Patents Issued in September 17, 2013
  • Patent number: 8536443
    Abstract: The present invention relates to a back sheet for solar cell and a method of manufacturing the same. The back sheet for solar cell comprises a substrate and a fluoropolymer layer, wherein the components by weight of the fluoropolymer layer are as follows: 25˜45 parts of fluororesin; 1.5˜3 parts of modified resin; 0.5˜3 parts of polymeric filler; 0.1˜1 parts of inorganic filler; and 50˜70 parts of solvent. The back sheet for solar cell provided by the present invention has low cost and excellent performances, such as high peeling strength, good waterproof performance, and good weathering resistance. The method of manufacturing the back sheet for solar cell provided by the present invention is simple in process, and thus can achieve continuous industrial production.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: September 17, 2013
    Assignees: China Lucky Film Group Corporation, Lucky Film Co., Ltd.
    Inventors: Gang Li, Xingming Li, Tianren Liu, Xuejian Zhang, Jing Zou
  • Patent number: 8536444
    Abstract: Extremely high efficiency solar cells are described. Novel alternating bias schemes enhance the photovoltaic power extraction capability above the cell band-gap by enabling the extraction of hot carriers. In conventional solar cells, this alternating bias scheme has the potential of more than doubling their yielded net efficiency. In solar cells incorporating quantum wells (QWs) or quantum dots (QDs), the alternating bias scheme has the potential of extending such solar cell power extraction coverage, possibly across the entire solar spectrum, thus enabling unprecedented solar power extraction efficiency. Within such cells, a novel alternating bias scheme extends the cell energy conversion capability above the cell material band-gap while the quantum confinement structures are used to extend the cell energy conversion capability below the cell band-gap.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: September 17, 2013
    Assignee: Ostendo Technologies, Inc.
    Inventors: Hussein S. El-Ghoroury, Dale A. McNeill, Selim E. Guncer
  • Patent number: 8536445
    Abstract: A method of forming a multijunction solar cell comprising an upper subcell, a middle subcell, and a lower subcell comprising providing first substrate for the epitaxial growth of semiconductor material; forming a first solar subcell on said substrate having a first band gap; forming a second solar subcell over said first subcell having a second band gap smaller than said first band gap; and forming a grading interlayer over said second subcell having a third band gap larger than said second band gap forming a third solar subcell having a fourth band gap smaller than said second band gap such that said third subcell is lattice mismatched with respect to said second subcell.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: September 17, 2013
    Assignee: Emcore Solar Power, Inc.
    Inventors: Arthur Cornfeld, Mark A. Stan
  • Patent number: 8536446
    Abstract: Multijunction solar cells that may include a first solar subcell with a first band gap, and a second solar subcell disposed over the first solar subcell and having a second band gap smaller than said first band gap. The solar cells may also include a grading interlayer disposed over the second solar subcell that may include a third band gap greater than the second band gap. The grading interlayer may not include phosphorus. The solar cells may also include a third solar subcell disposed over the interlayer that is lattice mismatched with respect to the second solar subcell. The third solar subcell may have a fourth band gap smaller than the third band gap.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: September 17, 2013
    Assignee: Emcore Solar Power
    Inventors: Arthur Cornfeld, Mark A. Stan
  • Patent number: 8536447
    Abstract: A fabricating method of an electrode of a solar cell includes forming a first electrode layer on a photoelectric conversion layer, forming an antireflective layer on the photoelectric conversion layer to cover the first electrode layer, forming a second electrode layer on the antireflective layer, and performing a sintering process. A material of the first electrode layer does not react with the photoelectric conversion layer and the antireflective layer during the sintering process, while at least a material of the second electrode layer reacts with the antireflective layer during the sintering process. The sintering process is performed, such that the second electrode layer reacts with the antireflective layer, and the second electrode layer penetrates the antireflective layer to electrically connect the first electrode layer.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: September 17, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Chen-Hsun Du, Shih-Peng Hsu, Han-Chang Liu
  • Patent number: 8536448
