Abstract: Pedestal assemblies, purge rings for pedestal assemblies, and processing methods for increasing residence time of an edge purge gas in heated pedestal assemblies are described. Purge rings have an inner diameter face and an outer diameter face defining a thickness of the purge ring, a top surface and a bottom surface defining a height of the purge ring, and a thermal expansion feature. Purge rings comprise a plurality of apertures extending through the thickness and aligned circumferentially with a plurality of circumferentially spaced purge outlets in a substrate support.

Abstract: A substrate support includes a substrate support portion having an electrostatic chuck for adsorbing a substrate and a substrate heater electrode inside the electrostatic chuck; a ring support supporting an edge ring and having an edge ring heater electrode inside; a base having a central stage on which the substrate support portion is disposed, and an outer peripheral stage on which the ring support is disposed; a first power feeding terminal disposed immediately below the substrate support portion to supply a power to the substrate heater electrode; and a second power feeding terminal disposed immediately below the ring support to supply the power to the edge ring heater electrode. An upper surface of the outer peripheral stage is positioned lower than that of the central stage, and a thickness of the ring support is equal to or larger than 40% of a thickness of the substrate support portion.

Abstract: Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body having a first surface; one or more receptacles extending through the first surface and into the support body; and one or more protrusions respectively disposed within corresponding ones of the one or more receptacles and projecting from the first surface, wherein the one or more protrusions at least partially define a substantially planar support surface above the first surface. Methods of eliminating backside wafer damage are also disclosed.

Abstract: An apparatus for plasma treatment of an implant prior to installing the implant in a live subject is provided. The apparatus comprises an activation device and a portable container detachable from the activation device. The portable container comprises a closed compartment containing the implant immersed in a fluid, and the activation device comprises a slot configured to receive the portable container. The activation device further comprises an electrical circuit configured to be electrically associated with at least one electrode and configured to provide to the at least one electrode electric power suitable for applying a plasma generating electric field in the closed compartment, when the portable container is disposed in the slot. A container suitable for providing plasma treatment to a silicone implant and a method for preparing an implant for implantation surgery are also provided.

Abstract: A ceramic heater includes a ceramic plate in which inner circumferential side and outer circumferential side resistance heating elements are built in; and a cylindrical shaft joined to a rear surface of the ceramic plate. A long hole is provided along a direction deviated from the diameter direction of the ceramic plate, and extends from a start point of a shaft inside area to a terminal position of the outer circumferential portion of the ceramic plate. A portion of the long hole forms a long groove, the portion passing through the shaft inside area. Terminals of the resistance heating elements are collectively provided in one of two division areas which are in the shaft inside area and divided by an axial line of the long groove, the one being a first division area having a larger area.

Abstract: A substrate support includes an electrostatic chuck having an upper surface, and a cover positioned on the electrostatic chuck to cover the upper surface thereof. The cover includes a first face adjacent the upper surface of the electrostatic chuck, a second face for supporting a substrate, and one or more conduits extending through the cover to permit a cooling gas to flow from the second face to the first face. The cover is made from a dielectric material.

Abstract: A powder-coating process of a brake caliper has in sequence the steps of: (a) preparing the brake caliper; (b) applying masking elements to at least one seat and/or duct of said brake caliper; (c) distributing the coating powder on at least one portion of said brake caliper; (d) removing the at least one masking element by automated de-masking means; (e) curing inside a curing oven.

Abstract: The invention concerns a device and a method for measuring the relative position and angles between two bodies to be measured (7, 77). The invention is characterized in that it comprises one or more permanent magnets (6) and in that the position to be measured is determined indirectly via a magnetic field. The magnetic field is detected by one or more magnetic field sensors (3) read by a microchip. A mathematical minimization method is used to calculate back to the position and angles of the permanent magnet system (6) in relation to the magnetic field sensors (3). The energy required to read out the sensors can be obtained from the excitation field of a readout device. The sensor can perform without energy supply and can be read out by means of standard readout devices, such as an NFC-capable mobile telephone.

