Heat insulator cover of semiconductor manufacturing apparatus

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Description

FIG. 1 is a front, top and right side perspective view of a heat insulator cover of semiconductor manufacturing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and

FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2 thereof; and,

FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 2.

Claims

The ornamental design for a heat insulator cover of semiconductor manufacturing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
D45172 January 1914 White
D404369 January 19, 1999 Kawachi
D407696 April 6, 1999 Shimazu
D413659 September 7, 1999 Swartz
D615936 May 18, 2010 Sato
D655801 March 13, 2012 Russell
D694711 December 3, 2013 Arioka
D818960 May 29, 2018 Yamaguchi
D818961 May 29, 2018 Yamaguchi
20120231407 September 13, 2012 Kadobe
Patent History
Patent number: D1003834
Type: Grant
Filed: Dec 23, 2021
Date of Patent: Nov 7, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Yusaku Okajima (Toyama)
Primary Examiner: Derrick E Holland
Application Number: 29/820,708