    Abstract: A structure to provide a Zener diode to avoid shunt formation is disclosed. An undoped or lightly doped monocrystalline thin semiconductor lamina is cleaved from a donor body which is not permanently affixed to a support element. The lamina may be annealed at high temperature to remove damage from a prior implant. At least one aperture is formed through the lamina, either due to flaws in the cleaving process, or intentionally following cleaving. Heavily doped amorphous silicon layers having opposite conductivity types are deposited on opposite faces of the lamina, one forming the emitter and one a base contact to a photovoltaic cell, while the lamina forms the base of the cell. The heavily doped layers contact in the aperture, forming a Zener diode. This Zener diode prevents formation of shunts, and may behave as a bypass diode if the cell is placed under heavy reverse bias, as when one cell in a series string is shaded while the rest of the string is exposed to sun.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: September 17, 2013
    Assignee: GTAT Corporation
    Inventor: Christopher J Petti
  • Patent number: 8536449
    Abstract: Insulated wires for use in electronic equipment have an electrically conductive core and an insulating layer and/or a insulating jacket formed of a flame retardant thermoplastic composition surrounding the electrically conductive core. The flame retardant thermoplastic composition includes (A) a thermoplastic copolyester elastomer and/or a copolyamide elastomer as a thermoplastic polymer component, (B) a metal salt of a phosphinic acid and/or a diphosphinic acid and/or a polymer thereof, (C) a nitrogen containing flame retardant synergist and/or a phosphor/nitrogen containing flame retardant as a flame retardant component, and (D) an inorganic compound chosen from basic and amphoteric oxides, hydroxides, carbonates, silicates, borates, stannates, mixed oxide-hydroxides, oxide-hydroxide-carbonates, hydroxide-silicates and hydroxide-borates, and mixtures thereof.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: September 17, 2013
    Assignee: DSM IP Assets B.V.
    Inventors: Angelika Schmidt, Christiaan Schröder
  • Patent number: 8536450
    Abstract: A sheath is disclosed which provides protection against radiation. The sheath surrounds or is configured to surround at least a neutral cable, a earth cable and a phase cable which are all connected to the power grid. The sheath includes an outer layer made from electrically insulating plastic which covers an inner layer made from electrically conductive material, elements being provided to connect the layer of electrically conductive material to an electrical conductor intended to be earthed. The conductor to be earthed takes the form of a wire, all or part of which is made from electrically conductive material that extends internally along the entire length of the sheath and which is in electrical contact, at least along part of the length thereof, with the inner layer of electrically conductive material.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: September 17, 2013
    Assignee: Rayponse
    Inventor: Christian Aumoitte
  • Patent number: 8536451
    Abstract: A high-voltage connection between two post insulators which can be moved relative to one another. In order to be able to implement such a high-voltage connection in the most compact form possible with regard to insulating air gaps, the high-voltage connection has a current conduction rod, which is surrounded by an insulating body and mounted at one end thereof on the one post insulator at an adjustable distance and at the other end thereof is held on the other post insulator. Outgoing current leads are connected to each end of the current conduction rod. An electric rail vehicle has at least two cars, each having a high-voltage line run in the roof and each having a post insulator on the roof in the area of the mutually facing ends of the cars. The high-voltage connection according to the invention is used in order to achieve an aerodynamically favorable design in the bridging area of the roof area of the cars.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: September 17, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventor: Gerhard Schmidt
  • Patent number: 8536452
    Abstract: An adjustable variable ring for electrical junction boxes including a base frame having a guide tab, a sliding insert having a box shaped frame, the sliding insert being configured to slide in and out of the base frame. A ratchet mechanism having a ratchet plate on the base frame including a plurality of steps, and a ratchet spring installed on an inner wall of the box shaped frame including an angled end tab and an angled mid tab protruding from the box shaped frame for engaging one or more of the plurality of steps. The sliding insert is configured to slide in and out of the base frame by disengaging the mid tab from the one or more of the steps by pressing on the end tab, and locks in the base frame by engaging the mid tab with the one or more of the steps.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: September 17, 2013
    Assignee: Orbit Industries, Inc.
