Light emitting diode package

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Description

FIG. 1 is a perspective view of a light emitting diode package showing the new design.

FIG. 2 is a front view thereof.

FIG. 3 is a rear view thereof.

FIG. 4 is a left side view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a top view thereof.

FIG. 7 is a bottom view thereof; and,

FIG. 8 is another perspective view thereof.

Claims

The ornamental design for a light emitting diode package, as shown.

Referenced Cited
U.S. Patent Documents
D512693 December 13, 2005 Kim et al.
D519943 May 2, 2006 Kamada
D597499 August 4, 2009 Kokubu et al.
D598872 August 25, 2009 In et al.
Patent History
Patent number: D608308
Type: Grant
Filed: Jan 21, 2009
Date of Patent: Jan 19, 2010
Assignee: Everlight Electronics Co., Ltd (Taipei)
Inventor: Chung-Chuan Hsieh (Taipei)
Primary Examiner: Selina Sikder
Attorney: Jianq Chyun IP Office
Application Number: 29/331,121
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)