Temporary protective film for manufacturing semiconductor devices

Description

1. Temporary protective film for manufacturing semiconductor devices

1.1 : Perspective

1.2 : Perspective

1.3 : Front

1.4 : Back

1.5 : Top

1.6 : Bottom

1.7 : Left

1.8 : Right

1.9 : A-A Sectional view

The article includes a core part and a film part, and is shown with the width of the core part as smaller than the width of the film part, and the film part is wound while partially protruding from the core part; this article is temporarily attached to a back of a lead frame when manufacturing a semiconductor device with only one side encapsulated and the lead frame on the back side exposed; the film part of this article has an adhesive layer on one side; since the core part does not protrude from the film part, this article can be easily positioned when set to equipment for manufacturing semiconductor devices, and it is possible to prevent this article from being misaligned when it is temporarily adhered to the back surface of the lead frame; reproduction 1.9 is a cross-sectional view taken along the line A-A of reproduction 1.7; the parts shown with solid lines in the drawings are parts for which a partial design registration is sought; the broken lines shown in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design; the parallel thin lines in the representation represent contours only and do not illustrate an ornamentation or decoration on the surface of the product.

Claims

The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.