Group Iib (zn, Cd, Hg) Metal Patents (Class 106/1.29)
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Patent number: 9840788Abstract: In accordance with one embodiment of the present disclosure, a method for depositing metal on a reactive metal film on a workpiece includes electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 6 to about 11 and applying a cathodic potential in the range of about ?1 V to about ?6 V. The workpiece includes a barrier layer disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal having a standard electrode potential more negative than 0 V and the seed layer including a second metal having a standard electrode potential more positive than 0 V.Type: GrantFiled: March 3, 2015Date of Patent: December 12, 2017Assignee: APPLIED Materials, Inc.Inventors: Roey Shaviv, Ismail T. Emesh, Dimitrios Argyris, Serdar Aksu
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Patent number: 9828687Abstract: In accordance with one embodiment of the present disclosure, a method for depositing metal on a reactive metal film on a workpiece includes electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 1 to about 6, and applying a cathodic potential in the range of about ?0.5 V to about ?4 V. The workpiece includes a barrier layer disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal having a standard electrode potential more negative than 0 V and the seed layer including a second metal having a standard electrode potential more positive than 0 V.Type: GrantFiled: March 3, 2015Date of Patent: November 28, 2017Assignee: APPLIED Materials, Inc.Inventors: Roey Shaviv, Ismail T. Emesh, Dimitrios Argyris, Serdar Aksu
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Publication number: 20150096461Abstract: Provided is a method for regenerating a nitric acid active treatment solution comprising: adding a zinc ion-aggregating agent to a nitric acid active treatment solution for a surface of a zinc-based material plated metal member, the nitric acid active treatment solution containing zinc ions, to thereby aggregate the zinc ions in the solution as an insoluble salt; and separating and removing the insoluble salt.Type: ApplicationFiled: May 10, 2013Publication date: April 9, 2015Applicant: DIPSOL CHEMICALS CO., LTD.Inventors: Ryuta Kashio, Tomitaka Yamamoto
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Patent number: 8932389Abstract: A zinc oxide precursor for use in deposition of a zinc oxide-based thin film contains a zincocene having the following formula or a derivative thereof: where R1 and R2 are hydrogen or CnH2n+1. The n is a number selected from 1 to 3, and the R1 and R2 is one selected from the group consisting of hydrogen, a methyl group, an ethyl group and an i-propyl group. A method of depositing a zinc oxide-based thin film includes the following steps of: loading a substrate into a deposition chamber; and supplying the above-described zinc oxide precursor and an oxidizer into the deposition chamber and forming a zinc oxide-based thin film on the substrate via chemical vapor deposition. In an exemplary embodiment, the zinc oxide-based thin film may be formed on the substrate via atmospheric pressure chemical vapor deposition.Type: GrantFiled: November 19, 2012Date of Patent: January 13, 2015Assignee: Samsung Corning Precision Materials Co., Ltd.Inventors: Sooho Park, Seohyun Kim, Jeongwoo Park, Taejung Park, YoungZo Yoo, GunSang Yoon, Eun-Ho Choi, Myong Woon Kim, Bogyeong Kim, Hyung Soo Shin, Seung Ho Yoo, Sang Do Lee, Sang Ick Lee, Sang Jun Yim
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Patent number: 8858694Abstract: A zinc oxide precursor for use in deposition of a zinc oxide-based thin film contains an alkyl zinc halide having the following formula: R—Zn—X, where R is an alkyl group CnH2n+1, and X is a halogen group. The n is a number ranging from 1 to 4, and the alkyl group is one selected from among a methyl group, an ethyl group, an i-propyl group and a t-butyl group. The halogen group contains one selected from among F, Br, Cl and I. A method of depositing a zinc oxide-based thin film includes loading a substrate into a deposition chamber; and supplying the zinc oxide precursor which contains the above-described alkyl zinc halide and an oxidizer into the deposition chamber and forming a zinc oxide-based thin film on the substrate via chemical vapor deposition. The zinc oxide-based thin film is deposited on the substrate via atmospheric pressure chemical vapor deposition.Type: GrantFiled: November 19, 2012Date of Patent: October 14, 2014Assignee: Samsung Corning Precision Materials Co., Ltd.Inventors: Sooho Park, Seohyun Kim, Jeongwoo Park, Taejung Park, Young Zo Yoo, GunSang Yoon, Eun-Ho Choi, Myong Woon Kim, Bogyeong Kim, Hyung Soo Shin, Seung Ho Yoo, Sang Do Lee, Sang Ick Lee, Sang Jun Yim
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Patent number: 8703166Abstract: Antimicrobial and algaecidal products are disclosed. In general, the antimicrobial or algaecidal products can be adhered to structural components of buildings and include particles that, when combined with water, produce a solution that is toxic to organisms such as algae. The products provide an algaecidal wash as water percolates on, or through the product, and can prevent or control growth of unsightly algae and other microbes.Type: GrantFiled: January 20, 2011Date of Patent: April 22, 2014Inventor: John Flynn
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Patent number: 8632628Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.Type: GrantFiled: October 29, 2010Date of Patent: January 21, 2014Assignee: Lam Research CorporationInventor: Artur Kolics
