devices described herein. In some examples, the light metal substrate can have any thickness suitable for a particular type of electronic device. The thickness of the metal in the light metal substrate can be selected to provide a desired level of strength and weight for the cover of the electronic device. In some examples, the light metal substrate can have a thickness from about 0.5 mm to about 2 cm, from about 1 mm to about 1.5 cm, from about 1.5 mm to about 1.5 cm, from about 2 mm to about 1 cm, from about 3 mm to about 1 cm, from about 4 mm to about 1 cm, or from about 1 mm to about 5 mm, though thicknesses outside of these ranges can be used.

Paint Coatings

Paint coating layers may include a transparent primer coating as well as other paint coatings. The paint coatings may include one, two, three or four layers or any other number of layers. The paint coating may include a primer coat, a base coat, and/or a top coat. The paint coating may be applied using any number of techniques including spray painting or inkjet painting. The paint may include a variety of materials. In one example, a primer coat can include a polyester, epoxy, epoxy-polyester, epoxy-polyimide, a polyurethane, or a copolymer thereof. In one example, a base coat can include a polyester, a polyurethane, polyacrylic, polyester-imide, and epoxy-polyimide, or a copolymer thereof. In one example, a top coat can include a polyurethane, a polyacrylic or polyacrylate, a urethane, an epoxy, or a copolymer thereof. The paint coatings can be any number of colors and can be transparent, semi-transparent, or opaque.

Definitions

It is noted that, as used in this specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the content clearly dictates otherwise.

The term “about” as used herein, when referring to a numerical value or range, allows for a degree of variability in the value or range, for example, within 5% or other reasonable added range breadth of a stated value or of a stated limit of a range. The term “about” when modifying a numerical range is also understood to include the exact numerical value indicated, e.g., the range of about 1 wt % to about 5 wt % includes 1 wt % to 5 wt % as an explicitly supported sub-range.

As used herein, “colorant” can include dyes and/or pigments.

As used herein, “dye” refers to compounds or molecules that absorb electromagnetic radiation or certain wavelengths thereof. Dyes can impart a visible color to an ink if the dyes absorb wavelengths in the visible spectrum.

As used herein, “pigment” generally includes pigment colorants, magnetic particles, aluminas, silicas, and/or other ceramics, organo-metallics or other opaque particles, whether or not such particulates impart color. Thus, though the present description primarily exemplifies the use of pigment colorants, the term “pigment” can be used more generally to describe pigment colorants and other pigments such as organometallics, ferrites, ceramics, etc. In one specific example, however, the pigment is a pigment colorant.

As used herein, a plurality of items, structural elements, compositional elements, and/or materials may be presented in a common list for convenience. However, these lists should be construed as though the individual members of the list are individually identified as a separate and unique member. Thus, no individual member of such list should be construed as a de facto equivalent of any other member of the same list solely based on their presentation in a common group without indications to the contrary.

Concentrations, dimensions, amounts, and other numerical data may be presented herein in a range format. It is to be understood that such range format is used merely for convenience and brevity and should be interpreted flexibly to include the numerical values explicitly recited as the limits of the range, and also to include all the individual numerical values or sub-ranges encompassed within that range as if individual numerical values and sub-ranges are explicitly recited. For example, a layer thickness from about 0.1 μm to about 0.5 μm should be interpreted to include the explicitly recited limits of 0.1 μm to 0.5 μm, and to include thicknesses such as about 0.1 μm and about 0.5 μm, as well as subranges such as about 0.2 μm to about 0.4 μm, about 0.2 μm to about 0.5 μm, about 0.1 μm to about 0.4 μm etc.

PROPHETIC EXAMPLES

The following illustrates examples of the present disclosure. However, it is to be understood that the following are illustrative of the application of the principles of the present disclosure. Numerous modifications and alternative compositions, methods, and systems may be devised without departing from the spirit and scope of the present disclosure. The appended claims are intended to cover such modifications and arrangements.

Example 1

A laptop cover for an electronic device is made with a substrate. The substrate is covered with an acid anodizing layer. The acid anodizing layer is covered with a dye application. The dye application is covered with a first nickel-free sealing layer. The first nickel-free sealing layer is covered with an alkaline anodizing layer. The alkaline anodizing layer is covered with a second nickel-free sealing layer. A solution for the alkaline anodizing layer is formed of about 3 wt % to about 10 wt % of borax (sodium tetraborate) and about 2 wt % to about 8 wt % of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent. The alkaline anodizing layer is applied at a voltage of about 100 to about 300 volts with a current of about 20 to about 40 amps with a frequency of about 30 to about 80 Hertz. The solution of the alkaline anodizing layer has a pH balance of about 9 to about 13. The alkaline anodizing layer is applied at a temperature of about 15 to about 50 degrees Celsius for a time period of about 20 to about 50 minutes. The first nickel-free sealing layer and the second nickel-free sealing layer are formed from a compound that does not contain nickel.

