Abstract: In wafer semiconductor manufacture, a method of etching an arsenic doped polysilicon layer down to a patterned boro-phospho-silicate-glass (BPSG) layer provided with a plurality of openings with an uniform etch rate is disclosed. The method relies on a combination of both system and process improvements. The system improvement consists to hold the wafer in the reactor during the etch process with an electrostatic chuck device to have a perfect plasma environment around and above the wafer. On the other hand, the process improvement consists in the use of a non dopant sensitive and not selective chemistry. A NF3/CHF3/N2 gas mixture with a 11/8.6/80.4 ratio in percent is adequate in that respect. The etch time duration is very accurately controlled by an optical etch endpoint detection system adapted to detect the intensity signal transition of a CO line at the BPSG layer exposure. The process is continued by a slight overetching.

Abstract: A method for forming HSG polysilicon with reduced dielectric bridging and increased capacitance. A first polysilicon layer is deposited and doped with impurities to increase conductivity. A second polysilicon layer is deposited at a reduced temperature to cause a nucleation of the second polysilicon layer. Grains are formed on the surface of the second polysilicon layer as a result of the nucleation. Next a wet etch is performed to remove portions of the polysilicon grains and portions of the first polysilicon layer. The duration of the wet etch is controlled to retain a roughened surface area. The size of the grains decreases during the wet etch and the distance between the grains increases. A dielectric layer is deposited to overlie the rough polysilicon following the wet etch. The thickness of the dielectric layer tends to be uniform thereby reducing bridging of the dielectric between the grains of the of the polysilicon.

Abstract: In one aspect, the invention encompasses a semiconductor processing method of forming a material over an uneven surface topology. A substrate having an uneven surface topology is provided. The uneven surface topology comprises a valley between a pair of outwardly projecting features. A layer of material is formed over the uneven surface topology. The layer comprises outwardly projecting portions over the outwardly projecting features of the surface topology and has a gap over the valley. The layer is etched, and the etching forms protective material within the gap while removing an outermost surface of the layer. The etching substantially does not remove the material from the bottom of the gap. In another aspect, the invention encompasses a semiconductor processing method of forming a material over metal-comprising lines. A first insulative material substrate is provided. A pair of spaced metal-comprising lines are formed over the substrate.

Abstract: A photo-resist etching mask is formed on a silicon oxide layer deposited on a polysilicon layer, and the silicon oxide and the polysilicon are respectively etched by using gaseous etchant containing CF4 and another gaseous etchant containing HBr and O2, wherein etching residue of fluorocarbon and a surface portion of the polysilicon layer are etched away by using Cl2 gas so as to pattern the polysilicon without undesirable influence of the etching residue.

Abstract: According to an example embodiment, the present invention is directed to a method for manufacturing a semiconductor device. The device comprises a light-reflective layer and an anti-reflective coating layer over the light-reflective layer. A material is located over the anti-reflective coating layer. The semiconductor is selectively etched using a non-polymerizing oxygen-rich fluorocarbon chemistry. By using an oxygen-rich fluorocarbon chemistry, the use of a polymerizing etchant is eliminated, making the manufacture of such devices simpler.

Abstract: A first layer of InP is deposited on a diffraction grating so as to cover it, by MOCVD in which PH3 or organophosphorus is used as a source material of P and in which H2 is used as a carrier gas. The substrate is heated up to a temperature which is higher than the substrate temperature during the first layer deposition, and then a second layer is deposited on the first layer. An active layer is deposited on the second layer. Found out is such a growth rate of an InP layer as to cause the photoluminescence intensity of a layer corresponding to the active layer to be one tenth as small as that when the InP layer is deposited at a growth rate of 0.

Abstract: A method for recovering the alignment mark on a substrate to the top of a dielectric layer. The method includes the steps of forming a dielectric layer over a substrate, and then forming a cap layer over the dielectric layer. The cap layer fills the trench in the dielectric layer directly above the alignment mark and covers the area surrounding the trench. Thereafter, a global planarization is carried out to remove the top portion of the cap layer. Finally, the remaining portion of the cap layer is removed to expose the dielectric layer so that an alignment mark re-emerges on top of the dielectric layer.