Abstract: A wood-plastic/lumber composite co-extrusion feeder includes a frame, wherein at least one group of toothed conveying units, a tooth mark milling unit for milling tooth marks on an outer surface of a lumber, and a lumber co-extrusion mold are arranged on the frame in sequence, each toothed conveying unit includes a lower toothed pressure roller installed on a first fixed bearing seat and an upper toothed pressure roller installed on a first movable bearing seat, and after the first fixed bearing seat and the first movable bearing seat are connected by an adjustment unit, a first conveying channel having an adjustable height is formed between the upper toothed pressure roller and the lower-toothed pressure roller.

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

Abstract: A lift pin assembly is provided. The lift pin assembly includes a level bolt mounted on a first frame lifted by a lifting device, a lift pin having a weight provided at a lower end of the lift pin, and supported by the level bolt, and a pressing bracket to forcibly move down the lift pin, when the lift pin is locked into a pin hole. The pressing bracket is adjusted in height to be set while maintaining a specific gap to a top surface of the weight.

Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.

Abstract: When processing of all the wafers accommodated in a first cassette mounted on a first cassette stage is ended, the last wafer is conveyed out from a holding surface of a chuck table, and the holding surface becomes vacant, the wafer accommodated in a second cassette mounted on a second cassette stage is immediately conveyed onto the holding surface, by control by a conveyance control section. When the wafer to be held by the holding surface is changed from the wafer conveyed out from the first cassette to the wafer conveyed out from the second cassette, processing conditions are changed over to the processing conditions corresponding to the second cassette stage, by changeover control by a changeover section.

Abstract: The invention relates to a workpiece carrier device (1) comprising: a drive gear (3) for receiving workpiece arrangements (4), which is rotatable about a main axis (2), a number of drive bodies (6), which are arranged on the drive gear (3), are respectively rotatable about an axis of rotation (5) and each have a drive pinion (8) and a stationary internal input gear (9) with an inner toothing, which meshes with the drive pinions (8), wherein the axes of rotation (5) extend parallel to the main axis (2) and are arranged in an annular region of the drive gear (3) that runs concentrically in relation to the main axis (2), and so, when there is rotation of the drive gear (3) relative to the internal input gear (9), the drive bodies (6) rotate about their respective axes of rotation (5), wherein the internal input gear (9) and the drive bodies (6) with their drive pinions (8) are formed and arranged in relation to one another and a working clearance (S) is provided between the internal input gear (9) and the drive

Abstract: A substrate processing apparatus capable of locally controlling a plasma intensity and improving thin film properties and thickness uniformity includes: a power supply unit, a processing unit electrically connected to the power supply unit, and a substrate support unit below the processing unit, wherein the substrate support unit includes a first ground electrode and a second ground electrode.

Abstract: An apparatus includes: a substrate holder including a base member and configured to hold a substrate so as to be spaced apart upward from the base member; a rotary driver configured to rotationally drive the substrate holder; a processing liquid nozzle configured to supply a processing liquid to the substrate; a liquid receiving cup configured to receive the processing liquid scattered from the substrate; a cup exhaust passage configured to suction an atmosphere in the liquid receiving cup; a purge gas nozzle configured to discharge a purge gas into a space formed between the substrate and the base member; a purge gas flow rate controller configured to control a flow rate of the purge gas discharged from the purge gas nozzle; and a controller configured to control at least an operation of the purge gas flow rate controller.

Abstract: The present disclosure provides a spray coater including a spray nozzle unit having at least one spray nozzle and configured to spray a coating material, a spray nozzle transfer unit configured to control a position of the spray nozzle unit by operating a transfer block, on which the spray nozzle unit is mounted, at least in a planar direction, a substrate seating unit positioned below the spray nozzle unit and configured such that a substrate, which is subjected to coating, is seated thereon, a substrate carrier configured to accommodate the substrate before the substrate is coated and accommodate the substrate after the substrate is coated, and a robot arm configured to unload the substrate from the substrate carrier and provide the substrate to the substrate seating unit before the substrate is coated or unload the substrate from the substrate seating unit and load the substrate on the substrate carrier after the substrate is coated.

