Patents by Inventor Noboru Miyamoto
Noboru Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240039426Abstract: A control system of the present disclosure is a control system for controlling an operation of a power converter which performs power conversion between a motor for driving a vehicle and a power supply, and includes a data acquisition unit for acquiring data from equipment inside a vehicle and a control unit for reducing a drive frequency of a switching element included in the power converter when it is determined, on the basis of the data acquired by the data acquisition unit, that it is a state where a driver can allow a noise.Type: ApplicationFiled: February 17, 2021Publication date: February 1, 2024Applicant: Mitsubishi Electric CorporationInventor: Noboru MIYAMOTO
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Patent number: 11239123Abstract: A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).Type: GrantFiled: August 29, 2013Date of Patent: February 1, 2022Assignee: Mitsubishi Electric CorporationInventors: Tatsuya Kawase, Noboru Miyamoto, Mikio Ishihara, Junji Fujino, Yuji Imoto, Naoki Yoshimatsu
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Patent number: 11088045Abstract: A semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.Type: GrantFiled: July 22, 2015Date of Patent: August 10, 2021Assignee: Mitsubishi Electric CorporationInventors: Noboru Miyamoto, Masao Kikuchi
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Patent number: 11069593Abstract: Provided is a technique for preventing warps of cooling plates due to a contraction of a joining material, thereby preventing a reduction in cooling performance of a semiconductor device. The semiconductor device includes the following: a first cooling plate; a second cooling plate facing the first cooling plate; a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and a case containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip. The semiconductor chip is mounted in a semiconductor-chip mounting part between the first cooling plate and the second cooling plate. The case is provided with a portion corresponding to the semiconductor-chip mounting part and to surroundings thereof. The portion has an up-and-down width greater than an up-and-down width of the remaining portions of the case.Type: GrantFiled: February 21, 2018Date of Patent: July 20, 2021Assignee: Mitsubishi Electric CorporationInventors: Noboru Miyamoto, Taishi Sasaki
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Patent number: 10825751Abstract: In semiconductor device, a substrate unit includes an insulating substrate, a first conductor substrate and a second conductor substrate which are disposed on one main surface of the insulating substrate and spaced apart from each other, and a third conductor substrate which is disposed on the other main surface opposite to the one main surface of the insulating substrate. A terminal is connected to a surface of a semiconductor element opposite to the first conductor substrate. The terminal extends from a region above the semiconductor element to a region above the second conductor substrate while being connected to the second conductor substrate. At least a part of the terminal, the substrate unit and the semiconductor element is sealed by a resin. The third conductor substrate is exposed from the resin.Type: GrantFiled: April 1, 2016Date of Patent: November 3, 2020Assignee: Mitsubishi Electric CorporationInventors: Yosuke Nakata, Tatsuya Kawase, Mikio Ishihara, Noboru Miyamoto
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Patent number: 10388589Abstract: The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.Type: GrantFiled: November 25, 2015Date of Patent: August 20, 2019Assignee: Mitsubishi Electric CorporationInventors: Tatsuya Kawase, Mikio Ishihara, Noboru Miyamoto, Yosuke Nakata, Yuji Imoto
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Publication number: 20190067159Abstract: In semiconductor device, a substrate unit includes an insulating substrate, a first conductor substrate and a second conductor substrate which are disposed on one main surface of the insulating substrate and spaced apart from each other, and a third conductor substrate which is disposed on the other main surface opposite to the one main surface of the insulating substrate. A terminal is connected to a surface of a semiconductor element opposite to the first conductor substrate. The terminal extends from a region above the semiconductor element to a region above the second conductor substrate while being connected to the second conductor substrate. At least a part of the terminal, the substrate unit and the semiconductor element is sealed by a resin. The third conductor substrate is exposed from the resin.Type: ApplicationFiled: April 1, 2016Publication date: February 28, 2019Applicant: Mitsubishi Electric CorporationInventors: Yosuke NAKATA, Tatsuya KAWASE, Mikio ISHIHARA, Noboru MIYAMOTO