Abstract: The inventive method provides a wet cleaning of semiconductor devices on semiconductor wafers after photoresist is stripped. Semiconductor wafers are placed into a centrifuge carriage of a processing chamber. The centrifuge carriage rotates the semiconductor wafers. N-methylpyrrolidine heated to a temperature between 65° C. and 85° C. is sprayed onto the semiconductor wafers. Next N-methylpyrrolidine at room temperature is sprayed onto the semiconductor wafers. Finally, water at room temperature is sprayed onto the semiconductor wafers. The inventive method provides high throughput cleaning without undue corrosion or damage to metal layers.

Abstract: An apparatus for etching a glass substrate includes a first bath containing an etchant, at least one porous panel having a plurality of jet holes in the first bath, the porous panel containing the etchant to jet the etchant against the glass substrate, a container storing the etchant, and a pump supplying the etchant from the container to the porous panel, the pump being connected to the container and the porous panel.

Abstract: A polishing pad for CMP is rapidly preconditioned before actual use by impinging a stream of particles on the polishing surface. Embodiments of the present invention include linearly traversing an impinging jet stream of unagglomerated ceramic particles, e.g., silicon dioxide particles having a particle size of about 5 to about 50 nm, across the polishing surface of a rotating polishing pad to effect preconditioning in less than about 5 minutes.

Abstract: In a method for forming an interconnection structure, first, second and third insulating films and a thin film are sequentially formed over lower-level metal interconnects. Then, the thin film is masked with a first resist pattern and etched to form a mask pattern with openings for interconnects. Next, the third insulating film is masked with a second resist pattern and dry-etched such that the third insulating film and the first and second resist patterns are etched at a high rate and that the second insulating film is etched at a low rate to form openings for contact holes in the third insulating film and remove the first and second resist patterns. Then, the second insulating film is masked with the third insulating film and dry-etched such that the second insulating film is etched at a high rate and that the first and third insulating films are etched at a low rate to form the openings for contact holes in the second insulating film.

Abstract: A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first plate-like base substrate has a base electrode on the rear surface thereof. A second plate-like base substrate is connected to the primary surface of the first plate-like base substrate, and the second plate-like base substrate has a substantially same extrapolated outer shape in a plane parallel to the primary surface of the first plate-like base substrate. The second plate-like base substrate has a penetrating hole perpendicular to the primary surface of the first plate-like base substrate. A plate-like cap member is connected to the second plate-like base substrate to cover the penetrating hole in the second plate-like base substrate.

Abstract: It is an object of the present invention to provide a process for a fluorine containing carbon film (a CF film), which can put an interlayer insulator film of a fluorine containing carbon film into practice.

Abstract: A semiconductor fabrication method is provided for the fabrication of a dual-damascene structure in an integrated circuit with a multilevel-interconnect structure. This method is characterized in that, after the dual-damascene hole is formed, a conformal barrier/adhesive layer is first formed over all the sidewalls of the dual-damascene hole, but not filling the dual-damascene hole. An anisotropic etching process is then performed to etch away the part of the conformal barrier/adhesive layer that is laid at the bottom of the dual-damascene hole and subsequently the underlying part of the topping layer until exposing the metallization layer. Finally, a conductive material, such as copper, is deposited into the remaining void portion of the dual-damascene hole. The deposited conductive material and the remaining part of the conformal barrier/adhesive layer in the dual-damascene hole in combination constitute the intended dual-damascene structure.

Abstract: A method of etching a silicon layer in a plasma etching reactor to form an ultra deep opening is disclosed. The method includes the steps of providing a semiconductor substrate including the silicon layer into the plasma etching reactor and flowing an etching gas that includes an oxygen reactant gas, a helium gas, and an inert bombardment-enhancing gas into the plasma etching reactor. The method further includes striking a plasma using the etchant gas chemistry, and then providing an additive gas having SF6 into the plasma etching reactor subsequent to striking the plasma. The method continues with etching an opening at least partially through the silicon layer using this plasma.

