Sensitizing Composition Patents (Class 106/1.11)
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Patent number: 11919084Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.Type: GrantFiled: August 18, 2022Date of Patent: March 5, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Keita Muneuchi, Eiji Iso, Isao Ida, Kenichi Araki, Noriko Shimizu, Takashi Tomohiro
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Patent number: 11643551Abstract: Disclosed are compositions that may be useful for forming synthetic membranes, methods of forming membranes therefrom, and membranes. In an embodiment, a membrane comprises a free hydrophilic polymer comprising a polyoxazoline, and a polyurethane, the polyurethane comprising a backbone comprising the reaction product of a diisocyanate, a polymeric aliphatic 5 diol, and optionally a chain extender.Type: GrantFiled: August 28, 2018Date of Patent: May 9, 2023Assignee: DSM IP ASSETS B.V.Inventors: Jennifer Al-Rashid, Jacob Riffey, Chad Sugiyama, John Zupancich
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Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
Patent number: 11098407Abstract: A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.Type: GrantFiled: September 10, 2019Date of Patent: August 24, 2021Assignee: NATIONAL TSING HUA UNIVERSITYInventors: Chin-Wei Hsu, Wei-Yen Wang, Tzu-Chien Wei -
Patent number: 11008657Abstract: This disclosure relates to a composition for catalyst-free electroless plating and a method for catalyst-free electroless plating using the same. More particularly, this disclosure relates to a composition for catalyst-free electroless plating and a method for catalyst-free electroless plating using the same that does not require a catalyst such as an expensive noble metal catalyst and may simplify the process.Type: GrantFiled: December 27, 2018Date of Patent: May 18, 2021Assignee: Korea Institute of Materials ScienceInventors: Taehoon Kim, Sang Bok Lee, Byung Mun Jung, Kyunbae Lee
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Patent number: 10966327Abstract: A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.Type: GrantFiled: January 29, 2016Date of Patent: March 30, 2021Assignee: JCU CORPORATIONInventors: Daisuke Sadohara, Kenichi Nishikawa, Keita Suzuki, Kouta Ibe, Katsumi Shimoda
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Patent number: 10903081Abstract: A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.Type: GrantFiled: December 29, 2017Date of Patent: January 26, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
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Patent number: 10822703Abstract: The invention relates to a process for coating plastics or plastic surfaces with metals, especially plastics composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (e.g. ABS blends), wherein the process comprises the pretreatment of the plastic surfaces with a composition C (etch solution) comprising at least two different ionic liquids IL1 and IL2.Type: GrantFiled: July 21, 2016Date of Patent: November 3, 2020Assignee: BASF SEInventors: Axel Kirste, Tobias Urban, Fabio Nicolini, Simone Lutter, Frank Richter, Andre Cezanne
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Patent number: 10662501Abstract: The disclosure provides a method of producing a platinum colloid comprising reducing platinum ions by the use of a platinum ion solution, water, a nonionic surfactant, a pH adjusting agent, and a reducing agent, wherein the platinum ion solution contains platinum at a concentration of 20 w/v %, the nonionic surfactant is polysorbate 80, the pH adjusting agent is an alkaline metal salt, the reducing agent is a lower alcohol, the volume of the water is from 600 to 660 times that of the platinum ion solution, the volume of the nonionic surfactant is from 0.20 to 0.30 times that of the platinum ion solution, the volume of the pH adjusting agent as a 5 w/v % aqueous solution is from 10 to 30 times that of the platinum ion solution, and the volume of the reducing agent is from 27 to 37 times that of the platinum ion solution, as well as the platinum colloid produced by the method.Type: GrantFiled: December 22, 2016Date of Patent: May 26, 2020Assignee: INOVEX CO., LTD.Inventor: Hiroshi Iwaki
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Patent number: 10619059Abstract: A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.Type: GrantFiled: June 20, 2019Date of Patent: April 14, 2020Assignee: Science Applications International CorporationInventors: David Morris, John Timler, Jason Schipp
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Patent number: 10501668Abstract: In one embodiment, a method for depositing metal on a polymer surface, the method includes coating the polymer surface with a binding metal to render the polymer surface solvophillic and/or hydrophilic and depositing a further metal on the binding metal-coated polymer surface.Type: GrantFiled: August 22, 2017Date of Patent: December 10, 2019Assignee: University of South FloridaInventors: Jaspreet Dhau, D. Yogi Goswami, Chand K. Jotshi, Elias K. Stefanakos
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Patent number: 10455645Abstract: The invention relates to a laminated motor vehicle glass panel which consists of two glass sheets joined by means of an intermediate sheet, the glass panel comprising a system of heated layers which is applied to one of the sheets and, to the edge of the same sheet, a substantially opaque masking strip, in contact with the glass sheet, the system of heated conductive layers at least partially covering the masking strip. The glass panel further comprises power supply busbars in contact with the system of layers in the portion covering the masking strip, characterized in that the masking strip has a roughness no greater than 0.5? and preferably no greater than 0.1?.Type: GrantFiled: May 28, 2015Date of Patent: October 22, 2019Inventors: Peter Masschelein, Zoltan Kazik