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Publication number: 20180374772Abstract: Provided is a technique for preventing warps of cooling plates due to a contraction of a joining material, thereby preventing a reduction in cooling performance of a semiconductor device. The semiconductor device includes the following: a first cooling plate; a second cooling plate facing the first cooling plate; a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and a case containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip. The semiconductor chip is mounted in a semiconductor-chip mounting part between the first cooling plate and the second cooling plate. The case is provided with a portion corresponding to the semiconductor-chip mounting part and to surroundings thereof. The portion has an up-and-down width greater than an up-and-down width of the remaining portions of the case.Type: ApplicationFiled: February 21, 2018Publication date: December 27, 2018Applicant: Mitsubishi Electric CorporationInventors: Noboru MIYAMOTO, Taishi SASAKI
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Publication number: 20180204784Abstract: The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.Type: ApplicationFiled: November 25, 2015Publication date: July 19, 2018Applicant: Mitsubishi Electric CorporationInventors: Tatsuya KAWASE, Mikio ISHIHARA, Noboru MIYAMOTO, Yosuke NAKATA, Yuji IMOTO
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Patent number: 9989939Abstract: A wireless device (1) searches a database that stores positional information of the wireless device (1), a device (2-4) and control identifiers for controlling the devices (2-4) in an associated manner, acquires a device (2-4) located near the wireless device (1) and a control identifier for controlling the device (2-4) based on the positional information of the wireless device (1), and, based on the device (2-4) and the control identifier for controlling the device (2-4) that have been acquired, determines a controlled device (at least one of the devices (2-4)) and generates a control identifier for the controlled device. The wireless device (1) transmits, by wireless communication, the generated controlled identifier to a receiver mounted on the controlled device to control the controlled device.Type: GrantFiled: March 26, 2013Date of Patent: June 5, 2018Assignees: NEC COMMUNICATION SYSTEMS, LTD., A SCHOOL CORPORATION KANSAI UNIVERSITY, ADVANCED TELECOMMUNICATIONS RESEARCH INSTITUTE INTInventors: Tetsuya Ito, Yukihiro Hara, Masahito Iwai, Yuma Asada, Yuta Okamoto, Shota Kakibuti, Ryou Nagase, Shohei Fukayama, Hironori Fukui, Noboru Miyamoto, Hiroyuki Yomo, Takatoshi Kimura, Suhua Tang, Akio Hasegawa
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Patent number: 9742285Abstract: A semiconductor device of the present invention includes a transistor having a drain and a source, a voltage being applied between the drain and the source from a high-voltage power supply, a drive device that generates a source voltage and a gate voltage for the transistor from a voltage of a low-voltage power supply lower than that of the high-voltage power supply, and a voltage dividing circuit connected to the low-voltage power supply, wherein when the source voltage is lower than a certain value, an output voltage from the voltage dividing circuit is applied to the source.Type: GrantFiled: September 13, 2012Date of Patent: August 22, 2017Assignee: Mitsubishi Electric CorporationInventors: Noboru Miyamoto, Fumio Wada
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Patent number: 9475535Abstract: A vehicle includes a center transmission plate, a first center turnable portion configured to turn about a first center turning axis extending in an up-down direction, a second center turnable portion configured to turn about a second center turning axis extending in a front-rear direction, a left transmission plate, a first left turnable portion configured to turn about a first left turning axis extending in the up-down direction, a second left turnable portion configured to turn about a second left turning axis extending in the front-rear direction, a right transmission plate, a first right turnable portion configured to turn about a first right turning axis extending in the up-down direction, and a second right turnable portion configured to turn about a second right turning axis extending in the front-rear direction. A tie rod is supported on the second center turnable portion, the second left turnable portion, and the second right turnable portion.Type: GrantFiled: September 24, 2013Date of Patent: October 25, 2016Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventors: Toshio Iizuka, Yosuke Hirayama, Yutaka Kubo, Takahiro Watanabe, Noboru Miyamoto, Kaoru Sasaki, Hirokatsu Ogawa
