Sensor cover package
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The broken lines in the drawings are used to illustrate unclaimed environmental structure and form no part of the claimed design.
Claims
The ornamental design for a sensor cover package, as shown and described.
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Type: Grant
Filed: Nov 19, 2019
Date of Patent: Oct 25, 2022
Assignee: MURATA MANUFACTURING CO., LTD. (Kyoto)
Inventor: Toru Shimuta (Kyoto)
Primary Examiner: George D. Kirschbaum
Application Number: 29/713,813