Elastic membrane for semiconductor wafer polishing
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Claims
The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
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Type: Grant
Filed: Dec 21, 2017
Date of Patent: Sep 10, 2019
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Satoru Yamaki (Tokyo), Makoto Fukushima (Tokyo), Keisuke Namiki (Tokyo), Osamu Nabeya (Tokyo), Shingo Togashi (Tokyo), Tomoko Owada (Tokyo)
Primary Examiner: Selina Sikder
Application Number: 29/630,484