    Inventor: Afshin Jafari
  • Patent number: 8536453
    Abstract: A waterproof device for receiving an electronic device is disclosed. The waterproof device includes a housing including an outer surface. A receiving case including a body and covering portion extends from the body. The body is inside of the housing, and the covering portion abuts the outer surface of the housing. The body receives an object to be waterproofed. A cover is secured to the covering portion. A first installation washer is secured between the covering portion and the outer surface of the housing, the first installation washer seals a first gap between the housing and the covering portion. A second installation washer is secured to the cover and abuts each edges of the body, the second installation washer seals a second gap between the cover and the body.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: September 17, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Gang-Qiang Qin
  • Patent number: 8536454
    Abstract: A housing system for covering a receptacle mounted on a board includes a base, a first flap and a second flap. Each of the first and second flaps has a proximal end, a distal end and an intermediate portion between the proximal and distal ends. Each of the first and second flaps is mounted to the first and second opposing walls of the base such that each of the first and second flaps pivotally moves about a connection point with each of the first and second opposing sidewalls at the proximal end of each of the first and second flaps, between a first position and a second position. In the first position, the intermediate portions of each of the first and second flaps are a first distance from each other and the distal ends of the first and second flaps are a second distance from each other. The second distance is greater than the first distance.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: September 17, 2013
    Assignee: EMC Corporation
    Inventors: Mingchang Wang, Qingqiang Guo
  • Patent number: 8536455
    Abstract: A high performance data cable which has an interior support or star separator. The star separator or interior support extends along the longitudinal length of the data cable. The star separator or interior support has a central region. A plurality of prongs or splines extend outward from the central region along the length of the central region. Each prong or spline is adjacent with at least two other prongs or splines. The prongs or splines may be helixed or S-Z shaped as they extend along the length of the star separator or interior support. Each pair of adjacent prongs or splines defines grooves which extend along the longitudinal length of the interior support. At least two of the grooves have disposed therein an insulated conductor. The interior support can have a first material and a different second material. The different second material forms an outer surface of the interior support.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: September 17, 2013
    Assignee: Belden Inc.
    Inventors: Galen Mark Gareis, Paul Z Vanderlaan
  • Patent number: 8536456
    Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: September 17, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Shou-Kuo Hsu, Hsien-Chuan Liang, Shin-Ting Yen, Dan-Chen Wu
  • Patent number: 8536457
    Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: September 17, 2013
    Assignee: Ibiden Co., Ltd.
    Inventor: Michimasa Takahashi
  • Patent number: 8536458
    Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: September 17, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
  • Patent number: 8536459
    Abstract: A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: September 17, 2013
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Voya Markovich, Timothy Antesberger, Frank D. Egitto, William Wilson, Rabindra N. Das
  • Patent number: 8536460
    Abstract: A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 ?m. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: September 17, 2013
    Assignee: Asia Electronic Material Co., Ltd.
    Inventors: Chih-Ming Lin, Shou-Jui Hsiang, Chien-Hui Lee
  • Patent number: 8536461
    Abstract: A printed circuit board comprising a hard portion of at least one main hard PCB, and at least one secondary hard PCB; and a flexible portion to connect the main hard PCB to the secondary hard PCB both physically and electrically and enabling the secondary hard PCB to move in relation to the main hard PCB.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Kuo-Hsiang Ouyang, Yao-Shun Tseng, Hone-Wei Tang
  • Patent number: 8536462
    Abstract: A flex circuit package includes a package body enclosing an electronic component and a first surface of the substrate. Columns are physically and electrically connected to first traces of the substrate, the columns extending through the package body. A flexible circuit connector has first terminals connected to the columns. The flexible circuit connector further includes second terminals that provide an electrical interconnection structure for electrical connection to a second electronic component structure. By connecting the flexible circuit connector to the columns extending through the package body, special routing of traces of the substrate of the flex circuit package to provide an interface for the flexible circuit connector is avoided.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: September 17, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Robert Francis Darveaux, Ludovico E. Bancod, Marnie Ann Mattei, Timothy Lee Olson
  • Patent number: 8536463
    Abstract: A method for manufacturing a printed-circuit board including: a capacitive element forming step of embedding a capacitive element in a substrate resin layer inside a substrate that includes a plurality of wiring layers laminated with the substrate resin layer interposed in between, the capacitive element forming step including forming a lower electrode using a conductive layer on one of the plurality of wiring layers, or using one of the plurality of wiring layers; forming a crystalline metal oxide-containing capacitor dielectric film at a temperature at or below a heat-resistant temperature of the substrate resin layer, and at or above room temperature; and forming an upper electrode on an upper surface of the capacitor dielectric film on the side opposite to the lower electrode.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 17, 2013
    Assignee: Sony Corporation
    Inventors: Mitsuharu Shoji, Kiwamu Adachi
  • Patent number: 8536464
    Abstract: A multilayer substrate is provided with a conductor plane region in which a plurality of conductor planes are disposed; a clearance region disposed adjacent to the conductor plane region so that the plurality of conductor planes are excluded from the clearance region. A plurality of signal vias are disposed through the clearance region so that the plurality of signal vias are isolated from the plurality of conductor planes. A conductor post is connected to one of the plurality of conductor planes and disposed between two of the signal vias in the clearance region.
