Gas nozzle for substrate processing apparatus

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Description

FIG. 1 is a front, top and left side perspective view of a gas nozzle for substrate processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 2 thereof;

FIG. 9 is an enlarged portion view taken along line 9-9 in FIG. 2 thereof; and,

FIG. 10 is an enlarged portion view taken along line 10-10 in FIG. 8.

The broken lines shown in the drawings represent portions of the gas nozzle for substrate processing apparatus that form no part of the claimed design.

Claims

We claim the ornamental design for a gas nozzle for substrate processing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
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D322470 December 17, 1991 Garlich
6553986 April 29, 2003 Liu
6851420 February 8, 2005 Jennings
D613116 April 6, 2010 Roberts
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D783351 April 11, 2017 Fujino
D847301 April 30, 2019 Yoshida
D851763 June 18, 2019 Mathews
20080171296 July 17, 2008 Yen
20100154775 June 24, 2010 Robinson
Patent History
Patent number: D888196
Type: Grant
Filed: Jul 5, 2018
Date of Patent: Jun 23, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Tokyo), Toru Kagaya (Tokyo), Hiroaki Hiramatsu (Tokyo), Shinya Ebata (Tokyo)
Primary Examiner: Derrick E Holland
Assistant Examiner: Andrew Kerr
Application Number: 29/655,565