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Patent number: 9452806Abstract: At least a portion of a tie rod of a steering force transmitting mechanism overlaps with a portion of a first support member or a second support member when viewed from a front of a vehicle in a fully-tilted condition in which the vehicle body frame is fully tilted in the left-right direction. At least a portion of the tie rod is disposed below a second cross member, above a first front wheel and a second front wheel, behind a front end of the first front wheel and a front end of the second front wheel, and ahead of a first axis of a first side member and a second axis of a second side member when viewed from the left or right of the vehicle when the vehicle body frame is in an upright state.Type: GrantFiled: September 24, 2013Date of Patent: September 27, 2016Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventors: Yosuke Hirayama, Toshio Iizuka, Yutaka Kubo, Takahiro Watanabe, Noboru Miyamoto, Kaoru Sasaki, Hirokatsu Ogawa
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Patent number: 9418910Abstract: A circuit pattern is bonded to a top surface of a ceramic substrate. A cooling body is bonded to an undersurface of the ceramic substrate. An IGBT and a FWD are provided on the circuit pattern. A coating film covers a junction between the ceramic substrate and the circuit pattern, and a junction between the ceramic substrate and the cooling body. A mold resin seals the ceramic substrate, the circuit pattern, the IGBT, the FWD, the cooling body, and the coating film etc. The ceramic substrate has higher thermal conductivity than the coating film. The coating film has lower hardness than the mold resin and alleviates stress applied from the mold resin to the ceramic substrate. The circuit pattern and the cooling body includes a groove contacting the mold resin without being covered with the coating film.Type: GrantFiled: July 5, 2012Date of Patent: August 16, 2016Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Noboru Miyamoto, Naoki Yoshimatsu
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Patent number: 9362219Abstract: A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member. A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.Type: GrantFiled: May 9, 2013Date of Patent: June 7, 2016Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Tatsuya Kawase, Mikio Ishihara, Noboru Miyamoto
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Publication number: 20160118329Abstract: A partition in lattice form forms a plurality of housing sections. A plurality of circuit blocks including a semiconductor block and a terminal base block are electrically connected one to another in a state of being housed in the housing sections to form a power semiconductor circuit. The semiconductor block is formed by covering an IGBT with an insulating material. A collector of the IGBT is connected to an electrode through a metal plate. The electrode is led out from an inner portion of the insulating material to a side surface of the insulating material. A terminal base block includes a power terminal to which an external power wiring for supplying electric power to the IGBT is electrically connected, and a screw hole into which a screw for fixing the power wiring is inserted.Type: ApplicationFiled: January 6, 2016Publication date: April 28, 2016Applicant: Mitsubishi Electric CorporationInventor: Noboru Miyamoto
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Patent number: 9324630Abstract: A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.Type: GrantFiled: February 14, 2012Date of Patent: April 26, 2016Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Noboru Miyamoto, Masao Kikuchi
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Publication number: 20160111345Abstract: A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).Type: ApplicationFiled: August 29, 2013Publication date: April 21, 2016Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tatsuya KAWASE, Noboru MIYAMOTO, Mikio ISHIHARA, Junji FUJINO, Yuji IMOTO, Naoki YOSHIMATSU
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Publication number: 20160079155Abstract: A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member . A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.Type: ApplicationFiled: May 9, 2013Publication date: March 17, 2016Applicant: Mitsubishi Electric CorporationInventors: Tatsuya KAWASE, Mikio ISHIHARA, Noboru MIYAMOTO
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Patent number: D769834Type: GrantFiled: October 1, 2014Date of Patent: October 25, 2016Assignee: Mitsubishi Electric CorporationInventors: Tatsuya Kawase, Noboru Miyamoto, Mikio Ishihara