    Type: Grant
    Filed: May 26, 2008
    Date of Patent: September 17, 2013
    Assignee: NEC Corporation
    Inventors: Taras Kushta, Jun Sakai, Hikaru Kouta
  • Patent number: 8536465
    Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 17, 2013
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Kobayashi
  • Patent number: 8536466
    Abstract: According to one embodiment, a terminal box includes a box case placed on and fixed to a back film of a solar cell string and a terminal panel formed on the box case. The box case includes a case main body placed on and fixed to the back film of the solar cell string and a terminal panel fixing portion for placing and fixing the terminal panel above the case main body. An opening for passing an output lead wire through the terminal panel is formed continuously from the bottom face of the case main body to the top face of the terminal panel. One edge of the terminal panel is provided so as to protrude from the terminal panel fixing portion such that the tip of the output lead wire can be bent and latched on.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: September 17, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Akira Shimizu
  • Patent number: 8536467
    Abstract: A circuit substrate for connection is used as a connecting member for electrically connecting a stator disposed inside a casing and a plurality of electric cables disposed outside the casing. A circuit substrate for connection is supported by a connecting member attachment. The connecting member attachment is molded using a circuit substrate for connection and a receptacle as inserts. Then, the circuit substrate for connection is disposed to pass through a wall portion of the casing in a thickness direction of the wall portion. The connecting member attachment is fixed onto the casing. Thus, the electric cables may be connected to the outside of the casing with a low-priced connecting structure.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: September 17, 2013
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshihito Miyashita, Hiroshi Hioki, Masakazu Chikyu
  • Patent number: 8536468
    Abstract: An electrical feedthrough, in particular for use in an electro-medical implant, having a flange enclosing at least one feedthrough bushing and at least one terminal pin enclosed by the at least one feedthrough bushing, the terminal pin having at least one section which can be joined at a lower energy in the interior of the implant.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 17, 2013
    Assignee: BIOTRONIK SE & Co. KG
    Inventor: Josef Teske
  • Patent number: 8536469
    Abstract: A body composition monitor of the present invention includes means for inputting a reference value of a body composition component, means for inputting a measurement value of the body composition component, body composition comparison means for comparing the reference value and the measurement value so as to determine a body composition component change amount of the measurement value relative to the reference value, display means provided with a plurality of stages for displaying one of the stages corresponding to the body composition component change amount, and stage determination means provided with a plurality of determination widths respectively corresponding to the plurality of stages for determining one of the stages corresponding to the body composition component change amount with using the plurality of determination widths, wherein the plurality of determination widths are not identical to each other.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 17, 2013
    Assignee: Omron Healthcare Co., Ltd
    Inventors: Tetsuya Sato, Yumi Kitamura, Shinya Tanaka
  • Patent number: 8536470
    Abstract: A body composition monitor of the present invention includes means for measuring a body composition, means for storing a measured body composition value, and body composition comparison means for comparing the measured body composition value and a stored body composition value, in which the body composition monitor further includes means for inputting a body weight value, means for storing an inputted body weight, body weight comparison means for comparing the inputted body weight and stored body weight, body composition change determination means for determining a change degree of the body composition value with using a comparison result of the body composition comparison means and a comparison result of the body weight comparison means, and display means for displaying a determination result determined by the body composition change determination means.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 17, 2013
    Assignee: Omron Healthcare Co., Ltd.
