Semiconductor element
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Description
FIG. 1 is a top, front perspective view of a semiconductor element showing my new design;
FIG. 2 is a front elevational view thereof; and,
FIG. 3 is a rear elevational view thereof.
Portions in broken lines are for illustrative purposes only and form no part of claimed design.
Claims
The ornamental design for a semiconductor element, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
D288557 | March 3, 1987 | Bois |
D359028 | June 6, 1995 | Siegel et al. |
D395423 | June 23, 1998 | Koyama et al. |
D395638 | June 30, 1998 | Koyama et al. |
D396696 | August 4, 1998 | Takagi et al. |
D418485 | January 4, 2000 | Kawafuji et al. |
D427977 | July 11, 2000 | Takizawa et al. |
- Catalog “Semiconductor '97 Package Manual,” “AS-A3,” Sony, 1997.
Patent History
Patent number: D448738
Type: Grant
Filed: Oct 4, 2000
Date of Patent: Oct 2, 2001
Assignee: Sony Corporation (Tokyo)
Inventor: Emiko Sekimoto (Tokyo)
Primary Examiner: Brian N. Vinson
Attorney, Agent or Law Firm: Rader, Fishman & Grauer, PLLC
Application Number: 29/130,541
Type: Grant
Filed: Oct 4, 2000
Date of Patent: Oct 2, 2001
Assignee: Sony Corporation (Tokyo)
Inventor: Emiko Sekimoto (Tokyo)
Primary Examiner: Brian N. Vinson
Attorney, Agent or Law Firm: Rader, Fishman & Grauer, PLLC
Application Number: 29/130,541
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;