Heat insulator cover of semiconductor manufacturing apparatus
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Description
Claims
The ornamental design for a heat insulator cover of semiconductor manufacturing apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
D45172 | January 1914 | White |
D404369 | January 19, 1999 | Kawachi |
D407696 | April 6, 1999 | Shimazu |
D413659 | September 7, 1999 | Swartz |
D615936 | May 18, 2010 | Sato |
D655801 | March 13, 2012 | Russell |
D694711 | December 3, 2013 | Arioka |
D818960 | May 29, 2018 | Yamaguchi |
D818961 | May 29, 2018 | Yamaguchi |
20120231407 | September 13, 2012 | Kadobe |
Patent History
Patent number: D1003834
Type: Grant
Filed: Dec 23, 2021
Date of Patent: Nov 7, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Yusaku Okajima (Toyama)
Primary Examiner: Derrick E Holland
Application Number: 29/820,708
Type: Grant
Filed: Dec 23, 2021
Date of Patent: Nov 7, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Yusaku Okajima (Toyama)
Primary Examiner: Derrick E Holland
Application Number: 29/820,708
Classifications
Current U.S. Class:
Insulator (7) (D13/129);
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)