Abstract: In a semiconductor device manufacturing method includes the steps of uniformly applying a first photoresist onto a first layer on a semiconductor substrate, a first resist pattern is formed out of the first photoresist by using a first photomask. The first layer is etched by using the resist pattern, thereby forming a first pattern. A second photoresist is uniformly applied onto the semiconductor substrate where the first pattern is formed. A second resist pattern is formed out of the second photoresist by using a second photomask. The first pattern is etched by using the second photoresist, thereby forming a second pattern constituted by the first layer. A semiconductor device fabricated by this method is also disclosed.

Abstract: Semiconductor integrated devices such as transistors are formed in a film of semiconductor material formed on a substrate. For improved device characteristics, the semiconductor material has regular, quasi-regular or single-crystal structure. Such a structure is made by a technique involving localized irradiation of the film with one or several pulses of a beam of laser radiation, locally to melt the film through its entire thickness. The molten material then solidifies laterally from a seed area of the film. The semiconductor devices can be included as pixel controllers and drivers in liquid-crystal display devices, and in image sensors, static random-access memories (SRAM), silicon-on-insulator (SOI) devices, and three-dimensional integrated circuit devices.

Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.

Abstract: A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44/55, wherein at least the first edge region 44 is defined along the first edge 22; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55, wherein the second array 88 is substantially a duplication or a mirror image of the first array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88.

Abstract: A conduction assist member has conductive members disposed in some or all through holes which are formed in a large number in a sheet made of an insulating elastic material. The conduction member is a cut piece which is fixed to the sheet at one end thereof and has two or more blades formed by one, two or more cuts. In the conduction assist member, one or some of the two or more blades formed on each cut piece, are bent toward one of two opening portions of the through hole so that ends of the blades formed on the cut pieces protrude from the opening portion on the same surface of the sheet. The conduction assist member can be applied as a connector to both a flat conduction surface and a curved conduction surface, and as an integrated circuit socket which can easily cope with differences in sizes of connectors and sockets, which is superior in high speed performance and usable as an integrated circuit socket for mounting, and which can easily be assembled.

Abstract: An electronic device comprising at least a first part 42 and a second part 43, the first part and second part being movable between a first closed position and a second open position. The device has a hinge 44 for coupling together the first part and the second part, the hinge providing an axis of rotation and including a knuckle 45 on the first part and a knuckle 46 on the second part. An electrical connector 2 is provided for connecting electronic components housed in the first part 42 and the second part 43, said connector being routed via the hinge 44. The electrical connector 2 comprises an elongate body having a helical turn 32 along its length which helical turn 32 extends from within the knuckle 44 on the first part to within the knuckle 45 on the second part.

Abstract: A spring holder 25 containing coiled springs 41 is installed in a female housing 11. When a male housing 1 and this female housing 11 are fitted together, a locking arm 20 rises over a stopping protrusion 7, a restraining wall 39 simultaneously engages a locking claw 22, and the coiled springs are compressed. The locking claw 22 makes contact with a contacting face of the restraining wall 39, this contacting face being a tapered face 40. When the locking arm 20 is about to pass over the stopping protrusion 7 to return to its original position, the restraining wall 39 receives a spring force F from the coiled springs and pushes the locking arm 20. A component force F1 in a returning direction of the locking arm 20 is obtained from this spring force F due to the tapered face 40. The component force F1 and the returning force of the locking arm 20 itself cause the locking arm 20 to return smoothly, and the locking arm 20 thus engages with the stopping protrusion 7.

Abstract: A terminal connection comprising a U-shaped spring The disclosure is of a terminal connection between a knife contact (1) and a terminal receiver (2) made of metallised plastic, the terminal receiver (2) having an opening (3) with metallised walls (3) into which a prestressed U-spring (4) is pressed and resiliently receives a knife contact (1).