Example 2

A laptop cover for an electronic device is made with a substrate. The substrate is covered with an acid anodizing layer. The acid anodizing layer is covered with a dye application. The dye application is covered with a first nickel-free sealing layer. A milled edge is formed along a corner of the substrate to expose a portion of the substrate. The milled edge cuts through a portion of the acid anodizing layer, the dye application, and the first nickel-free sealing layer. The milled edge and the exposed portions of the acid anodizing layer, the dye application, and the first nickel-free sealing layer are covered with an alkaline anodizing layer. The alkaline anodizing layer is covered with a second nickel-free sealing layer. A solution for the alkaline anodizing layer is formed of about 3 wt % to about 10 wt % of borax (sodium tetraborate) and about 2 wt % to about 8 wt % of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent. The alkaline anodizing layer is applied at a voltage of about 100 to about 300 volts with a current of about 20 to about 40 amps with a frequency of about 30 to about 80 Hertz. The solution of the alkaline anodizing layer has a pH balance of about 9 to about 13. The alkaline anodizing layer is applied at a temperature of about 15 to about 50 degrees Celsius for a time period of about 20 to about 50 minutes. The first nickel-free sealing layer and the second nickel-free sealing layer are formed from a compound that does not contain nickel.

Example 3

The laptop cover for an electronic device of either Example 1 or Example 2 is made. In this example, the substrate is composed of an aluminum alloy. The aluminum alloy includes from 50 wt % to 70 wt % aluminum.

Example 4

The laptop cover for an electronic device of either Example 1 or Example 2 is made. In this example, the substrate is composed of a magnesium alloy. The magnesium alloy includes more than 50 wt % magnesium.

Example 5

The laptop cover for an electronic device of either Example 1 or Example 2 is made. In this example, the substrate is composed of a hybrid substrate that has an aluminum alloy portion and a magnesium alloy portion. The aluminum alloy portion is used for the corner regions of a laptop cover, including all corners of openings in the laptop cover. In this example, the aluminum alloy includes from 50 wt % to 70 wt % aluminum. The magnesium alloy portion is prepared by forging, and the magnesium alloy includes more than about 55 wt %. The aluminum alloy portions are welded to the magnesium alloy portions to form a hybrid substrate. The hybrid substrate includes from about 10 wt % to about 45 wt % of the aluminum alloy and from about 55 wt % to about 90 wt % of the magnesium alloy. CNC milling is then used to shape the hybrid substrate for the laptop cover including forming a “C” shape and/or as a keyboard surface with openings therein for keys, a track pad, a fingerprint pad, etc. The hybrid substrate can then be polished.

Claims

1. A cover for an electronic device comprising:

a substrate including a metal alloy;

an acid anodizing layer on the substrate;

a dye application on the acid anodizing layer;

a first nickel-free sealing layer on the dye application;

an alkaline anodizing layer on the first sealing layer; and

a second nickel-free sealing layer on the alkaline anodizing layer.

2. The cover of claim 1, wherein the metal alloy is an aluminum alloy, a magnesium alloy, or hybrid where a first portion of the substrate is composed of an aluminum alloy and a second portion is composed of a magnesium alloy.

3. The cover of claim 1, further comprising a milled edge is formed along a corner of the substrate to expose a portion of the substrate after the first nickel-free sealing layer is formed and before the alkaline anodizing layer is formed, wherein the alkaline anodizing layer covers the milled edge.

4. The cover of claim 3, wherein the milled edge is a chamfered edge formed by computer numeric control, diamond cutting, or laser engraving.

5. The cover of claim 1, wherein the alkaline anodizing layer is formed using about 3 wt % to about 10 wt % of borax and about 2 vit % to about 8 wt % of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent.

6. The cover of claim 1, wherein the first sealing layer and the second sealing layer includes aluminum fluoride, cerium fluoride, cerium acetate, chromium(III) hydroxide, and/or aluminum acetate.

7. The cover of claim 1, wherein the dye application includes a dye selected from methylene blue, basic fuchsin, crystal violet, eosin, acid fuchsin, congo red, gentian violet, methyl violet, brilliant crystal glue, romanowsky dye, anthraquinone dyes; acridine orange, quinone-imine dyes, xanthene dyes, 2-amino-4-(azoyl)-azo-thiazole, or a combination thereof.

8. The cover of claim 1, wherein the substrate is degreased before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate.

9. The cover of claim 1, wherein the substrate is neutralized before the acid anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.

10. An electronic device comprising:

an electronic component; and

a cover enclosing a portion or all of the electronic component, the cover comprising: a substrate including a metal alloy; an acid anodizing layer on the substrate; a dye application on the acid anodizing layer; a first nickel-free sealing layer on the dye application; an alkaline anodizing layer on the first sealing layer; and a second nickel-free sealing layer on the alkaline anodizing layer.

11. The electronic device of claim 10, wherein the electronic device is a laptop, a desktop computer, a keyboard, a mouse, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a combination thereof, and wherein a milled edge is located at an edge of a touchpad, an edge of a fingerprint scanner, or an edge of a logo.

12. A method of making a cover for an electronic device comprising:

forming an enclosure with a substrate;

applying an acid anodizing layer on the substrate;

applying a dye application on the acid anodizing layer;

applying a first nickel-free sealing layer on the dye application;

applying an alkaline anodizing layer on the first sealing layer; and

applying a second nickel-free sealing layer on the alkaline anodizing layer.

13. The method of claim 12, further comprising milling an edge along a corner of the substrate to expose a portion of the substrate after the first nickel-free sealing layer is applied and before the alkaline anodizing layer is applied, wherein the alkaline anodizing layer covers the milled edge.

14. The method of claim 12, further comprising degreasing the substrate before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate.

15. The method of claim 12, further comprising neutralizing the substrate before the acid anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.