    Inventors: Tetsuya Sato, Shinya Tanaka, Yumi Kitamura
  • Patent number: 8536471
    Abstract: A pressure sensitive stylus, comprises a movable tip that recedes within a housing of the stylus in response to user applied contact pressure, wherein a displacement of the tip along an axis on which it recedes is a function of the applied contact pressure, and an optical sensor enclosed within the housing for optically sensing the displacement of the tip and for providing output in response to the sensing.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: September 17, 2013
    Assignee: N-trig Ltd.
    Inventors: Yuval Stern, Rafi Zachut, Yonatan Tzafrir, Eytan Mann, Oran Tamir, Alex Kalmanovich
  • Patent number: 8536472
    Abstract: A rotary switch mechanism includes a first rotatable member, a second rotatable member, a push button and a triggered switch. By rotating the first rotatable member, a first rotation command is executed. By rotating the second rotatable member, a second rotation command is executed. By moving a user's finger on the push button, a motion command is executed. By pressing down the push button to trigger the push switch, a pushing command is executed. In such way, the rotary switch mechanism may be used to input plural commands.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: September 17, 2013
    Assignee: Primax Electronics Ltd.
    Inventors: Chun-Che Wu, Chun-Nan Su
  • Patent number: 8536473
    Abstract: An electrical switch device includes a housing, faceplate, and a light pipe assembly that includes a light transmissive channel, a position stop, and a cam. The device also includes an air gap switch having a movable contact assembly and a stationary contact assembly. The movable contact assembly includes a cam follower that engages the cam of the light pipe assembly. The light pipe assembly is configured to pulled outward from the outer surface of the faceplate. Movement of the light pipe assembly cause the cam follower of the movable contact assembly to move along the cam and separate the movable contact from the stationary contact, shorting the circuit. Pushing the light pipe assembly in a direction back into the faceplate causes the cam follower to move in the opposite direction along the cam and allows the movable contact to engage the stationary contact and close the circuit.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: September 17, 2013
    Assignee: Cooper Technologies Company
    Inventors: Rahul Goyal, Oscar Neundorfer, James Fair, Ahmed Elgayyar
  • Patent number: 8536474
    Abstract: A rotary switch includes a rotor that is insert molded so upper and lower contact pieces have a predetermined number of contact regions with a predetermined angular width in each of a plurality of annular zones defined by a plurality of concentric circles and are stacked in a disk part. The contact pieces are exposed in two surfaces of the disk part, an upper contactor holder and a lower contactor holder are placed to cover a lower half and an upper half of the disk part of the rotor. A plurality of elastic contacts are brought into elastic contact with lower and upper side surfaces of the disk part in a plurality of annular zones, and a rotating operation shaft is inserted through the rotor, the lower contactor holder, and the upper contactor holder, and can rotate the rotor.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: September 17, 2013
    Assignee: Tokyo Cosmos Electric Co., Ltd.
    Inventors: Hajime Fukushima, Taro Fukunaga
  • Patent number: 8536475
    Abstract: Techniques disclosed herein include a conversion technique that converts an aircraft circuit breaker having male auxiliary connectors (micro switch connectors) to an aircraft circuit breaker having female auxiliary connectors, such as those conventionally used on European-made aircraft. Techniques include adding a barrier to a conventional aircraft circuit breaker approved for U.S. markets. This barrier includes female auxiliary connectors integrated with the barrier, as well as a flexible circuit that connects the male connectors with the female connectors such that the female connectors can still receive separate male connectors in the female receptacles. Such a technique converts conventional aircraft circuit breakers into a European-style breaker without requiring a full European rebuild and re-qualification. Embodiments can include single and multiple phase versions, and configurations for use with high and low amperage.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: September 17, 2013
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Keith Richard Washburn, Stephen J. Bryant, William John Bentley
  • Patent number: 8536476
    Abstract: An illuminated keyboard includes plural keys, a membrane switch circuit member and an illumination module. The illumination module is used for emitting plural light beams. When the membrane switch circuit member is triggered by depressing a key, the membrane switch circuit member issues a corresponding key signal. The membrane switch circuit member includes plural light-guiding zones. Each of the light-guiding zones is filled with the corresponding light-guiding layer, so that no vacant space is formed in the light-guiding zone. As a consequence, the light-guiding layer is structurally rigid, and the possibility of abrading the light-guiding layer is minimized.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: September 17, 2013
    Assignee: Primax Electronics Ltd.