Abstract: A connector including a plug, and outlet and a connecting block each of which provides enhanced performance by reducing crosstalk. The plug includes contacts having a reduced amount of adjacent area between neighboring contacts and a load bar that staggers the wires to be terminated to the contacts. An outlet which mates with the plug includes contacts positioned in a contact carrier so that adjacent area between neighboring contacts is reduced. A connecting block includes pairs of contacts wherein the distance between contacts in a pair is smaller than the distance between sets of pairs. The connecting block also includes an improved tip that reduces untwisting of wire coupled to the connecting block.

Abstract: A reversible fabric particularly for use in the production of military rainflies is described. The fabric has first and second faces, each of which has a visually distinct color in order that rainflies and other articles made from the fabric can be used to provide inconspicuous shelter in two visually distinct environments. Each of the sides of the fabric provides requisite degrees of visual opacity and infrared reflectance, as well as other functional properties—such as water-resistance, etc. The fabric includes a dyed textile substrate and three coats of pigmented polyurethane having varying compositions; the composite fabric can be produced by a coating and/or laminating process.

Abstract: The instant invention pertains to action figures having a female connection formed on the back and a belt or theme mounting having a plurality of male connectors. The action figures may pertain to a sport such as wrestling or baseball, or a super hero or other famous person. The action figure is connected to the belt for wearing a group of related action figures. A second embodiment consists of a theme mount such as a bat or hockey stick.

Abstract: A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

Abstract: In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.

Abstract: A hand tool is used for resizing bent, broken, warped or swollen tongue-in-groove panels or planks or boards. The tool has cutting tools mounted on its sides so as to be inserted into a groove for cutting the groove to size or opposing cutting surfaces for sizing a tongue. The tool is fastened by a simple clamp or clamps and has a handle for manipulation.

Abstract: The present invention includes backscatter communication systems, interrogators, methods of communicating in a backscatter system, and backscatter communication methods. According to one aspect of the present invention, a backscatter communication system includes an interrogator including a transmitter configured to output a forward link communication and a receiver configured to receive a return link communication having a carrier signal, the receiver being configured to reduce the amplitude of the carrier signal of the return link communication; and a communication device configured to modulate the carrier signal to communicate the return link communication responsive to reception of the forward link communication.

Abstract: A signal having a substantially uniform spectral distribution, e.g., a flat noise signal such as a signal ground, is provided at the input of a bandpass filter such as an IF filter of a receiver circuit, to thereby produce an output signal at the output of the bandpass filter. The output signal is processed in a limiter to produce a limited signal. An average frequency of the limited signal is determined, and the bandpass filter is adjusted based on the determined average frequency. According to one embodiment of the present invention, the bandpass filter comprises a Gm-C filter having a transconductance, and the filter is adjusted by adjusting the transconductance of the Gm-C filter based on the determined average frequency. According to another aspect of the present invention, a desired center frequency for the bandpass filter is identified. A resolution and a desired confidence interval are also identified.

Abstract: In a data transmission system, a transmitter adds control data to transmission data, and modulates the resultant signal by a predetermined modulation method, and sends the result in a wireless manner. A receiver detects a reception power intensity by use of the control data contained in the transmitted signal. A random pattern is used for a reception-power detecting portion for detecting a reception power intensity, which is contained in the control data.

Abstract: A method and apparatus for storing and accessing a preferred roaming list formed of variable size system records each of which includes a system identification field, a network identification included field, a preferred_negative field, a geographical region indicator field, and an acquisition parameter information field. Each of the system records optionally includes a network identification field, a priority field, and a roaming indicator field. The network identification, priority and roaming indicator fields from the records are stored in a first array; the system identification and geographical region indicator fields are stored in a second array; the first bit of the network identification included and the preferred_negative fields are stored in a third array; the second bit of the network identification included fields from the records are stored in a fourth array; and the acquisition parameter information fields are stored in a fifth array.