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Patent number: 8617301Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.Type: GrantFiled: January 30, 2007Date of Patent: December 31, 2013Assignee: Lam Research CorporationInventor: Mark Ian Wagner
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Patent number: 8317909Abstract: The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form new metal surfaces on all metal substrates. The processes form stable aqueous solutions of metal and metalloid ions that can be adsorbed or absorbed on and/or into conductive substrates. The aqueous solutions consist of ammonium alkali metal phosphate salts, and/or ammonium alkali metal sulfate salts mixed with a water soluble metal or metalloid salt from Group I through Group VIII of the periodic table of elements. The aqueous solutions allow for a nano deposition of the metal ions on and/or into the surfaces of conductive substrates. The surfaces created by the deposited metal ions will provide metal passivation and substantially eliminate friction in metal-to-metal contact without the use of hydrocarbon based lubricants.Type: GrantFiled: March 9, 2010Date of Patent: November 27, 2012Assignee: DFHS, LLCInventor: Frank G. Defalco
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Publication number: 20120104331Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.Type: ApplicationFiled: October 29, 2010Publication date: May 3, 2012Inventor: Artur KOLICS
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Patent number: 7964083Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.Type: GrantFiled: February 28, 2005Date of Patent: June 21, 2011Assignee: Taskem, Inc.Inventors: William E. Eckles, Thorsten Kuehler
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Publication number: 20100285664Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: Lam Research CorporationInventor: Mark Ian Wagner
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Patent number: 7786011Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.Type: GrantFiled: January 25, 2008Date of Patent: August 31, 2010Assignee: Lam Research CorporationInventor: Mark Ian Wagner
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Publication number: 20100029814Abstract: A surface conditioning composition for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes at least one kind of zinc compound particles selected from the group consisting of zinc oxide particles, zinc hydroxide particles, and basic zinc carbonate particles; phosphoric acid and/or condensed phosphoric acid; and an amine compound having a specific structure and in which the zinc compound particles are dispersed and stabilized by the phosphoric acid and/or condensed phosphoric acid, and the amine compound.Type: ApplicationFiled: April 9, 2007Publication date: February 4, 2010Inventors: Toshio Inbe, Yusuke Wada, Masanobu Futsuhara
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Patent number: 7645404Abstract: A composition for producing a protective coat against scaling on metallic surfaces. The composition includes, as binders, hydrolysates/condensates of at least one silane or a silicone resin binder and also, further, at least one metallic filler.Type: GrantFiled: April 9, 2007Date of Patent: January 12, 2010Assignees: Volkswagen AG, Nano-X GmbH, Thyssenkrupp Steel AGInventors: Uwe Paar, Stefan Sepeur, Stefan Goedicke, Kurt Steinhoff
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Publication number: 20080194103Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.Type: ApplicationFiled: January 25, 2008Publication date: August 14, 2008Applicant: Lam Research CorporationInventor: Mark Ian Wagner
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Publication number: 20080131728Abstract: An aqueous, acidic zincating composition comprising: zinc cations; fluoride anions; and a carboxylic acid having at least one additional —OH substituent is provided that is useful in a process of making a corrosion resistant article comprising contacting an article having an aluminum surface with the zincating composition and thereafter coating the article with an autodeposition coating.Type: ApplicationFiled: November 30, 2007Publication date: June 5, 2008Inventors: Manesh Nadupparambil Sekharan, Bashir M. Ahmed, Omar L. Abu-Shanab, William E. Fristad, Brian J. Marvin
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Patent number: 7109375Abstract: An additive for an alkaline zinc or zinc alloy electroplating bath medium, the additive comprising a random co-polymer comprising the reaction product of: (i) one or more di-tertiary amines including an amide or thioamide functional group, and (ii) optionally, one or more saturated second di-tertiary amines and/or one or more second di-tertiary amines including an unsaturated moiety, with (iii) one or more saturated or unsaturated linking agents capable of reacting with said di-tertiary amines (i) and (ii), provided that, where all the linking agents are saturated, an unsaturated di-tertiary amine must he present. Preferably, the polymer has the general formula n(2x+2y+zEp)j-.Type: GrantFiled: July 11, 2001Date of Patent: September 19, 2006Inventors: Roderick Dennis Herdman, Trevor Pearson, Anthony Rowan