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Patent number: 10440829Abstract: A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.Type: GrantFiled: July 2, 2015Date of Patent: October 8, 2019Assignee: United Technologies CorporationInventors: Sameh Dardona, Michael P. Humbert, John P. Wesson, Wayde R. Schmidt, Daniel V. Viens, Jin Hu
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Patent number: 10399137Abstract: This invention provides process for manufacturing a galvanized metal three-dimensional object with a shape including multiple edges, said process comprising, in the following order, the steps of: (A) providing and cutting a metal sheet matrix with a thickness within a range from 0.8 mm to 6 mm, the shape of said metal sheet matrix including multiple free edges, (B) batch-wise hot dipping said metal sheet matrix into a molten zinc alloy galvanizing bath, (C) cold-forming the galvanized metal sheet matrix into a desired three-dimensional shape including multiple adjacent metal edges, and (D) cold-forming a series of joining points for fastening together said multiple adjacent metal edges, to form said galvanized metal three-dimensional object.Type: GrantFiled: February 27, 2015Date of Patent: September 3, 2019Assignee: FONTAINE HOLDINGS, NVInventors: Lars Baumgürtel, Michael Rahlke
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Patent number: 10358725Abstract: Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by: (Ag+)a(L)b(P)c?? (I) wherein L represents an ?-oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.Type: GrantFiled: June 14, 2017Date of Patent: July 23, 2019Assignee: EASTMAN KODAK COMPANYInventors: Deepak Shukla, Kevin M. Donovan, Dianne Marie Meyer
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Patent number: 10174434Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing phosphonium salt with two or more of aromatic rings is provided.Type: GrantFiled: March 24, 2016Date of Patent: January 8, 2019Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Kiyotaka Nakaya, Mami Watanabe
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Patent number: 10077498Abstract: The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.Type: GrantFiled: September 11, 2014Date of Patent: September 18, 2018Assignee: Atotech Deutschland GmbHInventors: Matthias Dammasch, Marco Haryono, Sengül Karasahin, Hans-Jürgen Schreier
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Patent number: 9966306Abstract: A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layer 22 by supplying a catalyst solution 32 onto a substrate 2 having a recess 2a to adsorb the catalyst 22A onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate 2 and an inside of the recess 2a by supplying a rinse liquid; drying the surface of the substrate 2 and the inside of the recess 2a. Further, by supplying a binder solution 34 containing a binder 22B onto the substrate 2, the catalyst 22A on the surface of the substrate 2 is bound to the substrate 2 by the binder 22B.Type: GrantFiled: February 19, 2016Date of Patent: May 8, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Yuichiro Inatomi, Takashi Tanaka, Nobutaka Mizutani, Yusuke Saito, Kazutoshi Iwai, Mitsuaki Iwashita
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Patent number: 9885116Abstract: The present invention provides a simple and economical process for preparation of metal-coated non-metallic nano/micro particles. The nano/micro particles are composed of a core and metallic coat over the core using silver or other transition/noble metals. The core of the non-metallic nano/micro particles are selected from inorganic material such as silica, calcium carbonate, barium sulfate, or emulsion grade polyvinyl chloride and other polymers prepared by emulsion process including porous polymers. The metal coating is selected from the transition/noble metals such as copper, nickel, silver, palladium, platinum, osmium, ruthenium, rhodium, and such other metals and their combinations that are easily reducible to elemental metal.Type: GrantFiled: December 19, 2014Date of Patent: February 6, 2018Inventors: Vinod Chintamani Malshe, Ajay Prabhakar Malshe
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Patent number: 9878307Abstract: Methods of fabricating nano-catalysts are described. In some embodiments the nano-catalyst is formed from a powder-based substrate material and is some embodiments the nano-catalyst is formed from a solid-based substrate material. In some embodiments the substrate material may include metal, ceramic, or silicon or another metalloid. The nano-catalysts typically have metal nanoparticles disposed adjacent the surface of the substrate material. The methods typically include functionalizing the surface of the substrate material with a chelating agent, such as a chemical having dissociated carboxyl functional groups (—COO), that provides an enhanced affinity for metal ions. The functionalized substrate surface may then be exposed to a chemical solution that contains metal ions. The metal ions are then bound to the substrate material and may then be reduced, such as by a stream of gas that includes hydrogen, to form metal nanoparticles adjacent the surface of the substrate.Type: GrantFiled: January 14, 2013Date of Patent: January 30, 2018Assignee: Consolidated Nuclear Security, LLCInventors: Roland D. Seals, Paul A. Menchhofer, Jane Y. Howe, Wei Wang
