Thermal insulating finger pad

Description

FIG. 1 is a front elevational view of a thermal insulating finger pad showing my new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof in use, the hand shown in broken lines is for illustrative purposes only and forms no part of the claimed design.

The broken lines on the pad in FIGS. 1, 4 and 7 represents conventional stitching.

Referenced Cited
U.S. Patent Documents
D355051 January 31, 1995 Ives
580148 April 1897 Staples
1990553 February 1935 Koffler et al.
2069449 February 1937 Jensen
3228033 January 1966 Ames et al.
Patent History
Patent number: D368330
Type: Grant
Filed: Sep 14, 1994
Date of Patent: Mar 26, 1996
Assignee: Williamson Enterprises (Santa Monica, CA)
Inventor: Florida C. Robinson (Denver, CO)
Primary Examiner: Ruth McInroy
Law Firm: Benman, Collins & Sawyer
Application Number: 0/28,451
Classifications
Current U.S. Class: Potholder (D29/119)