Package for electronic device
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Those portions of the package for electronic device shown in broken lines are included for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a package for electronic device, as shown and described.
Type: Grant
Filed: Nov 14, 2008
Date of Patent: Feb 2, 2010
Assignee: Infineon Technologies AG (Neubiberg)
Inventors: Mario Feldvoss (Munich), Erich Griebl (Dorfen), Teck Sim Lee (Melaka), Juergen Schredl (Mering)
Primary Examiner: Nanda Bondade
Attorney: Dicke, Billig & Czaja, PLLC
Application Number: 29/327,873