Heat pipe
Latest ASIA VITAL COMPONENTS CO., LTD. Patents:
Description
Claims
The ornamental design for a heat pipe, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
D54852 | April 1920 | Kerr |
D263494 | March 23, 1982 | Markum |
D271794 | December 13, 1983 | Wenzel |
D287119 | December 9, 1986 | Wadia |
4880052 | November 14, 1989 | Meyer, IV |
D359117 | June 6, 1995 | Ostman |
D425611 | May 23, 2000 | Qu |
D475354 | June 3, 2003 | Wang |
D484854 | January 6, 2004 | Lee |
6796373 | September 28, 2004 | Li |
D667538 | September 18, 2012 | Wu |
D667539 | September 18, 2012 | Wu |
D667540 | September 18, 2012 | Wu |
8322403 | December 4, 2012 | Lin |
D763417 | August 9, 2016 | Hokazono |
D764034 | August 16, 2016 | Schmidt |
10036596 | July 31, 2018 | Lan |
10119766 | November 6, 2018 | Lin |
D945579 | March 8, 2022 | Kanagala |
D960336 | August 9, 2022 | Kanagala |
20040112572 | June 17, 2004 | Moon |
20090166006 | July 2, 2009 | Guo |
20100083500 | April 8, 2010 | Lin |
20100238630 | September 23, 2010 | Xu |
20110277977 | November 17, 2011 | Lin |
20110315357 | December 29, 2011 | Lin |
20140138074 | May 22, 2014 | Huang |
20160282054 | September 29, 2016 | Hirasawa |
20170153064 | June 1, 2017 | Lan |
20180100703 | April 12, 2018 | Beaver |
20180292872 | October 11, 2018 | Fu |
20190186847 | June 20, 2019 | Kanagala |
20200263933 | August 20, 2020 | Hsu |
20220022339 | January 20, 2022 | Chen |
- Rarido Round Copper Heat Pipe, Mar. 27, 2019, Amazon, site visited Mar. 6, 2023: https://www.amazon.ca/dp/B07NZ1VW7R/ (Year: 2019).
- BQLZR Copper Heat Pipe, Sep. 4, 2018, Amazon, site visited Mar. 6, 2023: https://www.amazon.ca/dp/B07FKPCW8M/ (Year: 2018).
- Sabrent M.2 2280 SSD Rocket Heatsink, Jul. 1, 2019, Amazon, site visited Mar. 6, 2023: https://www.amazon.ca/dp/B07TN2RX2K/ (Year: 2019).
- Heat Pipe Overview Wakefield-Vette, Jul. 9, 2015, YouTube, site visited Mar. 6, 2023: https://www.youtube.com/watch?v=WoJnnHTQfuw (Year: 2015).
Patent History
Patent number: D1009813
Type: Grant
Filed: Dec 30, 2019
Date of Patent: Jan 2, 2024
Assignee: ASIA VITAL COMPONENTS CO., LTD. (New Taipei)
Inventor: Wen-Ji Lan (New Taipei)
Primary Examiner: Jack Reickel
Assistant Examiner: Bobby W Jones, II
Application Number: 29/718,862
Type: Grant
Filed: Dec 30, 2019
Date of Patent: Jan 2, 2024
Assignee: ASIA VITAL COMPONENTS CO., LTD. (New Taipei)
Inventor: Wen-Ji Lan (New Taipei)
Primary Examiner: Jack Reickel
Assistant Examiner: Bobby W Jones, II
Application Number: 29/718,862
Classifications