Abstract: The invention relates to a method of performing handover in a mobile radio system. The mobile radio system performs quality measurements on signals transmitted (300) between a mobile terminal and predetermined radio base stations. Handover is performed (301, 302, 303) when some of the measured signal strengths exceeds the signal strength for the radio base station to which the mobile terminal for the moment is set up, added to a handover value. The handover value is dependent on measured signal strengths and neighboring cell relation values. The neighboring cell relation values depend on a probability for handover to be performed from one radio base station to another radio base station in the mobile radio system.

Abstract: A position measuring apparatus according to the present invention includes a first position measuring means for position measuring a first position by receiving a first radio wave, a second position measuring means for position measuring a second position by receiving a second radio wave, an evaluating means for evaluating uncertainty of data derived from the first position measuring means and/or the second position measuring means, and a selecting means for selecting data from the first position measuring means or the second position measuring means based on an output signal of the evaluating means.

Abstract: Methods are provided for determining and enhancing the service efficiency of mobile communications. To assess communication efficiency in each communication region of interest, a signal-fading record is generated for that region and this record is then analyzed to find availability and energy cost for each of a plurality of power-control parameter sets. The results facilitate the selection of power-control parameter sets that enhance system efficiency in each communication region.

Abstract: A signal wire connecting between a hand-free receiver and a mobile telephone includes a first side having a hand-free receiver plug co-operating with the hand-free receiver so as to be connected to the main circuit of the hand-free receiver, and a second side having a mobile telephone plug co-operating with the output receptacle of the mobile telephone so as to be connected to the mobile telephone. In such a manner, the mobile telephone plug includes a voltage control leg provided with a first branch resistor which is adapted to match the power supply circuit of the hand-free receiver to obtain the exact voltage supply value of the mobile telephone, which can be outputted to the power supply input leg of the mobile telephone to function as the power supply of the mobile telephone.

Abstract: A battery or battery pack for a portable radio telephone is provided with a machine readable identification on its exterior. An electrical device, such as a portable radio telephone main unit and/or battery charger, has a battery identifier for reading or sensing the identification. Based upon the identification read by the identifier, the electrical device can prevent or establish an operational electrical connection with the battery cells in the battery.

Abstract: A video game apparatus includes an external ROM. This external ROM is previously memorized with player object data, basic shadow object data and light object data. A direction in which a shadow is thrown is determined according to the player object data and the light object data, to thereby determine a length of each leg of the player object. Based on the length of the leg and the height of the light, a length of the shadow is determined. Based on the height of each leg, a depth of the shadow is determined. A shape of a displaying shadow object is determined from a state of a ground object to which the shadow is thrown.

Abstract: A coupling device is designed with a flywheel mass which faces a drive and is operatively connected, such that they rotate together, to a driver which acts on the drive. A holder is provided on the flywheel mass, which holder faces the driver and is provided with a tooth system. The driver has an axial attachment, which is likewise designed with a tooth system at its end which faces the holder. At least one tooth of the tooth system of the axial attachment is pressed, with radial prestressing, into the tooth gap between in each case two teeth of the tooth system of the holder.

Abstract: A propeller shaft for automobiles includes a cylindrical main body 1 made of FRP and joints 2 that are joined to the ends of this main body by press fitting, the main body 1 having a main layer 1a extending over the entire length thereof and including reinforcing fibers helically wound at an angle of ±5˜30′ with respect to the axial dimension of the main body, and sub-layers 1b formed at the ends of the main body so as to be integral with and internally of the main layer 1a and including hooped reinforcing fibers. Each joint 2 has a slope 2c descending toward the joint surface between this joint and the main body 1, an erect surface 2d having an outer diameter not larger than the outer diameter of the sub-layers 1b and abutting the end surface of the associated sub-layer 1b, or a wedge 2f the tip of which is opposed to the interface between the main layer 1a and the associated sub-layer 1b.

