Semiconductor module
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The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals projects from the top surface. Each end in a longitudinal direction includes a mounting hole. Each corner includes a positioning boss.
Claims
The ornamental design for a semiconductor module, as shown and described.
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Type: Grant
Filed: May 22, 2014
Date of Patent: Mar 17, 2015
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventors: Satoru Motohashi (Nagano), Hideaki Takahashi (Nagano), Tatsuya Karasawa (Nagano), Kenshi Terashima (Nagano)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/491,549