Abstract: A method includes receiving a plurality of sets of sensor data associated with a processing chamber of a substrate processing system. Each of the plurality of sets of sensor data comprises a corresponding sensor value of the processing chamber mapped to a corresponding spacing value of the processing chamber. The method further includes providing the plurality of sets of sensor data as input to a trained machine learning model. The method further includes obtaining, from the trained machine learning model, one or more outputs indicative of a health of the processing chamber. The method further includes causing, based on the one or more outputs, performance of one or more corrective actions associated with the processing chamber.

Abstract: A resonator device includes: a base including a semiconductor substrate; a resonator element; and a lid to be bonded to the base, the lid and the base forming a cavity for accommodating the resonator element. An integrated circuit is disposed at the semiconductor substrate, the integrated circuit including an oscillation circuit electrically coupled to the resonator element, a memory circuit configured to store a reference value of an output characteristic of the resonator element, and a determination circuit configured to compare a detection value of the output characteristic of the resonator element with the reference value and determine an airtight state inside the cavity based on a comparison result.

Abstract: A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.

Abstract: A vacuum processing apparatus that can excellently perform uniform processing and can efficiently perform regular maintenance and occasional maintenance even in the case where the diameter of a workpiece is increased. A vacuum processing apparatus having a vacuum transport chamber includes: a lower container in a cylindrical shape; a sample stage unit including a sample stage and a ring-shaped sample stage base having a support beam disposed in axial symmetry with respect to the center axis of the sample stage; an upper container in a cylindrical shape; and a moving unit that is fixed to the sample stage base and moves the sample stage unit in the vertical direction and in the horizontal direction.

Abstract: A pizza saucer having a housing in which components may be mounted. The housing includes a base having an upwardly facing deck, a neck that extends from the base to a head, and a manifold mounted to the head facing the deck. The housing contains at least one pump to convey pizza sauce from a source to the manifold, and a computer that controls a rotary prime mover in the base with a driveshaft extending through the deck to a tray drivingly linked to the driveshaft. An input, such as a touchscreen, is mounted to the head and faces the user during operation. With the touchscreen, the user may input the crust size. The computer actuates the pumps and the rotary prime mover, simultaneously causing the crust to rotate 360-370 degrees and the manifold to dispense sauce onto the crust until the crust is coated.

Abstract: A substrate support device relating to technology disclosed in the description of the present application includes: a holding plate for opposing a substrate bowable by being heated by irradiation with flash light; and a plurality of substrate support pins provided on the holding plate and being for supporting the substrate, wherein the plurality of substrate support pins are arranged at locations where a volume of a space between the holding plate and the substrate in an unbowed state and a volume of a space between the holding plate and the substrate in a bowed state are equal to each other. Breakage of the substrate can be suppressed in a case where the substrate is bowed by flash light.

Abstract: A deposition apparatus including a chamber having a deposition area and a non-deposition area, a gas intake device communicated with the chamber, a gas annulus disposed in the chamber and surrounding the gas intake device, a carrier disposed in the deposition area and a retaining annulus disposed in chamber and surrounding the carrier. The gas intake device is disposed corresponding to the deposition area and configured to draw a process gas into the deposition area. The gas annulus is configured to generate an annular gas curtain in the deposition area. The carrier carries a deposited object, wherein the gas annulus is located between the gas intake device and the carrier. The deposited object is surrounded by the annular gas curtain. The retaining annulus has a plurality of through holes. The retaining annulus is located between the gas annulus and the carrier.

Abstract: A reticle cleaning system includes a casing, a reticle holder, and a static charge reducing device. The reticle holder is in the casing and configured to hold a reticle. The static charge reducing device is above the reticle holder and includes a fluid generator, an ionizer, and a static charge sensor. The fluid generator is configured to control a humidity condition in the casing. The ionizer is configured to provide ionized air molecules to the reticle. The static charge sensor is configured to detect a static charge value on the reticle, wherein the ionizer is between the fluid generator and the static charge sensor.

Abstract: A carrier plate for receiving a wafer includes a pocket defined in a middle section on a top surface of the carrier plate and has a surface diameter. The pocket defines a substrate support region. A retaining feature of the carrier plate is defined at an outer edge of the pocket. A tapered portion of the carrier plate extends from the retaining feature to an outer diameter. The tapered portion is configured to receive a focus ring. A bottom surface of the carrier plate is configured to sit over a pedestal that is used in a process chamber. A plurality of wafer supports is disposed on a top surface of the substrate support region to support the wafer, when received.

