LED light device
Latest NEOBULB TECHNOLOGIES, Inc. Patents:
- LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same
- LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same
- LED COMPONENT BY INTEGRATING EPITAXIAL STRUCTURE AND PACKAGE SUBSTRATE TOGETHER AND METHOD OF MANUFACTURING THE SAME
- LED lighting device
- LED LIGHT SOURCE
Description
The broken line showing is for the purpose of illustrating environmental structure and forms no part of the claimed design.
Claims
The ornamental design for a LED light device, as shown and described.
Referenced Cited
U.S. Patent Documents
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D595005 | June 23, 2009 | Chou |
D597246 | July 28, 2009 | Meyer et al. |
D597247 | July 28, 2009 | Meyer et al. |
D613443 | April 6, 2010 | Chen |
7712927 | May 11, 2010 | Shuai et al. |
7758214 | July 20, 2010 | Lee et al. |
20090201683 | August 13, 2009 | Chuan |
20090296414 | December 3, 2009 | Moriyama et al. |
20100039829 | February 18, 2010 | Tsai |
20100195327 | August 5, 2010 | Inoue et al. |
20100208461 | August 19, 2010 | Xiang et al. |
Patent History
Patent number: D625875
Type: Grant
Filed: Apr 9, 2010
Date of Patent: Oct 19, 2010
Assignee: NEOBULB TECHNOLOGIES, Inc.
Inventors: Jen-Shyan Chen (Hsinchu), Chung-Jen Lin (Taipei), Hsian-Lung Tan (Zhongli)
Primary Examiner: Angela J Lee
Attorney: Thomas, Kayden, Horstemeyer & Risley, LLP.
Application Number: 29/359,367
Type: Grant
Filed: Apr 9, 2010
Date of Patent: Oct 19, 2010
Assignee: NEOBULB TECHNOLOGIES, Inc.
Inventors: Jen-Shyan Chen (Hsinchu), Chung-Jen Lin (Taipei), Hsian-Lung Tan (Zhongli)
Primary Examiner: Angela J Lee
Attorney: Thomas, Kayden, Horstemeyer & Risley, LLP.
Application Number: 29/359,367
Classifications
Current U.S. Class:
Recessed Within Mounting Surface (D26/74)