Earphone

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Description

FIG. 1 is a bottom, rear and left side perspective view of an earphone showing our new design;

FIG. 2 is a top, front and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings illustrate portions of the earphone that form no part of the claimed design.

Claims

The ornamental design for an earphone, as shown and described.

Referenced Cited
U.S. Patent Documents
D492667 July 6, 2004 Skulley
D521987 May 30, 2006 Ma
D555153 November 13, 2007 Wilson
D598895 August 25, 2009 Bentley
D635962 April 12, 2011 Kelley
D715256 October 14, 2014 Jiang
D790505 June 27, 2017 Vargo
D843350 March 19, 2019 Vargo
D903633 December 1, 2020 Vargo
D906282 December 29, 2020 Kelley
D933042 October 12, 2021 Xiao
D983771 April 18, 2023 Yan
Foreign Patent Documents
306941701 November 2021 CN
008660054-0013 October 2021 EM
Other references
  • Yealink WH67 Wireless Headsets, date first available: Aug. 29, 2021, [retrieved May 31, 2023], Retrieved from Internet, URL: <https://www.amazon.com/Yealink-WH67-Wireless-Headsets-Certified/dp/B08WYPM999> (Year: 2021).
  • Yealink WH67—headset, date not available, [retrieved May 31, 2023], Retrieved from Internet, URL: <https://www.cdw.com/product/yealink-wh67-headset/6423658> (Year: 2023).
Patent History
Patent number: D1002586
Type: Grant
Filed: Nov 30, 2021
Date of Patent: Oct 24, 2023
Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD. (Xiamen)
Inventors: Jingfeng Su (Fujian), Jiancheng Zhang (Fujian)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/817,230
Classifications
Current U.S. Class: Headphone (D14/223)