    Inventor: Chung-Yuan Chen
  • Patent number: 8536477
    Abstract: A control assembly for an electronic device includes a housing, a control key, and an elastic member. The housing defines a groove. The control key is slidably positioned in the groove. The elastic member includes a plate portion and at least one elastic arm. The control key brings the elastic member to move to contact a switch, and the at least one elastic arm provides a return force to return the control key.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: September 17, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Jian-Hui Chen
  • Patent number: 8536478
    Abstract: An exemplary electronic device includes a casing with a slot defined in an outer face of the casing, a through holed defined in the slot, and a switch module. The switch module includes a switch received in the casing, and a slidable button embedded in the slot. The slidable button includes an operating portion received in the slot and abutting an outer face of the casing, a holding portion extending outwardly from the operating portion and through the through hole, and two elastic arms respectively extending outwardly from two lateral sides of the holding portion. Each elastic arm includes a connecting section extending outwardly from the holding portion and a locking section protruding outwardly from the connecting section towards the operating portion. The locking sections of the elastic arms abut an inner face of the casing, whereby the slidable button is fixed to the casing.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: September 17, 2013
    Assignees: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hong Li, Ting-Ting Zhao, Xiao-Hui Zhou, Min-Li Li
  • Patent number: 8536479
    Abstract: A first tubular, inner radial annular seam is produced to weld together two hollow cylinders by narrow-gap tungsten inert gas arc welding. Narrow-gap metal gas-shielded arc welding is used to create another tubular, outer radial annular seam to further weld together both hollow cylinders. In this manner, the rotational axis of the rotor shaft remains vertically aligned throughout the entire production method of welding together the shaft parts. In this manner, the required production time can be advantageously reduced and the use of welding filler can be effectively decreased.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: September 17, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventor: Karl-Heinz Gunzelmann
  • Patent number: 8536480
    Abstract: In an encoder dampening mechanism for an electric spot welding gun equipped with a motor that is accommodated inside of a motor housing and causes a hollow rotor to rotate, and an encoder main body that detects a rotation angle of the hollow rotor, the encoder dampening mechanism includes: a thin plate that is formed with a top surface that is larger in a surface area than a base surface of the encoder main body, and on which the base surface of the encoder main body is installed within the top surface; and a thin plate mounting portion that connects the thin plate to the motor housing via the thin plate support part and the thin plate pressure part, which dampen vibration.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: September 17, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hiroshi Miwa, Koichi Matsumoto, Teruaki Kobayashi
  • Patent number: 8536481
    Abstract: Electrode assemblies for plasma reactors include a structure or device for constraining an arc endpoint to a selected area or region on an electrode. In some embodiments, the structure or device may comprise one or more insulating members covering a portion of an electrode. In additional embodiments, the structure or device may provide a magnetic field configured to control a location of an arc endpoint on the electrode. Plasma generating modules, apparatus, and systems include such electrode assemblies. Methods for generating a plasma include covering at least a portion of a surface of an electrode with an electrically insulating member to constrain a location of an arc endpoint on the electrode. Additional methods for generating a plasma include generating a magnetic field to constrain a location of an arc endpoint on an electrode.
