Temporary protective film for manufacturing semiconductor devices
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Temporary protective film for manufacturing semiconductor devices
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The article includes a core part and a film part, and is characterized by the fact that the width of the core part is smaller than the width of the film part, and the film part is wound while partially protruding from the core part; each article is temporarily attached to a back of a lead frame when manufacturing a semiconductor device with only one side encapsulated and the lead frame on the back side exposed; the film part of each article has an adhesive layer on one side; since the core part does not protrude from the film part, each article can be easily positioned when set to equipment for manufacturing semiconductor devices, and it is possible to prevent the article from being misaligned when it is temporarily adhered to the back surface of the lead frame. The parallel thin lines in the representation represent contours only and do not illustrate an ornamentation or decoration on the surface of the product.
Claims
The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
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Type: Grant
Filed: Apr 22, 2021
Date of Patent: Sep 6, 2022
Assignee: SHOWA DENKO MATERIALS CO., LTD. (Tokyo)
Inventor: Naoki Tomori (Tokyo)
Primary Examiner: Rhea Shields
Application Number: 35/512,766