Light emitting diode package

- Lextar Electronics Corp.
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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is another elevational view thereof.

Claims

The ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D578084 October 7, 2008 Kobayakawa
D608309 January 19, 2010 Kim
D628541 December 7, 2010 Lin
D632267 February 8, 2011 Chen et al.
D640995 July 5, 2011 Lin et al.
D640996 July 5, 2011 Lee et al.
20110127566 June 2, 2011 Yoon
Patent History
Patent number: D668235
Type: Grant
Filed: Nov 17, 2011
Date of Patent: Oct 2, 2012
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventors: Cheng-Ping Chang (Hsin Chu County), Che-Ming Hsu (Chang Hua County), Hui-Kai Hsu (Taitung)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts LLP
Application Number: 29/406,690
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)