Abstract: An electrostatic-chuck heater is a Johnsen-Rahbek electrostatic-chuck heater and is used in a process of forming a conductive film on a wafer. The electrostatic-chuck heater includes a disc-shaped ceramic base including an electrostatic electrode and a heating resistor, and a hollow shaft attached to a side of the ceramic base that is opposite a wafer-mounting surface. A protruding ring is provided on the wafer-mounting surface and having an outside diameter smaller than a diameter of the wafer. A through-hole extends in a peripheral wall of the hollow shaft from a lower end through to an area of the wafer-mounting surface that is on an inner side with respect to the protruding ring. The through-hole allows gas to be supplied from the lower end of the hollow shaft into a below-wafer space enclosed by the wafer-mounting surface, the protruding ring, and the wafer mounted on the wafer-mounting surface.

Abstract: A substrate support assembly arranged in a chamber includes: a support plate including a first surface on which a substrate is seated; a driver configured to tilt the support plate such that the first surface is inclined with respect to a reference surface by a lower inclination angle; and a controller configured to control the driver such that the lower inclination angle is adjusted based on an upper inclination angle formed by the inclination of the gas supplier coupled to the upper surface of the chamber with respect to the reference surface.

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

Abstract: A removable window cassette (100) for a bottom-up stereolithography apparatus includes (a) a light-transmissive window (110) having a rigid bottom portion (112), a semipermeable top portion (114), and a fluid flow region therebetween; (b) a circumferential frame (120) surrounding said window and into which said window is recessed, said frame having a top portion, a bottom portion, and an internal wall portion (120C), said frame internal wall portion defining with said window semipermeable top portion a well into which a polymerizable liquid may be received; and (c) a plurality of clamp draw-in pins (140) connected to said frame bottom portion and extending downward therefrom; and (d) at least a first and second port (150A, 150B) connected to said frame bottom portion, with said first port in fluid communication with said second port through said window fluid flow region.

Abstract: A method includes providing thermal energy to a component, determining a thermal response of the component in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting a surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.

Abstract: A method includes estimating a replacement time of a consumable part of a processing device, specifying a timing after substrate processing of the processing device is completed in a period before the replacement time as a replaceable timing of the consumable part, estimating a movement time period required for the part transporting device to move to a position of the processing device requiring the replacement, and estimating a preparation time period required for preparation until the part transporting device moved to the position of the processing device requiring the replacement becomes a state in which the consumable part is replaceable. The method further includes transmitting a replacement instruction to the part transporting device at a timing before a timing that is earlier than the replaceable timing by a total time of the movement time period and the preparation time period, and instructing the replacement of the consumable part.

Abstract: A method of applying an air barrier material to an inner surface of a tire includes steps of: (a) performing a post-cure inflation of the tire; (b) placing the tire onto a dump gate platform after finishing the post-cure inflation of the tire; and (c) spraying the air barrier material onto the inner surface of the tire while the tire is on the dump gate platform.

Abstract: The present disclosure provides an electrostatic chuck device capable of uniformly cooling or heating a fixedly adsorbed substrate. The electrostatic chuck device includes an electrostatic chuck plate, a bonding layer, and a base. The bonding layer has a bonding agent bonded to a rear surface of the electrostatic chuck plate. The base has a bonding surface bonded to the bonding layer and a plurality of protrusions radially extending from a central part toward an outer circumferential surface of the bonding surface. The ends of the respective protrusions on the central part may be arranged at intervals.

Abstract: A processing chamber includes a ground shield and a cover ring. The ground shield includes an annular body, and at least one guide pin extending from the annular body. The cover ring is positioned on the ground shield, and includes an annular body including at least one recess. At least a part of the at least one guide pin is receivable in the at least one recess, an inner cylindrical ring extends from the annular body, and an outer cylindrical ring extends from the annular body and is radially separated from the inner cylindrical ring by a horizontally extending portion of the annular body.