    Type: Grant
    Filed: January 28, 2008
    Date of Patent: September 17, 2013
    Assignee: Battelle Energy Alliance, LLC
    Inventors: Peter C Kong, Jon D Grandy, Brent A Detering, Larry D Zuck
  • Patent number: 8536482
    Abstract: A laser processing machine is provided which has a machine frame and a laser generator fastened to the machine frame. The laser generator is movable relative to the machine frame.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: September 17, 2013
    Assignee: TRUMPF Laser -und Systemtechnik GmbH
    Inventor: Gerhard Link
  • Patent number: 8536483
    Abstract: A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: September 17, 2013
    Assignee: General Lasertronics Corporation
    Inventors: James W. Thomas, Robert L. Cargill, Mitchell R. Wool
  • Patent number: 8536484
    Abstract: Laser engravers with a masking mechanism comprise a machine body, a laser-engraving mechanism inside the machine body, a working platform, and an exhauster. The laser-engraving mechanism includes a lens-cart rail that moves back and forth along a working track. The exhauster includes air outlets behind the working platform. The masking mechanism, which includes a reelable curtain-sheet, is installed above the air outlets so that while processing, the curtain-sheet is reeled out above the working platform and an air induction channel is formed to increase the working efficiency of the exhauster.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: September 17, 2013
    Assignee: Great Computer Corporation
    Inventors: Hsien-Chang Lin, Che-Min Kung
  • Patent number: 8536485
    Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: September 17, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Charles M. Watkins, William M. Hiatt
  • Patent number: 8536486
    Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: September 17, 2013
    Assignee: Disco Corporation
    Inventors: Kenji Furuta, Satoshi Usuda
  • Patent number: 8536487
    Abstract: A consumable electrode type arc welding method for generating arc between a plate-shaped work and a welding wire by a mixed shield gas including argon gas to weld the plate-shaped work, includes: making a state of reverse polarity in which the polarity of the welding wire is positive at the welding start time, and switching at least once to a state of positive polarity in which the polarity of the welding wire is negative.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: September 17, 2013
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Seigo Nishikawa, Kanji Katada, Hirotaka Adachi, Tsuneo Shinada, Hideyasu Machii
  • Patent number: 8536488
    Abstract: A cable management system for a welding-type system includes a support column extending in a first direction from a first end supported by a welding-type device to a second end arranged above the welding-type device. The cable management system also includes a cable support arranged on the second end of the support column that extends in a second direction substantially transverse to the first direction. Accordingly, a portion of the cable support extends away from the welding-type device to allow a cable supported thereon to extend below the cable support and proximate to the welding-type device.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: September 17, 2013
    Assignee: Illinois Tool Works Inc.
    Inventors: Jonathan R. Ertmer, Chris J. Roehl, John C. Breitbach, Thomas G. Yunk
  • Patent number: 8536489
    Abstract: A hob includes a cooking surface with a glass ceramic defining a cutout in an outside edge of the glass ceramic, and an insert in the cutout including a material that is different from the glass ceramic and which is permeable to light in a blue spectral range.
    Type: Grant
    Filed: September 1, 2008
    Date of Patent: September 17, 2013
    Assignee: BSH Bosch und Siemens Hausgeraete GmbH
    Inventors: Bernd Martin, Markus Schlegel, Thomas Stein
  • Patent number: 8536490
    Abstract: An electric kettle includes a kettle body, a base, a heating element and a wireless signal transmission device. The wireless signal transmission device includes a controller circuitry, a first wireless transceiver, a second wireless transceiver, and a light reflection arrangement. The light reflection arrangement includes a first reflective mechanism provided on the kettle body, and a second reflective mechanism provided on the base, wherein when the kettle body is rotatably and detachably coupled with the base through a lower and an upper connector, wherein when one of the first and the second wireless transceiver is activated to generate a wireless signal toward another of the wireless transceiver, the wireless signal is subject to multiple reflections by the first and the second reflective mechanism until the wireless signal reaches the corresponding first and the second wireless transceiver.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: September 17, 2013
    Assignee: Crastal Technology (Shenzhen) Co., Ltd.
    Inventors: George Mohan Zhang, Bei Zhang, Tianliang Wang
  • Patent number: 8536491
    Abstract: A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system is provided that includes a plurality of rotatable heaters arranged and operative to heat the chamber. In one embodiment, spacing between the sidewall heaters is adjustable. The heating system controls temperature variations within the chamber and promotes uniform film deposit thickness on the wafers.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: September 17, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zin-Chang Wei, Hsin-Hsien Wu, Chun-Lin Chang
  • Patent number: 8536492
    Abstract: A method and apparatus for rapid thermal annealing comprising a plurality of lamps affixed to a lid of the chamber that provide at least one wavelength of light, a laser source extending into the chamber, a substrate support positioned within a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber. A method and apparatus for rapid thermal annealing comprising a plurality of lamps comprising regional control of the lamps and a cooling gas distribution system affixed to a lid of the chamber, a heated substrate support with magnetic levitation extending through a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: September 17, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Sundar Ramamurthy, Andreas G. Hegedus, Randhir Thakur