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Patent number: 9809606Abstract: A non-hydroxylic-solvent soluble silver complex comprises a reducible silver ion complexed with an ?-oxy carboxylate and a 5- or 6-membered N-heteroaromatic compound. The non-hydroxylic-solvent soluble silver complex can be represented by the following formula (I): (Ag+)a(L)b(P)c?? (I) wherein L represents the ?-oxy carboxylate; P represents the 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. Such complexes can be incorporated into photosensitive compositions for thin films or patterns in various articles to provide electrically-conductive silver metal.Type: GrantFiled: August 9, 2016Date of Patent: November 7, 2017Assignee: EASTMAN KODAK COMPANYInventor: Deepak Shukla
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Patent number: 9583389Abstract: Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD) is described. In an example, a method of fabricating a metallization structure for an integrated circuit involves forming an exposed surface above a substrate, the exposed surface including regions of exposed dielectric material and regions of exposed metal. The method also involves forming, using a selective metal deposition process, a metal layer on the regions of exposed metal without forming the metal layer on the regions of exposed dielectric material.Type: GrantFiled: December 4, 2015Date of Patent: February 28, 2017Assignee: Intel CorporationInventors: Patricio E. Romero, Scott B. Clendenning, Jeanette M. Roberts, Florian Gstrein
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Patent number: 9499910Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.Type: GrantFiled: July 21, 2015Date of Patent: November 22, 2016Inventors: Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Martin W. Bayes, Ka-Ming Yip, Chun-Man Chan, Hung-Tat Chan, Tsui-Kiu Li, Lok-Lok Liu
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Patent number: 9472811Abstract: A method for forming an electrocatalyst for fuel cell applications comprises electrolessly depositing a first plurality of nickel particles onto carbon-support particles. The nickel particles are formed from a nickel ion-containing aqueous solution. At least a portion of the nickel particles are replaced with platinum via a galvanic displacement reaction to form a second plurality of nickel particles coated with a platinum layer. During this displacement reaction step, the nickel particles are heated to a temperature sufficient to form the platinum layer. Finally, the second plurality of nickel particles is optionally incorporated into a cathode layer of a fuel cell.Type: GrantFiled: February 15, 2011Date of Patent: October 18, 2016Assignee: GM Global Technology Operations LLCInventors: Junliang Zhang, Zhongyi Liu, Zhiqiang Yu
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Patent number: 9441303Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.Type: GrantFiled: March 4, 2013Date of Patent: September 13, 2016Assignee: MEC COMPANY LTD.Inventors: Masayo Kurii, Kiyoto Tai, Mami Nakamura
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Patent number: 9388477Abstract: A method comprises heating an aqueous solution of colloidal silver particles. A soluble noble metal halide salt is added to the aqueous solution which undergoes a redox reaction on a surface of the silver particles to form noble metal/silver halide SPs, noble metal halide/silver halide SPs or noble metal oxide/silver halide SPs on the surface of the silver particles. The heat is maintained for a predetermined time to consume the silver particles and release the noble metal/silver halide SPs, the noble metal halide/silver halide SPs or the noble metal oxide/silver halide SPs into the aqueous solution. The aqueous solution is cooled. The noble metal/silver halide SPs, the noble metal halide/silver halide SPs or noble metal oxide/silver halide SPs are separated from the aqueous solution. The method optionally includes adding a soluble halide salt to the aqueous solution.Type: GrantFiled: January 20, 2015Date of Patent: July 12, 2016Assignee: UChicago Argonne, LLCInventors: Yugang Sun, Yongxing Hu
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Patent number: 9382627Abstract: One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.Type: GrantFiled: October 16, 2014Date of Patent: July 5, 2016Assignee: Lam Research CorporationInventor: Artur Kolics
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Patent number: 9227182Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface.Type: GrantFiled: December 31, 2012Date of Patent: January 5, 2016Inventors: Wenjia Zhou, Suk Kwan Kwong, Dennis Chit Yiu Chan, Dennis Kwok Wai Yee, Weijuan Zhou
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Patent number: 9181623Abstract: A solution and a process are used for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. The composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; and C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. The solution and process may be applied for the manufacture of electronic devices such as integrated circuits, especially in three dimensions.Type: GrantFiled: September 9, 2010Date of Patent: November 10, 2015Assignee: ALCHIMERInventors: Vincent Mevellec, Dominique Suhr
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Patent number: 9149798Abstract: A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces.Type: GrantFiled: December 31, 2012Date of Patent: October 6, 2015Inventors: Wenjia Zhou, Suk Kwan Kwong, Dennis Chit Yiu Chan, Dennis Kwok Wai Yee
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Patent number: 9072209Abstract: A method for forming a conductive pattern on a substrate (208) includes providing an image pattern for imaging on the substrate; imaging the image pattern on the substrate creating imaged areas; spraying functional material (240) on the substrate that diffuse molecules of the functional material into the imaged areas and wherein the functional material is in a form of liquid; and applying electro-less copper coating that builds conductive material traces on the imaged areas on the substrate.Type: GrantFiled: June 14, 2013Date of Patent: June 30, 2015Assignee: EASTMAN KODAK COMPANYInventor: Israel Schuster
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Patent number: 9062378Abstract: The present invention relates to the use of ternary nickel-containing metal alloys of the NiMR type (where M=Mo, W, Re or Cr, and R=B or P) deposited by an electroless process in semiconductor technology. In particular, the present invention relates to the use of these deposited ternary nickel-containing metal alloys as barrier material or as selective encapsulation material for preventing the diffusion and electromigration of copper in semiconductor components.Type: GrantFiled: November 1, 2010Date of Patent: June 23, 2015Assignee: BASF AKTIENGESELLSCHAFTInventor: Alexandra Wirth
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Publication number: 20150072070Abstract: A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.Type: ApplicationFiled: September 5, 2014Publication date: March 12, 2015Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Masayuki UTSUMI, Takuya OKAMACHI, Takuya KOMEDA
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Patent number: 8961669Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.Type: GrantFiled: November 26, 2013Date of Patent: February 24, 2015Assignee: Rohm and Haas Electronic Materials LLCInventors: Feng Liu, Maria Anna Rzeznik
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Patent number: 8900666Abstract: Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.Type: GrantFiled: October 21, 2011Date of Patent: December 2, 2014Assignee: Rohm and Haas Electronic Materials LLCInventors: Feng Liu, Maria Anna Rzeznik
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Publication number: 20140273407Abstract: Methods and compositions for the surface cleaning and passivation of CdTe substrates usable in solar cells are disclosed. In some embodiments amine-containing chelators are used and in other embodiments phosphorus-containing chelators are used.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Applicant: FIRST SOLAR, INC.Inventors: Scott Christensen, Scott Jewhurst, Minh Huu Le, Haifan Liang, Hao Lin, Wei Liu, Minh Anh Nguyen, Zhi Wen Sun, Gang Xiong
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Patent number: 8828131Abstract: Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4.Type: GrantFiled: August 5, 2010Date of Patent: September 9, 2014Assignee: C. Uyemura & Co., Ltd.Inventors: Hisamitsu Yamamoto, Tetsuji Ishida
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Patent number: 8814997Abstract: An electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The electroless plating pretreatment agent contains an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.Type: GrantFiled: March 14, 2011Date of Patent: August 26, 2014Assignee: JX Nippon Mining & Metals CorporationInventors: Toru Imori, Jun Suzuki, Ryu Murakami, Akihiro Aiba, Junichi Ito
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Patent number: 8591636Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.Type: GrantFiled: December 14, 2010Date of Patent: November 26, 2013Assignee: Rohm and Haas Electronics Materials LLCInventors: Feng Liu, Maria Anna Rzeznik
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Patent number: 8591637Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.Type: GrantFiled: December 14, 2010Date of Patent: November 26, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Maria Anna Rzeznik, Feng Liu
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Patent number: 8308858Abstract: Embodiments as described herein provide methods for depositing a material on a substrate during electroless deposition processes, as well as compositions of the electroless deposition solutions. In one embodiment, the substrate contains a contact aperture having an exposed silicon contact surface. In another embodiment, the substrate contains a contact aperture having an exposed silicide contact surface. The apertures are filled with a metal contact material by exposing the substrate to an electroless deposition process. The metal contact material may contain a cobalt material, a nickel material, or alloys thereof. Prior to filling the apertures, the substrate may be exposed to a variety of pretreatment processes, such as preclean processes and activations processes. A preclean process may remove organic residues, native oxides, and other contaminants during a wet clean process or a plasma etch process. Embodiments of the process also provide the deposition of additional layers, such as a capping layer.Type: GrantFiled: January 18, 2010Date of Patent: November 13, 2012Assignee: Applied Materials, Inc.Inventors: Michael P. Stewart, Timothy W. Weidman, Arulkumar Shanmugasundram, David J. Eaglesham
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Publication number: 20120171363Abstract: Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4.Type: ApplicationFiled: August 5, 2010Publication date: July 5, 2012Applicant: C. UYEMURA & CO., LTD.Inventors: Hisamitsu Yamamoto, Tetsuji Ishida
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Publication number: 20120156892Abstract: The present invention relates to a solution and a process for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. According to the invention, this composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. Application: Manufacture of electronic devices such as, in particular, integrated circuits, especially in three dimensions.Type: ApplicationFiled: September 9, 2010Publication date: June 21, 2012Applicant: ALCHIMERInventors: Vincent Mevellec, Dominique Suhr
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Publication number: 20120097548Abstract: Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.Type: ApplicationFiled: October 21, 2011Publication date: April 26, 2012Applicant: Rohm and Haas Electronic Materials LLCInventors: Feng LIU, Maria Anna Rzeznik
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Patent number: 8152914Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.Type: GrantFiled: April 24, 2008Date of Patent: April 10, 2012Assignee: Atotech Deutschland GmbHInventors: Sigrid Schadow, Brigitte Dyrbusch, Carl Christian Fels
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Publication number: 20110159191Abstract: Provided is a sensitizing solution for electroless plating which can easily dissolve an Sn compound therein without the use of acid, and thus can be used for a long period of time without impairing the uniformity of a metal plating coating. The sensitizing solution for electroless plating is a sensitizing solution for electroless plating including: an Sn compound; and a solvent, wherein the solvent contains 10 vol. % or more of a water-soluble alcohol. In addition, provided is an electroless plating method including: a pretreatment process of immersing a body to be plated into a pretreatment solution; and a plating process of immersing the body to be plated after being subjected to the pretreatment process into a plating solution, wherein the sensitizing solution for electroless plating according to the invention is used as the pretreatment solution.Type: ApplicationFiled: August 26, 2009Publication date: June 30, 2011Applicants: SHOWA DENKO K.K., Kanto Gakuin School CorporationInventors: Ichiro Koiwa, Akira Hashimoto, Masahiko Usuda
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Patent number: 7867564Abstract: The object of the present invention is to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method involves surface treating an article to be plated with a liquid prepared by mixing or reacting in advance an organic acid salt of a silane coupling agent containing an azole in a molecule, for example, a coupling agent which is an equimolar reaction product of imidazole and ?-glycidoxypropyltrimethoxysilane, and a noble metal compound, and then conducting electroless plating thereon.Type: GrantFiled: August 5, 2003Date of Patent: January 11, 2011Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Toru Imori, Atsushi Yabe
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Patent number: 7862860Abstract: A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface to cause the ligating copolymer to bind thereto, and contacting the modified substrate surface with a solution of a catalyst, causing the catalyst to be ligated by the ligating copolymer and thus immobilized on the substrate surface. The ligating copolymer may be patterned on the substrate surface using a method such as microcontact printing.Type: GrantFiled: May 22, 2006Date of Patent: January 4, 2011Assignee: International Business Machines CorporationInventors: Tricia Breen Carmichael, Sarah Jane Vella, Ali Afzali-Ardakani, Mahmoud Mostafa Khojasteh
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Patent number: 7780771Abstract: A composition and method are disclosed. The composition both conditions and activates a dielectric material for metal deposition. The metal may be deposited on the dielectric by electroless methods. The metallized dielectric may be used in electronic devices.Type: GrantFiled: December 5, 2006Date of Patent: August 24, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Frank Scaraglino, Walter Sommer, Neil D. Brown, Kai Wang
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Patent number: 7731786Abstract: The invention relates to a photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate, which combines the following: a pigment providing oxidation-reduction properties under light irradiation, a metallic salt, a complex-forming agent for the metallic salt, a liquid film-forming polymer formulation, a basic compound, an organic solvent and water. The invention also relates to the use of said dispersion.Type: GrantFiled: August 20, 2008Date of Patent: June 8, 2010Assignee: SemikaInventors: Olivier Dupuis, Mary-Helene Delvaux
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Publication number: 20100119713Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.Type: ApplicationFiled: April 24, 2008Publication date: May 13, 2010Applicant: Atotech Deutschland GmbHInventors: Sigrid Schadow, Brigitte Dyrbusch, Carl Christian Fels