Abstract: A method deposits an epitaxial layer on a front side of a semiconductor wafer having monocrystalline material. The method includes: providing the semiconductor wafer; arranging the semiconductor wafer on a susceptor; heating the semiconductor wafer to a deposition temperature using thermal radiation directed to the front side and to the rear side of the semiconductor wafer; conducting a deposition gas over the front side of the semiconductor wafer; and selectively reducing an intensity of a portion of the thermal radiation that is directed to the rear side of the semiconductor wafer, as a result of which first partial regions at an edge of the semiconductor wafer, in the first partial regions a growth rate of the epitaxial layer is greater than in adjacent second partial regions given uniform temperature of the semiconductor wafer owing to an orientation of the monocrystalline material, are heated more weakly.

Abstract: The present invention provides a stage which comprises: a plate-shaped member having a mounting surface on which a workpiece to be processed is mounted and a rear surface facing the mounting surface, said plate-shaped member being provided with a through hole that penetrates through the mounting surface and the rear surface; and an embedded member disposed inside the through hole. This stage is configured such that the surface of the embedded member is provided with at least one of a concave portion and a convex portion.

Abstract: There is provided the substrate holder for holding a substrate comprising a first holding member, a second holding member, a sealing member, a pin, a ring, and a moving mechanism. The sealing member forms a sealed space inside the substrate holder. The pin is fixed to one of the first holding member and the second holding member. The ring is disposed on another of the first holding member and the second holding member. The ring engages with the pin. The moving mechanism circumferentially moves the ring. The pin and the ring are engaged with one another to fix the first holding member and the second holding member to one another. The pin and the ring are disposed inside the sealed space.

Abstract: A horizontal substrate carrier is provided, for example a carrier for holding semiconductor substrates during horizontal thermal processing. The horizontal substrate carrier has asymmetrically placed support rails. One side of the horizontal substrate carrier has no upper rail while the other side of the horizontal substrate carrier has an upper rail placed at a relatively high location, for example at an angular location of 60° or more, more preferably of 70° or more, and most preferably at 90°. The side without an upper rail may be used for robotic loading of the horizontal substrate carrier. In a preferred embodiment, only three rails are provided: one upper rail on one side and two lower rails. The use and placement of these three rails can hold the substrate in precise uniform locations, minimize substrate movement, and minimize particle generation, all while allowing for easy robotic access.

Abstract: A pedestal assembly including a pedestal for supporting a substrate. A central shaft positions the pedestal at a height during operation. A ring is placed along a periphery of the pedestal. A ring adjuster subassembly includes an adjuster flange disposed around a middle section of the central shaft. The subassembly includes a sleeve connected to the adjuster flange and extending from the adjuster flange to an adjuster plate disposed under the pedestal. The subassembly includes ring adjuster pins connected to the adjuster plate and extending vertically from the adjuster plate. Each of the ring adjuster pins being positioned on the adjuster plate at locations adjacent to and outside of a pedestal diameter. The ring adjuster pins contacting an edge undersurface of the ring. The adjuster flange coupled to at least three adjuster actuators for defining an elevation and tilt of the ring relative to a top surface of the pedestal.

Abstract: Holding apparatus 100 for electrostatic holding component 1 (e.g., semiconductor wafer), includes base body 10 with at least one plate 10A, protruding burls 11 on upper side of plate and end faces 12 of which span a burls support plane for supporting component, and electrode device 20 in layered form in spacings between burls and insulator layer 21 which is connected to plate, dielectric layer 23 of inorganic dielectric and electrode layer 22 between insulator and dielectric layers. Between burls support plane and dielectric layer upper side, predetermined gap spacing A is set. Electrode device has openings 24 and is on plate upper side between burls, which protrude therethrough. Insulator layer includes inorganic dielectric and is connected with adhesive 13 to base body upper side between burls. Electrode device is embedded in adhesive. Spacing between burls and electrode device is filled with adhesive. A production method is also described.

Abstract: A cleaner holder comprises a base, a stand coupled to the base and extending upward from the base, a support body coupled to an upper portion of the stand and configured to support a cleaner, and a cleaning module support coupled to the stand and configured to support a cleaning module of the cleaner. The cleaning module may be detachably coupled to an extension tube of the cleaner.

