Semiconductor device

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view shown in a used condition with a device shown in broken lines; and,

FIG. 10 is a front view shown in a used condition with a device shown in broken lines.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Patent History
Patent number: D719537
Type: Grant
Filed: Aug 16, 2013
Date of Patent: Dec 16, 2014
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Tatsuya Kawase (Chiyoda-ku), Noboru Miyamoto (Chiyoda-ku), Mikio Ishihara (Chiyoda-ku)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/464,434