Abstract: A golf club includes an electroactive assembly attached to the club and electrically tuned to capture energy from one or more vibrational modes with high efficiency. More generally, a sports implement includes an electroactive element, such as a piezoceramic sheet attached to the implement, and a circuit attached to the electroactive element. The circuit may be a shunt, or may include processing such as amplification and phase control to apply a driving signal which may compensate for strain sensed in the implement, or may simply alter the stiffness to affect performance. The electroactive element is located in a region of high strain to apply damping, and may include plural subassemblies mounted to capture energy in different planes, or to capture an asymmetric strain distribution while maintaining structural symmetry. In a ski the element captures between about one and five percent of the strain energy of the ski.

Abstract: Disclosed is a set of golf clubs. The clubs are divided into at least a first group and at least a second group of golf clubs. The first group desirably comprises a plurality of club heads each having a main body of low density metallic material. The second group of golf clubs desirably comprises a plurality of club heads each having a main body of higher density metallic material than the density of the metallic material of the main body of each of the heads of the first group. The first group of clubs desirably comprises lower numbered clubs than the second group of clubs.

Abstract: A golf shaft for attachment to a hossel of a club head, said shaft comprising: (a) a first section comprising a first material and having a hossel end and a first joint end, said first section having a linear weight no greater than 2.4 g/in; (b) a second section comprising a second material and having a butt end and a second joint end, said second joint end being connected to said first joint end; (c) wherein said second material is less dense than said first material; and (d) wherein said first material has a shear modulus greater than that of said second material.

Abstract: In the metal iron golf club head (1), the rigidity of the medium sensitivity region (5) which is a region on the heel side and excluding the vicinity of the face center (3) is made lower than the rigidity of the low sensitivity region (4) so as to approximate the natural frequency of the metal iron golf club head to the natural frequency of the ball as well as to ensure the strength in the face portion (2).

Abstract: An iron type golf club head having a unique weighting, stabilizing and reinforcing configuration for the rear face of a cavity back, peripheral weight club head. At least one dominant secondary weight member is combined with at least one auxiliary reinforcing and stabilizing weight member extending from an innermost secondary weight member surface across the rear face of the rear cavity.

Abstract: The invention is related to a rotational speed converter comprising shafts (1, 2) with bevelled gears fixed thereon, separate bevelled gears (3, 4) which cooperate with said gears fixed onto said shafts and are mounted on a separate shaft (5), a planetary gear (6) connected to said separate shaft, and at least one braking gear (7) acting on said planetary gear.

Abstract: A multi-function exercise machine includes a base structure that defines an exercise position. A lever is provided on the base structure for pivotal movement about an axis. The axis is located between opposite end portions of the lever. A handle is associated with the lever so as to be engaged by an exerciser to move the handle about the axis in an upward direction to a raised position and in a downward direction toward to a raised position and in a downward direction toward a lowered position. A first connector is provided on one end portions of the lever to apply selectively a first resistance against movement of the handle in the upward direction. A second connector is provided on the opposite end portion of the lever to apply selectively a second resistance against movement of the handle in the downward direction.

Abstract: A stackable weight plate for an exercise machine weight stack has a front edge, a rear edge, opposite side edges, an upper face, a lower face, and an aperture extending between the upper and lower face for receiving a weight stack selector stem. The front and rear edges having a matching arcuate curvature with one edge being convex and the other edge being concave, and the side edges are tapered at an angle from the front edge to the rear edge.

Abstract: A paint roller frame which securely retains a paint roller cover thereon during painting and which permits the roller cover to be easily removed therefrom is disclosed. The paint roller frame includes a cage assembly comprising a cage body and oppositely disposed end caps having bores therein permitting the passage of the paint roller frame therethrough. The inboard end cap includes a plurality of circumferentially spaced-apart longitudinally extending ribs which securely engage the inner surface of the paint roller cover during the painting process and which permit the easy removal of the roller cover therefrom when painting has been completed or when the roller cover needs replacement.