Abstract: A system and method for robotic container storage, handling, and transfer system and method includes a grid structure formed of two substantially perpendicular sets of rails above a portion of at least one transport network, a robotic load handling device operating on the grid structure, a vehicle means located on the at least one transport network below the grid structure configured to receive a container, the robotic load handling device being provided with an engaging means for engaging the container and a lifting means configured for lifting the container from the vehicle means for movement to an alternative location, wherein one or more portions of the rails above the vehicle means of the transport network are missing in a direction transverse to a direction of the transport network forming one or more open grid spaces enabling alignment of the robotic load handling device above the vehicle means.

Abstract: A substrate support for use in a plasma processing chamber includes a substrate support body, a lifter pin and a lift mechanism. The substrate support body has a pin through-hole and the pin through-hole has a female-threaded inner wall. The lifter pin has a base segment, an intermediate segment, and a leading segment. The lifter pin is inserted into the pin through-hole, the intermediate segment is male-threaded, and the male-threaded intermediate segment is screwable to the female-threaded inner wall. The lift mechanism is configured to vertically move the lifter pin relative to the substrate support body.

Abstract: A susceptor for a CVD reactor includes a flat circular disc-shaped body with channels that are arranged on a broad side of the disc-shaped body within one or more circular surface sections extending on a plane in order to transfer heat to a substrate holder. The channels run about respective centers of the one or more circular surface sections in a spiral manner and are formed as depressions that are open towards the plane. An end of each of the channels has a channel opening, the channel openings being fluidically connected to a feed opening arranged at the end of a gas supply line. Additionally, the one or more surface sections are equipped with one or more influencing elements that influence the local heat transfer and are formed as open depressions on the plane or as insert pieces that plug into the depressions.

Abstract: A plasma processing apparatus includes: a detector configured to detect a change in an intensity of light emission from plasma formed inside a processing chamber; and a unit configured to adjust conditions for forming the plasma or processing a wafer arranged inside the processing chamber using an output from the detector, wherein the detector detects a signal of the intensity of light emission at plural time instants before an arbitrary time instant during processing, and wherein the adjusting unit removes the component of a temporal change of a long cycle of the intensity of light emission from this detected signal and detects the component of a short temporal change of the intensity of light emission, and adjusts the conditions for forming the plasma or processing a wafer arranged inside the processing chamber based on the short temporal change of the detected intensity of light emission.

Abstract: A loading jig and an evaporator are provided. The loading jig includes a body and at least one elastic membrane. The body has a plate-like structure and is sandwiched between the bearing platform and the plurality of clamping blocks. Said at least one elastic membrane is respectively disposed between at least one clamping block and a bottom of the body. The elastic membrane is externally connected to a signal converter. The pressure applied by the clamping block may be measured through the elastic membrane when the clamping block is pressed against the bottom of the body, and then the measured pressure signal is transmitted to the signal converter to be converted into a pressure value.

Abstract: A workpiece susceptor body can include a front face configured to support a workpiece, a back face opposite the front face, a workpiece contact zone at least partially forming a support boundary on an inner portion of the front face, and a plurality of axial channels disposed within the susceptor body. The workpiece contact zone can be disposed radially inward of an outer edge of a workpiece positioned on the front face in a processing configuration. Each of the plurality of axial channels may connect to corresponding openings extending into an outer portion of the front face. Each of the openings may be disposed radially outward of the workpiece contact zone of the susceptor body.

Abstract: A tooling for wheel spraying reinforcement can uniformly apply a hard coating on the inner rim and the spoke back cavity of a wheel, and can effectively solve the technical problems of uneven spraying and poor roundness. The high-precision spraying of the hard coating of the wheel is realized, and the device has novel structure, advanced technology and high universality.

Abstract: A biological reaction apparatus for receiving at least one substrate having a sample located in a sample region, and a separate cover, such that a reaction chamber is formed between the cover and substrate over the sample region, wherein the apparatus includes a locating means to locate the substrate; a cover locating means for locating and moving the cover with respect to the substrate; a fluid dispensing means for dispensing fluid into the reaction chamber; and a draining mechanism; wherein the draining mechanism includes wicking means.