Electrolytic plating anode
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The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.
Claims
The ornamental design for an electrolytic plating anode, as shown and described.
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Type: Grant
Filed: Jul 13, 2006
Date of Patent: Dec 30, 2008
Assignee: Ebara Corporation (Tokyo)
Inventors: Fumio Kuriyama (Tokyo), Masaaki Kimura (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Wenderoth, Lind & Ponack, L.L.P.
Application Number: 29/262,881