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Patent number: 7084288Abstract: The object of this invention is to provide an organometallic precursor for forming a metal film or pattern and a method of forming the metal film or pattern using the same. More particularly, the present invention provides an organometallic precursor containing a hydrazine-based compound coordinated with a central metal thereof, and a method of forming a metal film or pattern using the same. Further, the present invention provides a composition containing an organometallic compound and a hydrazine-based compound, and a method of forming a metal film or pattern using the same. Additionally, the present invention is advantageous in that a pure metal film or pattern is formed using the organometallic precursor or composition through a simple procedure without limiting atmospheric conditions at a low temperature, and the film or pattern thus formed has excellent conductivity and morphology. Therefore, the film is useful in an electronic device field including flexible displays and large-sized TFT-LCD.Type: GrantFiled: October 2, 2003Date of Patent: August 1, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Hae Jung Son, Euk Che Hwang, Sang Yoon Lee, Soon Taik Hwang, Byong Ki Yun
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Patent number: 7070689Abstract: The invention relates to a dip comprising an acid aqueous solution having no ammonium ion, fluoroborate ions or citrate ion and containing per liter: between 10 and 60 g of Zn2+ ions and between 20 and 100 g of Mn2+ ions. The invention is characterised in that it comprises a buffer agent that maintains the pH at a value of between 3 and 7, preferably between 4.5 and 6 or better still between 4.8 and 5.5, and another agent, different from the buffer agent, which is used to bring together the deposition potentials of couple Zn/Zn2+ and couple Mn/Mn2+. The inventive dip used to deposit a Zn and Mn alloy by electrolysis.Type: GrantFiled: February 6, 2002Date of Patent: July 4, 2006Assignee: CoventyaInventors: Lionel Thiery, Gianluigi Schiavon, Nicolas Pommier
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Patent number: 6911068Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: GrantFiled: October 2, 2001Date of Patent: June 28, 2005Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6852210Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.Type: GrantFiled: January 7, 2002Date of Patent: February 8, 2005Assignees: Daiwa Fine Chemicals Co., Ltd., Sumitomo Electric Industries, Ltd.Inventors: Keigo Obata, Dong-Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya, Masatoshi Majima, Shigeyoshi Nakayama
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Patent number: 6837980Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.Type: GrantFiled: December 12, 2001Date of Patent: January 4, 2005Assignee: Olin CorporationInventors: Szuchain F. Chen, Leonard R. Howell
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Patent number: 6818313Abstract: A corrosion-inhibiting coating, process, and system that provides a tight, adherent zinc- or zinc-alloy coating that is directly deposited onto steel or cast iron surfaces for enhanced corrosion protection. A process for applying the coating is also provided. The process includes the application of two sequential aqueous baths. The first bath contains a precursor zinc compound while the second bath contains a reducing agent to deposit the zinc directly upon the steel or cast iron.Type: GrantFiled: July 24, 2002Date of Patent: November 16, 2004Assignee: University of DaytonInventors: Andrew W. Phelps, Jeffrey A. Sturgill
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Publication number: 20040219377Abstract: A surface of copper is brought into contact with an aqueous solution for forming a bonding layer for bonding resin comprising: (a) at least one type of acid selected from inorganic acid and organic acid; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper.Type: ApplicationFiled: April 16, 2004Publication date: November 4, 2004Applicant: MEC COMPANY LTD.Inventors: Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Naomi Kanda, Toshiko Nakagawa
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Patent number: 6811673Abstract: Matt surfaces are obtained when a metal is coated electrolytically with zinc from an electrolyte solution which contains zinc sulfate or an alkanesulfonate of zinc or mixtures thereof, and optionally further metal salts, sulfuric acid or an alkanesulfonic acid or a mixture thereof, and at least one additive selected from nitrogen-containing surface-active compounds, which may be ionic or nonionic, sulfur-containing anionic surface-active compounds, and surface-active compounds based on multifunctional alcohols having at least three hydroxyl groups.Type: GrantFiled: January 10, 2003Date of Patent: November 2, 2004Assignee: BASF AktiengesellschaftInventors: Gregor Brodt, Jens Haas, Werner Hesse, Hans-Ulrich Jäger
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Patent number: 6787239Abstract: A material usable for the electrodes and the dielectric layer plasma display panels and capable of reducing the occurrence of yellowing and a high-image-quality plasma display panel using the material are provided. Using glass powder containing 25 to 50 wt % of Bi2O3, 5 to 35 wt % of B2O3, 10 to 20 wt % of ZnO, 5 to 20 wt % of BaO, 0 to 15 wt % of SiO2 and 0 to 10 wt % of Al2O3, the electrodes and the dielectric layer of a plasma display panel are formed.Type: GrantFiled: November 27, 2002Date of Patent: September 7, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Fujii, Tatsuo Mifune
