Molded case for an electronic device

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Description

FIG. 1 is a front-elevational view of a molded case for an electronic device showing our new invention;

FIG. 2 is a rear-elevational view thereof;

FIG. 3 is a top-perspective view thereof;

FIG. 4 is a bottom-perspective view thereof;

FIG. 5 is a right side-elevational view thereof, with the left side being a mirror image thereof;

FIG. 6 is a front-perspective view thereof; and,

FIG. 7 is a rear-perspective view thereof.

Claims

The ornamental design for a molded case for an electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D639296 June 7, 2011 Tseng
D718294 November 25, 2014 Barfoot
D718756 December 2, 2014 Barfoot
D719145 December 9, 2014 Barfoot
D721370 January 20, 2015 Barfoot
9026181 May 5, 2015 Tani
D731494 June 9, 2015 Barfoot
D734760 July 21, 2015 Brunner
D736211 August 11, 2015 Kirkpatrick
D745505 December 15, 2015 Barfoot
D745525 December 15, 2015 Bates
20090201254 August 13, 2009 Rais
20120140396 June 7, 2012 Zeliff
Patent History
Patent number: D763854
Type: Grant
Filed: Oct 6, 2014
Date of Patent: Aug 16, 2016
Assignee: (Tainan)
Inventor: Hsu-Sheng Yu (Tainan)
Primary Examiner: Cynthia Underwood
Application Number: 29/504,418
Classifications
Current U.S. Class: Cover (D14/440)