Soldering station
Latest ERSA GmbH Patents:
- Soldering apparatus
- SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF CONTAMINATION IN PARTICULAR DURING THE REFLOW SOLDERING OF PRINTED CIRCUIT BOARDS, AND ASSOCIATED EVALUATION UNIT
- Moving unit for moving two soldering assemblies for processing circuits boards, and soldering system for selective wave soldering with a moving unit
- SOLDERING TIP ASSEMBLY FOR AN ELECTRIC SOLDERING DEVICE, IN PARTICULAR A SOLDERING IRON, SOLDERING DEVICE, AND SOLDERING SYSTEM
- NETWORK FOR CONTROLLING SOLDERING SYSTEMS AND METHOD THEREFOR
Description
The broken lines depict portions of the soldering station in which the design is embodied that are not considered part of the claimed design.
Claims
The ornamental design for a soldering station, as shown and described.
Referenced Cited
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Patent History
Patent number: D1005808
Type: Grant
Filed: Feb 17, 2022
Date of Patent: Nov 28, 2023
Assignee: ERSA GmbH (Wertheim)
Inventors: Thorsten Issler (Buetthard), Lars Mayer (Hanau), Eugen Weissenberger (Eussenheim)
Primary Examiner: Philip S Hyder
Application Number: 29/827,063
Type: Grant
Filed: Feb 17, 2022
Date of Patent: Nov 28, 2023
Assignee: ERSA GmbH (Wertheim)
Inventors: Thorsten Issler (Buetthard), Lars Mayer (Hanau), Eugen Weissenberger (Eussenheim)
Primary Examiner: Philip S Hyder
Application Number: 29/827,063
Classifications
Current U.S. Class:
Solid Material Melting, E.g., Solder, Etc. (D15/144.2)