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Publication number: 20040084322Abstract: An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine and a reducing sugar, and a compound that forms a reducing sugar upon hydrolysis.Type: ApplicationFiled: November 5, 2002Publication date: May 6, 2004Applicant: COLUMBIA CHEMICAL CORPORATIONInventors: Robert J. Ludwig, William E. Rosenberg
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Patent number: 6706167Abstract: A polymer additive for alkaline zinc and zinc alloy electrodepositing media and processes comprises the reaction product of one or both of (i) a first di-tertiary amine of the formula: where R′ represents and q is 2 to 6, R represents CH3 or C2H5 and each R may be the same or different and m is 2 to 4, and a second di-tertiary amine of the formula: where B is CgH2g+1 and g=0 or an integer the respective B groups being the same or different, and f=0 o an integer, and R″ represents CH3 or C2H5 and each R″ may be the same or different, with (ii) a di-halo alkane of the formula: A—(CH2)n—A where A represents a halogen atom and n is at least 2. The resulting polymer preferably has the general structure: Where: 0≦x≦1 0≦y≦1 and: either (x or y) or (x and y)=1 z is at least 2 and when y=0, n is at least 3.Type: GrantFiled: March 7, 2001Date of Patent: March 16, 2004Inventors: Trevor Pearson, Alan Peter Swales
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Publication number: 20040016363Abstract: A corrosion-inhibiting coating, process, and system that provides a tight, adherent zinc- or zinc-alloy coating that is directly deposited onto steel or cast iron surfaces for enhanced corrosion protection. A process for applying the coating is also provided. The process includes the application of two sequential aqueous baths. The first bath contains a precursor zinc compound while the second bath contains a reducing agent to deposit the zinc directly upon the steel or cast iron.Type: ApplicationFiled: July 24, 2002Publication date: January 29, 2004Inventors: Andrew W. Phelps, Jeffrey A. Sturgill
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Patent number: 6582582Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.Type: GrantFiled: March 9, 2001Date of Patent: June 24, 2003Inventor: Donald Becking
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Publication number: 20030102226Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: October 2, 2001Publication date: June 5, 2003Applicant: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Publication number: 20030070934Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: ApplicationFiled: October 2, 2001Publication date: April 17, 2003Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20020112965Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.Type: ApplicationFiled: December 12, 2001Publication date: August 22, 2002Applicant: Olin Corporation, a corporation of the Commonwealth of VirginiaInventors: Szuchain F. Chen, Leonard R. Howell
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Patent number: 6273943Abstract: An electroless composite plating solution comprising metal ions, a complexing agent for said metal ions, a hypophosphite serving as a reducing agent, a surface active agent, and a water-insoluble composite material, said surface active agent comprising a quaternary ammonium salt surface active agent which has two or more ethylene oxide groups and an alkyl group or a fluorine-substituted alkyl or alkenyl group, said quaternary ammonium salt surface active agent being cationic in nature or exhibiting substantially cationic properties under pH conditions of said plating solution.Type: GrantFiled: January 12, 2000Date of Patent: August 14, 2001Assignee: C. Uyemura & Co., Ltd.Inventors: Tadashi Chiba, Koji Monden
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Patent number: 6197366Abstract: According to the present invention, a metal paste comprising an organo- or inorganometallic compound of a metal that is a solid at ordinary temperature and belongs to group 3 through 15 of the periodic table, and an amino compound as medium, and which exhibits coatable viscosity, is provided. By using the metal paste, metal films of various types of metals or alloys can be formed inexpensively with an industrially simple process and apparatus even on various types of general-purpose, inexpensive substrates having a low softening point such as a glass, plastic, film and so forth, in addition to a ceramic substrate. In particular, the metal film can be formed easily in an ordinary pressure onto a printed wiring board or a substrate to be coated with a metal, which has a poor heat resistance.Type: GrantFiled: November 5, 1999Date of Patent: March 6, 2001Assignee: Takamatsu Research LaboratoryInventor: Hideki Takamatsu
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Patent number: 6183545Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.Type: GrantFiled: June 28, 1999Date of Patent: February 6, 2001Assignee: Daiwa Fine Chemicals Co., Ltd.Inventors: Yoshiaki Okuhama, Takao Takeuchi, Masakazu Yoshimoto, Shigeru Takatani, Emiko Tanaka, Masayuki Nishino, Yuji Kato, Yasuhito Kohashi, Kyoko Kuba, Tetsuya Kondo, Keiji Shiomi, Keigo Obata, Mitsuo Komatsu, Hidemi Nawafune
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Patent number: 6179985Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, cadmium, indium, iron, tin/lead and tin/lead copper.Type: GrantFiled: March 19, 1999Date of Patent: January 30, 2001Assignees: Technic, Inc., Specialty Chemical Systems, Inc.Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel