Abstract: A method of separating excess resin from at least one object includes: (a) stereolithographically producing at least one object, each object having at least one retention feature (32) formed thereon, each object carrying excess resin on a surface thereof; then (b) mounting each object on at least one transfer frame (21), each transfer frame having at least one retention member (22) that mates with the retention feature; (c) connecting each transfer frame to a rotor with the at least one object carried thereon; (d) centrifugally separating excess resin from each object by spinning the rotor with each transfer frame connected thereto while the at least one object remains connected to each transfer frame by the retention feature; then (e) removing each transfer frame from the rotor, with excess resin separated from each at least one object thereon.

Abstract: According to one embodiment, an electrostatic chuck apparatus includes a substrate support plate formed of a dielectric material. The substrate support plate includes: a plurality of support bases protruding from an upper surface of the substrate support plate, a plurality of ground electrodes formed inside the substrate support plate, each of the ground electrodes at a corresponding position to a respective one the support bases, and an electrostatic chuck electrode provided below the ground electrodes.

Abstract: A substrate fixing device includes a first supporter supporting at least one substrate and a second supporter connected to the first supporter, making contact with a first surface and a second surface of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that a third surface faces a normal line direction of the first supporter. The second supporter defines a deposition surface including the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface in the at least one substrate and exposes the defined deposition surface to the deposition processing space. A deposition processing equipment including the substrate fixing device and a deposition processing method using the deposition processing equipment are also provided.

Abstract: Embodiments described herein generally relate to process chambers with coaxial lift devices. In some embodiments, the device comprises both a bottom bowl lift and a pedestal lift. The bottom bowl lift supports a bottom bowl and is configured to move the bottom bowl into a position that reduces the process volume. The bottom bowl lift is co-axial with the pedestal lift and the bottom bowl lift and the pedestal lift are attached for vacuum operation. The pedestal lift includes multiple actuators to create a dynamic lift mechanism. Both systems complete a nested system such that the bottom bowl lift is adjustable and can close the bottom bowl creating a symmetric and small process volume. The pedestal lift can move independently to its process position and tilt in a desired direction without interference with the bottom bowl lift, increasing film uniformity on a processed substrate.

Abstract: A painting system includes painting unit including a first painting robot and a second painting robot, a cartridge carrier, and a cleaning tank. The painting robots each include a robot arm including a painting machine. The cartridge carrier includes a cartridge grip part. A first region is a region where a movable region of the painting machine of the first painting robot overlaps with a movable region of the cartridge grip part. A second region is a region where the movable region of the painting machine of the second painting robot overlaps with the movable region of the cartridge grip part. The cleaning tank is provided in a position including at least a part of the first region and at least a part of the second region.

Abstract: Impregnation plant for internally hollow cylindrical components (stators) of electric motors including working stations arranged linearly and sequentially, managed and controlled by central processing unit; and a plurality of motor-driven elements to impart rotatory motion, in both directions of rotation, and tilting motion, in both directions respective to a predefined plane, to each component mounted onto a respective support device when such support device is inserted into the plant working stations. Each support device has a spring collet in turn has blocks clamping the component onto the inner diameter of its respective cylindrical body. Each spring collet entirely crosses the component cylindrical body to rest on both of its respective circumferential ends. An impregnation method for electric motor components using the impregnation plant, wherein the component is rotatable in both directions about a support device predefined axis, and tiltable respective to a predefined plane of such support device.

Abstract: An embodiment of a line-of-sight coating fixture includes a support structure, a spindle, and a shadow structure. The support structure includes a plurality of compartments disposed below a platter, each compartment having an opening on a periphery of the support structure. Each compartment is adapted to receive and secure a base of a workpiece such that a body of each workpiece to be coated is disposed about a periphery of the support structure and extends above the platter. The spindle is disposed through a center of the platter or support structure for rotating the workpieces thereabout. The shadow structure is disposed about the spindle, inside of the periphery, the shadow structure sized and adapted to shield a portion of each workpiece from line-of-sight coating material.

Abstract: An atomic layer deposition device is disclosed. The atomic layer deposition device includes a chamber, a precursor inlet, a heater, a support unit, a hollow component, and a baffle. When the heater and the support unit are driven by a lifting device to approach the hollow component, the support unit and the baffle surround and set bounds to a reaction space, so that the flow field of the process fluid, such as precursor or purge gas, can be adjusted stably to make a uniform deposition on the substrate.

Abstract: The present invention relates to a clutch arrangement (500) of a vehicle transmission arrangement (100), the clutch arrangement (500) being positioned within a clutch bell housing (206) of the vehicle transmission and comprising a pneumatically controlled actuator arrangement (208) connectable to a first clutch unit (202) of the vehicle transmission arrangement (100) and arranged to controllably position the first clutch unit (202) between a closed position and an opened position, a pneumatically controlled brake actuator arrangement (210) connectable to a second clutch unit (204) of the transmission arrangement and arranged to controllably position the second clutch unit (204) between a closed position and an opened position, and a valve unit (302) connected to the pneumatically controlled actuator arrangement (208) and the pneumatically controlled brake actuator arrangement (210), wherein the valve unit (302) comprises a clutch valve (308) arranged in fluid communication with the pneumatically controlled ac

Abstract: Embodiments of this application disclose methods and apparatuses for processing information for a goods-picking container, and a store system including a first area for storing goods and performing a plurality of goods-picking tasks, wherein each of the plurality of goods-picking tasks corresponds to one of one or more delivery batches and is performed with one of a plurality of goods-picking containers; an automatic transfer device configured to automatically transfer each of the plurality of goods-picking containers containing goods picked according to a corresponding goods-picking task in the first area to the second area; the second area for grouping the plurality of goods-picking containers into one or more groups, and for transferring the group of goods-picking containers to a third area; and the third area for packing the goods contained in the plurality of goods-picking containers according to each of the plurality of delivery batches.

Abstract: There is provided a device and method for accurately positioning a substrate on a stage by a simple method using power of a movement mechanism provided for a movable stage. A substrate holding device for holding a substrate is provided. The substrate holding device includes a substrate stage for supporting the substrate, a stage drive mechanism for causing the substrate stage to move, positioning pin for positioning the substrate on the substrate stage, first urging members each urging the positioning pin, and a stopper member capable of applying a force against the urging member to the positioning pin. The positioning pin is configured to move together with the substrate stage by the stage drive mechanism. The positioning pin moving together with the substrate stage allows the substrate to be positioned on the substrate stage.

Abstract: A semiconductor manufacturing apparatus includes a mounting unit arranged to mount an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate. The apparatus further includes a holding unit arranged to hold the work substrate having the annular member mounted thereto. The apparatus further includes a first fluid supply unit arranged to supply a first fluid to the second substrate of the work substrate held by the holding unit.

Abstract: Packaging is used to store articles to be customized by methods including embroidery, wherein the packaging includes at least two portions defining a window, and wherein the two portions of the packaging hold a portion of the article, for example a fabric panel, taut across the window so that the portion of the article may be embroidered by an embroidery machine while retained by portions of the packaging. The packaging may be in the form of a box during embroidery, or may be converted into the form of a box after embroidery.

Abstract: Provided is holding finger 21 with which a thin-plate substrate W that has been subjected to surface processing can be transferred without generating a natural oxide film on a surface to be processed of the thin-plate substrate W.

Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

Abstract: A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system.

Abstract: Embodiments of the present disclosure include methods and apparatuses utilized to reduce residual film layers from a substrate periphery region, such as an edge or bevel of the substrate. Contamination of the substrate bevel, backside and substrate periphery region may be reduced after a plasma process. In one embodiment, an edge ring includes a base circular ring having an inner surface defining a center opening formed thereon and an outer surface defining a perimeter of the base circular ring. The base circular ring includes an upper body and a lower portion connected to the upper body. A step is formed at the inner surface of the base circular ring and above a first upper surface of the upper body. The step defines a pocket above the first upper surface of the upper body. A plurality of raised features formed on the first upper surface of the base circular ring.

Abstract: There is provided a substrate holding mechanism of holding a substrate in a predetermined substrate holding region on a susceptor, including: a substrate holding member installed around the substrate holding region and configured to be in contact with a lateral surface of the substrate mounted on the substrate holding region at a predetermined contact surface of the substrate holding member when the substrate holding member is rotated inward of the substrate holding region; a biasing part configured to apply a biasing force with respect to the substrate holding member such that the substrate holding member is brought into contact with the lateral surface of the substrate to hold the substrate; and a release member configured to apply a pressing force against the biasing force of the biasing part with respect to the substrate holding member such that the substrate holding member is released to vertically lift up the substrate.

Abstract: A plasma processing apparatus includes a chamber, a mounting table 2 and a focus ring 8. The chamber is configured to process a semiconductor wafer W with plasma. The mounting table 2 is provided within the chamber, and includes a holding surface 9a on which the semiconductor wafer W is mounted. The focus ring 8 is provided to surround the semiconductor wafer W mounted on the holding surface 9a, and includes a first flat portion 8a, a second flat portion 8b and a third flat portion 8c which are formed in sequence from an inner circumferential side of the focus ring 8 toward an outer circumferential side thereof. Here, the first flat portion 8a is lower than the holding surface 9a, the second flat portion 8b is lower than the first flat portion 8a, and the third flat portion 8c is higher than the first flat portion 8a.

Abstract: A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.

Abstract: A plasma processing apparatus includes a mounting stage on which a substrate is mounted, a focus ring arranged around a periphery of the mounting stage, a plurality of magnetic members arranged at a surface of the focus ring and a surface of the mounting stage facing opposite each other, and a temperature adjustment unit configured to adjust a temperature of the focus ring by introducing a heat transfer gas between the surface of the focus ring and the surface of the mounting stage facing opposite each other.

Abstract: Provided is a substrate holder where an effect of a pressure of a plating solution can be suppressed. A substrate holder includes first and second holding members for sandwiching a substrate. The first holding member includes: a support base; a movable base for supporting the substrate; and a biasing mechanism disposed between the support base and the movable base, and biasing the movable base in a direction along which the movable base is separated from the support base. The second holding member includes a protruding portion brought into contact with the substrate so as to seal the substrate. A biasing force of the biasing mechanism which is applied to a region or a position of the movable base differs from a biasing force of the biasing mechanism which is applied to another region or at another position of the movable base.

Abstract: A cloth heating apparatus includes a body, a receiver, a cloth holder, and a heater. The receiver is disposed in the body. The cloth holder is removably attached to the receiver, to hold a cloth. The heater is disposed in the body, to heat the cloth. The cloth holder is removably attachable to a printing apparatus to print an image on the cloth, with the cloth held on the cloth holder.

Abstract: A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.

Abstract: A five axis welding positioner has a horizontally oriented indexing axis for indexing a welding part between workstations. The indexing axis corresponds to a first axis of rotation. Each workstation has a “C” shaped frame for holding a welding part and may be tilted about a tilting axis. The tilting axes of each workstation correspond to second and third axes of rotation. Each “C” shaped frame has a head stock and tail stock that can rotate the welding part about a rotation axis. The rotation axes correspond to fourth and fifth axes of rotation. Movement about each axis can be effectuated by an actuator such as a motor.

Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.

Abstract: A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.

Abstract: Embodiments of the invention provide a mechanical chuck and a plasma processing apparatus.

Abstract: A temperature control device includes a moving stage allowed to be heated and configured to mount a processing target object on a top surface thereof; a cooling body allowed to be cooled and fixed at a position under the moving stage; a shaft, having one end connected to the moving stage; the other end positioned under the cooling body; a first flange provided at the other end; and a second flange provided between the first flange and the cooling body, extended between the one end and the other end; a driving plate, provided between the first flange and the second flange, having a top surface facing the second flange and a bottom surface opposite to the top surface; an elastic body provided between the bottom surface of the driving plate and the first flange; and a driving unit configured to move the driving plate up and down.

Abstract: There is provided a sputtering apparatus in which a holding body holding a substrate by facing a target in a processing chamber is covered by a deposition preventive plate including a substrate retainer for covering a peripheral edge part of the substrate, and a thin film made of metal is deposited on a surface of the substrate exposed to an inside of the deposition preventive plate. A stopper protrusion protrudes at a portion in which the holding body and the deposition preventive plate face each other from one part to the other part, and face the holding body or the deposition preventive plate at a smaller interval than the interval between the deposition preventive plate and the substrate retainer.

Abstract: A fixture assembly includes a standoff, a backplate and a spray coating shield attached to a support. The assembly supports a workpiece and sprays a base coat at substantially ninety degrees with respect to a surface of the workpiece to coat the workpiece with the base coat. The assembly sprays a top coat at an angle with respect to the surface of the workpiece to mask a shadowed surface area of the workpiece, where the angle different from ninety degrees.

Abstract: In a substrate processing apparatus, a shield plate includes a first chucking magnetic material (441). The shield plate is moved up and down by a chamber opening-and-closing mechanism. A substrate holding part includes a movable chuck member (412) and a fixed chuck member. The movable chuck member (412) includes a second chucking magnetic material (442). When the shield plate is moved down, the shield plate comes in close proximity to the upper surface of a substrate (9), and the first chucking magnetic material (441) comes in close proximity to the second chucking magnetic material (442). The substrate (9) is held by magnetic action between the first chucking magnetic material (441) and the second chucking magnetic material (442). It is thus possible to hold the substrate (9) with a simple structure.

Abstract: Variable geometry process kits for use in semiconductor process chambers have been provided herein. In some embodiments, a process kit for use in a semiconductor process chamber includes: an annular body configured to rest about a periphery of a substrate support; a first ring positioned coaxially with the annular body and supported by the annular body; a second ring positioned coaxially with the first ring and supported by the first ring; and an annular shield comprising a horizontal leg positioned coaxially with the second ring such that a portion of the horizontal leg is aligned with and below portions of the first ring and second ring.

Abstract: Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.

Abstract: A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a wafer setting module on which a wafer is to be set. The apparatus further includes a cover module configured to cover a portion of the wafer set on the wafer setting module. The apparatus further includes a position controller configured to detect a position of the wafer set on the wafer setting module and control a position of the cover module based on the detected position of the wafer.

Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.

Abstract: In a substrate processing apparatus, a shield plate includes a first chucking magnetic material (441). The shield plate is moved up and down by a chamber opening-and-closing mechanism. A substrate holding part includes a movable chuck member (412) and a fixed chuck member. The movable chuck member (412) includes a second chucking magnetic material (442). When the shield plate is moved down, the shield plate comes in close proximity to the upper surface of a substrate (9), and the first chucking magnetic material (441) comes in close proximity to the second chucking magnetic material (442). The substrate (9) is held by magnetic action between the first chucking magnetic material (441) and the second chucking magnetic material (442). It is thus possible to hold the substrate (9) with a simple structure.

Abstract: A lenticular label for a container, such as a curved glass bottle, is formed of a lenticular array having a plurality of lenticules on a front face and a smooth back face and a compliant base layer having first and second faces. A first adhesive is disposed between the first face of the compliant base layer and the smooth back face of the lenticular array. The first adhesive is in substantial contact with both the first face of the compliant base layer and the smooth back face of the lenticular array. A second adhesive is disposed upon the second face of the base layer.

Abstract: A multi-stepped boat assembly includes a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in the stack hole. A guide boat has at least one guide hole vertically aligned with the at least one stack hole. The guide boat is removably attachable to the stack boat. An inner sidewall of the stack hole includes a first step configured to receive the first semiconductor package, and a second step provided on the first step and configured to receive the second semiconductor package. The guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.

Abstract: The present disclosure relates generally to a fixture for use in applying a coating to a multiple vane nozzle for use in a turbomachine. The fixture includes first and second masks that are applied to opposite sides of the nozzle to mimic the geometry and spacing of the vanes of the nozzle.

Abstract: Methods and apparatus for in-situ plasma cleaning of a deposition chamber are provided. In one embodiment a method for plasma cleaning a deposition chamber without breaking vacuum is provided. The method comprises positioning a substrate on a susceptor disposed in the chamber and circumscribed by an electrically floating deposition ring, depositing a metal film on the substrate and the deposition ring in the chamber, grounding the metal film deposited on the deposition ring without breaking vacuum, and removing contaminants from the chamber with a plasma formed in the chamber without resputtering the metal film on the grounded deposition ring and without breaking vacuum.

Abstract: Provided are a substrate supporting unit and a substrate processing apparatus, and a method of manufacturing the substrate supporting unit. The substrate supporting unit includes a susceptor on which a substrate is placed on a top surface thereof, one or more heat absorbing members which are capable of being converted between a mounted position at which the heat absorbing member is disposed on an upper portion of the susceptor to thermally contact the susceptor and a released position at which the heat absorbing member is separated from the upper portion of the susceptor, the one or more heat absorbing members absorbing heat of the susceptor at the mounted position, and an edge ring having a plurality of fixing slots in which the heat absorbing members are selectively inserted and fixed.

Abstract: A substrate processing apparatus includes a vacuum chamber; a turntable rotatably provided in the vacuum chamber, on which a circular substrate is to be mounted, and provided with a circular concave portion at a front surface having a larger diameter than that of the substrate, and a circular substrate mounting portion provided in the concave portion having a diameter smaller than that of the concave portion and the substrate at a position higher than a bottom portion of the concave portion, the center of the substrate mounting portion being off center with respect to the center of the concave portion toward an outer peripheral portion side of the turntable; a process gas supplying unit which supplies a process gas to the substrate; and a vacuum evacuation mechanism which evacuates the vacuum chamber.

Abstract: A coating film forming apparatus includes a substrate holding unit, a ring-shaped member annularly installed along a circumferential direction of the substrate so as to cover an upper side of a peripheral edge portion of the substrate, and a control unit that outputs a control signal so as to perform: positioning the ring-shaped member at a processing position where an air flow flowing above the peripheral edge portion of the substrate is straightened; rotating the substrate at a first revolution number such that a coating liquid supplied to a central portion of the substrate is diffused toward the peripheral edge portion by a centrifugal force; bringing the ring-shaped member to a retreated position where an air flow flowing near a front surface of the substrate is prevented from becoming turbulent; and reducing the revolution number of the substrate to a second revolution number lower than the first revolution number.

Abstract: A method of forming a golf ball comprising at least one layer consisting of at least one of a thermoset or thermoplastic composition comprising the steps of: providing a subassembly having at least one of an innermost surface or an outermost surface; providing at least one polymeric mixture Pc comprising a plurality of particles having a softening, melting and/or reacting temperature Mp; heating a fluid with a heat source that does not contact Pc to a temperature Mph wherein Mp?Mph to form a heated fluid; softening, melting and/or reacting the plurality of particles by mixing each polymeric mixture Pc with at least one heated fluid and forming at least one heated mixture Pcs; and propelling each Pcs onto at least one of the innermost surface or the outermost surface to form a thermoset and/or thermoplastic layer Tmpl about the outermost surface which may be comprised of a heterogeneous composition. The thickness of Tmpl may be from about 3 mils to about 0.10 in.

Abstract: An aligning fixture for box welding that is used to internally support a work-piece has a mounting plate and a plurality of supporting legs. Each of the plurality of supporting legs is removably attached to the mounting plate by a plate connector in order to provide adjustability for welding work-pieces of various sizes. A support structure, being a first leg and a second leg, is pivotally connected to the plate connector and a hinge. The hinge supports a roller mount, a roller, and a pad assembly. The roller mount is vertically positioned, wherein the roller is connected to the roller mount opposite the hinge. The roller allows the supporting leg to slide across the bottom surface within the work-piece. The pad assembly is pivotally attached to the hinge and rests flush against the inner wall of the work-piece when the aligning fixture is deployed.

Abstract: In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. A first recess of a second transfer jig allows an entire region of a second recess of the second transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. The alignment object is transferred from the cavity of said first jig to a cavity of said second jig.

Abstract: An apparatus having a skewer preparation tray with individual cube sections for placing food items and an easy process of securing the food items to a skewer enabling a user to simultaneously safely prepare several skewers for grilling with minimal waste through dropping food-items and eliminating the dripping of marinade. The cube sections are created via coupling a plurality of horizontal-dividers with a plurality of vertical-dividers.