Instrument for transferring boats for thermal treatment of semiconductor wafers
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Description
FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a left side elevational view;
FIG. 3 is a front elevational view, the rear elevational view being a mirror image;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and
FIG. 6 is a right side elevational view thereof.
Referenced Cited
Patent History
Patent number: D323173
Type: Grant
Filed: Jan 25, 1989
Date of Patent: Jan 14, 1992
Assignee: Tel Sagami Limited (Kanagawa)
Inventors: Katsumi Ishii (Fujino), Mitsuo Katoh (Sagamihara)
Primary Examiner: Bruce W. Dunkins
Assistant Examiner: Antoine D. Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/301,996
Type: Grant
Filed: Jan 25, 1989
Date of Patent: Jan 14, 1992
Assignee: Tel Sagami Limited (Kanagawa)
Inventors: Katsumi Ishii (Fujino), Mitsuo Katoh (Sagamihara)
Primary Examiner: Bruce W. Dunkins
Assistant Examiner: Antoine D. Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/301,996
Classifications
Current U.S. Class:
Miscellaneous (D15/199)